A bonding apparatus includes a movable light guide, a first capture, a second capture, a detector, an aligner, and a mover. When the movable light guide is positioned between a chip and a board, an image of the chip is made incident from a first incident port and emitted from a first emission port, and an image of a bonding position of the board is made incident from a second incident port and emitted from a second emission port. The first capture images the image of the chip emitted from the first emission port. The second capture images the bonding position emitted from the second emission port. The detector detects a relative positional deviation of the chip and the bonding position. The aligner relatively moves a bonding tool and a stage. The mover advances and retreats the movable light guide.

A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.

Provided is a bonding apparatus including a table (52), a first reaction member (58A) and a second reaction member (58B), which are each provided movably in a Y axis direction with respect to a pedestal (41). The first and second reaction members are each configured to move in a direction opposite to the table in the Y axis direction when the table moves in the Y axis direction. As viewed in an X axis direction, the first and second reaction members are arranged on both sides of the table, respectively, with the table being interposed between the first and second reaction members, so that the centers of gravity of the first and second reaction members are positioned based on the center of gravity of the table. Consequently, the bonding apparatus can suppress an increase in space, and can improve a weight balance on the pedestal.

A die bonding apparatus comprising a stage configured to support a first die, a pickup head configured to pick up a second die, regions of magnetic materials arranged on the first die and the second die, an electromagnet arranged on a surface of the pickup head or the stage; and a controller configured to apply a current to the electromagnet to generate a magnetic field when the first die and the second die are disposed at a predetermined distance from each other in a vertical direction. As a result of the magnetic field generated by the electromagnet, the regions of magnetic material arranged on first die and the second die are aligned with one another in the vertical direction.

A method of bonding a die comprising solder bumps to a substrate comprising bond pads, the method comprising the steps of heating the die from a first temperature to a second temperature, wherein the first temperature is below the melting point of the solder bumps, and the second temperature is above the melting point of the solder bumps; moving the die relative to the substrate to a first height, whereat the solder bumps contact the bond pads; moving the die further away from the substrate to a second height, while maintaining contact between the solder bumps and bond pads; and thereafter cooling the die from the second temperature to a third temperature to allow the solder bumps to solidify so as to bond the die to the substrate.

Provided is a method of correcting an estimated force of a bonding apparatus including measuring a first pressure of a first space in a chamber of a bonding apparatus and a second pressure of a second space in the chamber in a first state. In the first state a pressuring member is at rest within the chamber. The pressuring member is moveable within the chamber. The method includes obtaining a first estimated force. The first estimated force is an estimated force of the pressuring member in the first state, using the measured first and second pressures. The method includes obtaining a first error. The first error is a difference between a first real force and the first estimated force. The first real force is a real force of the pressuring member in the first state. The method includes correcting the first estimated force using the first error.

The present invention includes: a position detection unit (55) detecting positions of semiconductor chips and storing each detected position in a position database (56); a position correction unit (57) outputting a corrected bonding position; and a bonding control unit (58) performing bonding of the semiconductor chips based on the corrected bonding position input from the position correction unit (57). The position correction unit (57) calculates position shift amounts between the semiconductor chips of respective stages and an accumulated position shift amount, and when the accumulated position shift amount is greater than or equal to a predetermined threshold value, corrects the position of the semiconductor chip by the accumulated position shift amount and outputs it as the corrected bonding position, and the bonding control unit (58) performs bonding of the semiconductor chip of the next stage at the corrected bonding position input from the position correction unit.

The method of manufacturing a functional inlay comprises the steps of: a support layer with at least a first and a second side a wire antenna in said support layer processing said support layer with said embedded wire antenna to a connection station in which said support layer is approached on said first side by a holding device holding a chip with a surface comprising connection pads; said support layer is approached on said second side by a connection device; and said antenna wire is connected to said connection pads by means of a reciprocal pressure exerted between said holding device and said connection device.

The method of manufacturing a functional inlay comprises the steps of: a support layer with at least a first and a second side a wire antenna in said support layer processing said support layer with said embedded wire antenna to a connection station in which said support layer is approached on said first side by a holding device holding a chip with a surface comprising connection pads; said support layer is approached on said second side by a connection device; and said antenna wire is connected to said connection pads by means of a reciprocal pressure exerted between said holding device and said connection device.

An apparatus and method for mounting devices on a substrate. Processing is often interrupted during operation because the components are not provided for assembly parallel to the substrate. Inclination control solutions increase the cost, weight and complexity of the bonding head. By tilting the contact surface using existing drives and/or actuators, simplified tilt correction is made possible, providing high throughput and high reliability. The tilt correction mechanism consists of one or more engagement members, one or more adjustment members and one or more tilt position blocks. In some cases, passive elements and mechanisms may be used.