A chip stack having a protection structure for semiconductor device package, which comprises a first chip and a second chip stacked with each other, wherein said first chip has a first surface, said second chip has a second surface, said first surface and said second surface are two surfaces facing to each other, wherein at least one metal pillar is formed on at least one of said first surface and said second surface and connected with the other, at least one protection ring is formed on at least one of said first surface and said second surface and having a first gap with the other, and at least one electrical device is formed on at least one of said first surface and said second surface, wherein said at least one electrical device is located inside at least one of said at least one protection ring.

A film element for driving a display device and a display device using the same are disclosed. The film element includes a film substrate including wirings and pads connected to the wirings, and an IC chip mounted on the film substrate to be connected to the wirings. The pads on the film substrate are grouped into a plurality of areas having different thermal correction amounts. Pads in a second area are closer to the IC chip than pads in a first area. A length of the first area is set to a length obtained by subtracting a first thermal correction amount from a first reference length. A length of the second area is set to a length obtained by subtracting a second thermal correction amount from a second reference length. The second thermal correction amount is smaller than the first thermal correction amount or has a negative value.

A semiconductor chip includes a mounting surface having a plurality of first conductive contacts and at least one second conductive contact. Each of the first contacts is arranged in a regularly spaced apart array such that centroids of immediately adjacent first contacts are separated from one another in a first direction by a first distance. Each of the first contacts have an identical first lateral extent. The second conductive contact is at least partially within an area which has the first lateral extent and is separated from an immediately first contact by the first distance. Either the second conductive contact has a second lateral extent that is less than the first lateral extent; or a centroid of the second conductive contact is separated in the first direction from the centroid of one of the first contacts by a second distance that is different from the first distance.

A display device includes a display substrate including a display area where an image is displayed and a pad area disposed at a periphery of the display area, and a first pad portion disposed in the pad area, the first pad portion including a plurality of first line pad terminals arranged along a first curved line in a first direction.

A method of manufacturing an electronic component module and the electronic component module manufactured by the manufacturing method includes bumps, each including a thicker portion having a relatively large thickness and a thinner portion having a relatively small thickness and formed on one surface of the substrate. When looking at the electronic component in a mounted state in a plan view, the thicker portion is positioned on a side of a corresponding outer terminal closer to a center of the electronic component and the thinner portion is positioned on the opposite side of the corresponding outer terminal. In the plan view, joining portions joining the outer terminals respectively to the bumps are formed such that a height of each joining portion on the opposite side is lower than a height of the joining portion on the side closer to the center of the electronic component.

An electronic device includes a first electronic part that includes a first terminal, a second electronic part disposed to be opposed to the first electronic part, the second electronic part that includes a second terminal including a first end part in contact with the first terminal and a second end part located on an outside of the first terminal, and an adhesive disposed between the first electronic part and the second electronic part, the adhesive maintaining the contact between the first terminal and the first end part by bonding the first electronic part and the second electronic part to each other.

An electronic device includes a substrate, an electronic element mounted on the substrate, bumps that electrically connect the substrate to the electronic element, dummy bumps that are formed on the substrate to surround the electronic element, and a side fill that is formed around the electronic element and is in contact with the dummy bumps.

The joint reliability in flip chip bonding of a semiconductor device is enhanced. Prior to flip chip bonding, flux 9 is applied to the solder bumps 5a for flip chip bonding over a substrate and reflow/cleaning is carried out and then flip chip bonding is carried out. This makes is possible to thin the oxide film over the surfaces of the solder bumps 5a and make the oxide film uniform. As a result, it is possible to suppress the production of local solder protrusions to reduce the production of solder bridges during flip chip bonding and enhance the joint reliability in the flip chip bonding of the semiconductor device.

A bonding method of a first member and a second member includes: forming a first wire bonding bump (12) on a first electrode (14) arranged in the first member; forming a second wire bonding bump (22) on a second electrode 24 arranged in the second member; and flattening a tip section of the second wire bonding bump to form a bump flat surface (221). The tip section (120) of the first wire bonding bump and the bump flat surface (221) are pressure bonded to each other.

A display device includes a display substrate including a display area where an image is displayed and a pad area disposed at a periphery of the display area, and a first pad portion disposed in the pad area, the first pad portion including a plurality of first line pad terminals arranged along a first curved line in a first direction.