A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.

In one example, an electronic device includes a substrate including a substrate first side, a substrate second side, and a conductive structure. An electronic component includes a component first side coupled to the conductive structure at the substrate first side, a component second side, and a component lateral side connecting the component first side to the component second side. A lid structure includes a first lid having a first lid side wall coupled to the substrate and a first lid top coupled to the first lid side wall and an opening over the component second side. The lid structure includes second lid with a second lid top coupled to the first lid top and a lid channel coupled to the opening. A thermal interface material is within the opening and covers at least a portion of the component second side. Other examples and related methods are also disclosed herein.

A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.

A device integration method and integrated device. The method may include the steps of directly bonding a semiconductor device having a substrate to an element; and removing a portion of the substrate to expose a remaining portion of the semiconductor device after bonding. The element may include one of a substrate used for thermal spreading, impedance matching or for RF isolation, an antenna, and a matching network comprised of passive elements. A second thermal spreading substrate may be bonded to the remaining portion of the semiconductor device. Interconnections may be made through the first or second substrates. The method may also include bonding a plurality of semiconductor devices to an element, and the element may have recesses in which the semiconductor devices are disposed. A conductor array having a plurality of contact structures may be formed on an exposed surface of the semiconductor device, vias may be formed through the semiconductor device to device regions, and interconnection may be formed between said device regions and said contact structures.

A transfer apparatus for semiconductor manufacturing, the transfer apparatus including: a carrier configured to move; a substrate disposed on the carrier; a guide jig disposed above an upper surface of the substrate, the guide jig including a plurality of partition walls and a plurality of accommodation guide holes partitioned by the plurality of partition walls; and a preform solder disposed on the upper surface of the substrate, the preform solder including a plurality of bent portions, wherein the plurality of bent portions include a first bent portion formed adjacent to one end of a body; and a second bent portion formed adjacent to the other end of the body.

An electronic structure includes a substrate; an electronic component; and an interconnection film disposed between the substrate and the electronic component, electrically and mechanically connecting the electronic component to the substrate; the interconnection film including a first face, a second face opposite to the first face, an electrically conductive zone extending from the first face to the second face and an electrically insulating polymer material coating the electrically conductive zone, at least one of the first and second faces of the interconnection film being structured so as to form a dry adhesive film, said at least one of the first and second faces having a plurality of patterns, at least part of the patterns being formed by the electrically insulating polymer material.