Methods and techniques are provided for using a conductive epoxy to create interconnects across a gap between an embedded integrated circuit chip and a dielectric substrate. The chosen epoxy is adhesive and thixotropic so that it sticks well and won't lose its volume after a drying process. Further, a liquid dielectric ink is used as an underfill material to not only cover and protect the interconnects but also act as a dielectric layer. This allows as for additional dielectric layers with corresponding interconnects and vias to form a multilayer structure with additional embedded chips. The disclosed methods and techniques can be implemented using direct print additive manufacturing processes.