A sintering paste includes solvent and nanomicrocrystallite (NMC) particles. Each NMC particle is a single crystallite having at least one dimension in the range of 1 nm to 100 nm and at least one dimension in the range of 0.1 m to 1000 m. The sintering paste may be used in a pressureless sintering process to form a low porosity joint having high bond strength, high electrical and thermal conductivity, and high thermal stability.

Method and device for improved die bonding. In some embodiments, a bonding device includes a heating element configured to heat air. The bonding device also includes an application element having a plurality of holes configured to apply the heated air to a die, the application element is characterized by an arrangement of the plurality of holes that satisfies one or more directionality criteria. The bonding device further includes a controller configured to control the heating element and to set the temperature of the heated air expelled through the plurality of holes of the application element in order to satisfy one or more bonding criteria.

The present invention relates to a copper fine particle dispersion containing copper nanoparticles A, a carboxylic acid B having not less than 6 and not more than 14 carbon atoms, a compound C represented by the formula (1): RO(CH.sub.2CH.sub.2O).sub.nCH.sub.2COOH wherein R is a hydrocarbon group having not less than 6 and not more than 14 carbon atoms, and n represents an average molar number of addition of ethyleneoxy groups, and is a number of not less than 0.5 and not more than 20, and a dispersion medium D, in which the dispersion medium D contains at least one compound selected from the group consisting of a (poly)alkylene glycol, a (poly)alkylene glycol derivative, a terpene alcohol, glycerin and a glycerin derivative, a content of the carboxylic acid B in the dispersion is not less than 0.1% by mass, a content of the compound C in the dispersion is not less than 0.05% by mass, and a total content of the carboxylic acid B and the compound C in the dispersion is not more than 8% by mass, and also relates to a method for producing a bonded body, which includes the steps of allowing the aforementioned copper fine particle dispersion to intervene between a plurality of metal members, and heating the dispersion between the plurality of metal members.

In a semiconductor device according to the present disclosure, one end and the other end of a plurality of insulation covering wires are joined to a connection region in an upper electrode of a DBC substrate over a semiconductor element while an insulation covering portion in a center region has contact with a surface of the semiconductor element. The plurality of insulation covering wires are provided along an X direction in the same manner as the plurality of metal wires. The plurality of insulation covering wires are provided with no loosening, thus have press force of pressing the semiconductor element in a direction of the solder joint portion.

A manufacturing method of an electronic package is provided, which includes: disposing an electronic element and a heat dissipation structure on a carrier structure, wherein the heat dissipation structure is disposed on the electronic element by a heat conductor, and a flux material is sandwiched between the heat conductor and the heat dissipation structure and between the heat conductor and the electronic element; performing a first heating operation at a first temperature to vaporize the flux material; and performing a second heating operation at a second temperature to melt the heat conductor, and forming inter-metallic compound layers between the heat conductor and the heat dissipation structure and between the heat conductor and the electronic element.