A method of feeding underfill material to fill a space between a semiconductor die and a substrate onto which the semiconductor die has been bonded, the method comprises positioning a stencil over the semiconductor die. The stencil has an elongated slot extending adjacent to an edge of the semiconductor die. Underfill material is printed through the slot such that the underfill material falls through the slot onto the substrate next to the edge of the semiconductor die. Thereafter, the underfill material is heated such that the underfill material flows across the space between the semiconductor die and the substrate from the edge of the semiconductor die to an opposite edge thereof through capillary action.

A reflow apparatus include a carrier supporting a printed circuit board placed on a side thereof by using a vacuum pressure generated therein, and a processing chamber including a heating chamber and a cooling chamber, wherein the carrier includes at least one adsorption hole, formed in one side of the carrier, a vacuum space connected to the adsorption hole, and a vacuum control unit capable of maintaining or removing a vacuum pressure in the vacuum space by selective opening and closing a path connecting the vacuum space to the outside.

The inventive concept relates to an apparatus for manufacturing a semiconductor package and a method of manufacturing a semiconductor package. According to embodiments, the method of manufacturing a semiconductor package may include preparing a substrate including upper conductive pads on an upper surface of the substrate, preparing a first semiconductor chip including first solder balls, wherein a first dielectric layer covering sidewalls of the first solder balls is on a lower surface of the first semiconductor chip, disposing the first semiconductor chip on the substrate such that the first solder balls are on the upper conductive pads, and bonding the first solder balls to the upper conductive pads by applying an alternating current electric field to the first dielectric layer.

An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.

A solder reflow apparatus includes: a reflow chamber configured to receive a heat transfer fluid, wherein the heat transfer fluid transfers heat to a solder for mounting an electronic part on a substrate; a heater configured to heat the heat transfer fluid in the reflow chamber; a stage arranged in the reflow chamber to support the substrate; and a jig disposed on the electronic part and fixing the electronic part.

A method of using a processing oven may include disposing at least one substrate in a chamber of the oven and activating a lamp assembly disposed above them to increase their temperature to a first temperature. A chemical vapor may be admitted into the chamber above the at least one substrate and an inert gas may be admitted into the chamber below the at least one substrate. The temperature of the at least one substrate may then be increased to a second temperature higher than the first temperature and then cooled down.

A solder reflow apparatus may include a reflow chamber, a heater and a stage. The reflow chamber may be configured to receive a heat transfer fluid. The heat transfer fluid may be configured for transferring heat to a solder for mounting an electronic part on a substrate. The heater may be configured to heat the heat transfer fluid in the reflow chamber. The stage may be in the reflow chamber to support the substrate. The stage may be inclined to a bottom surface of the reflow chamber to induce the heat transfer fluid toward a central portion of the substrate. Thus, the vertically ascended heat transfer fluid may be uniformly applied to the central portion and an edge portion of the substrate so that the solders at the central portion and the edge portion of the substrate may be uniformly soldered.

A baking system is provided. A receiving base is operable to receive a processing unit assembly including a processing unit, a thermal solution, and a thermal interface material operable to couple the processing unit and the thermal solution. An upper portion is operable to provide heat to the processing unit assembly to cure the thermal interface material. The upper portion directs heat to the processing unit assembly from above the processing unit assembly. A bottom portion is operable to provide heat to the processing unit assembly to cure the thermal interface material. The bottom portion directs heat to the processing unit assembly from below the processing unit assembly opposite the upper portion.

A method of using a processing oven may include disposing at least one substrate in a chamber of the oven and activating a lamp assembly disposed above them to increase their temperature to a first temperature. A chemical vapor may be admitted into the chamber above the at least one substrate and an inert gas may be admitted into the chamber below the at least one substrate. The temperature of the at least one substrate may then be increased to a second temperature higher than the first temperature and then cooled down.

A vaporizer apparatus includes a liquid inlet; a plurality of plates in a stacked arrangement and configured with openings and surfaces defining a tortuous path for a liquid through the plurality of plates; an atomizer configured to atomize liquid from the liquid inlet and inject a spray of the liquid toward a first plate of the plurality of plates, wherein the plurality of plates is configured to direct a flow of the liquid through the tortuous path from a first end corresponding to the first plate and output a vapor of the liquid at a second end of the tortuous path corresponding to a last plate of the plurality of plates; and at least one heating element configured to heat the plurality of plates to vaporize the liquid along its flow through the tortuous path and generate the vapor.