An exemplary assembly includes a top circuit substrate; a bottom circuit assembly that underlays the top circuit substrate and is attached to the top circuit substrate by an adhesive layer as a stiffener, the adhesive layer, and a plurality of conductive balls. The top circuit substrate includes a plurality of upper vias that extend through the top circuit substrate. The bottom circuit assembly includes a plurality of lower vias that extend through the bottom circuit assembly. The adhesive layer includes internal connections that electrically connect the upper vias to the lower vias. The conductive balls are housed in the lower vias. The bottom circuit assembly has an elastic modulus at least six times the elastic modulus of the top circuit substrate, and has a coefficient of thermal expansion at least two times the coefficient of thermal expansion of the top circuit substrate.

An exemplary assembly includes a top circuit substrate; a bottom circuit assembly that underlays the top circuit substrate and is attached to the top circuit substrate by an adhesive layer as a stiffener, the adhesive layer, and a plurality of conductive balls. The top circuit substrate includes a plurality of upper vias that extend through the top circuit substrate. The bottom circuit assembly includes a plurality of lower vias that extend through the bottom circuit assembly. The adhesive layer includes internal connections that electrically connect the upper vias to the lower vias. The conductive balls are housed in the lower vias. The bottom circuit assembly has an elastic modulus at least six times the elastic modulus of the top circuit substrate, and has a coefficient of thermal expansion at least two times the coefficient of thermal expansion of the top circuit substrate.

A foil package includes a first foil substrate with a first and a second main surface, a second foil substrate with a first and a second main surface, wherein its first main surface is arranged facing the second main surface of the first foil substrate. The foil package includes at least one electronic device arranged between the first foil substrate and the second foil substrate and a first electrically conductive layer structure structured into a plurality of first partial areas arranged on the second main surface of the first foil substrate. The plurality of partial areas incompletely cover the second main surface of the first foil substrate. The at least one electronic device includes a terminal side and a side opposite to the terminal side.

A thermal interface material and systems and methods for forming a thermal interface material include depositing a layer of a composite material, including at least a first material and a second material, the first material including a carrier fluid and the second material including a filler particle suspended within the first material. A particle manipulator is positioned over the layer of the composite material, the particle manipulator including at least one emitter to apply a particle manipulating field to bias a movement of the filler particles. The second material is redistributed by applying the particle manipulating field to interact with the second material causing the second material to migrate from a surrounding region in the composite material into a high concentration region in the composite material to form a customized thermal interface such that the high concentration region is configured and positioned corresponding to a hotspot.

A semiconductor device includes a silicon carbide layer, a metal carbide layer arranged over the silicon carbide layer, and a solder layer arranged over and in contact with the metal carbide layer.

A stacked semiconductor device is provided, including a first semiconductor structure, a second semiconductor structure and a bonding structure disposed between the first and second semiconductor structures. The first semiconductor structure and the second semiconductor structure include first conductive pillars and second conductive pillars, respectively. The first semiconductor structure is stacked above the second semiconductor structure. The bonding structure contacts the first conductive pillars and the second conductive pillars, wherein the bonding structure comprises conductive paths for electrically connecting the first conductive pillars and the second conductive pillars.

A Micro LED display panel, a method for fabricating the Micro LED display panel and a display device are provided. When the LED chip array is transferred, it may only be required to embed the LED chip array into the adhesive film layer. The LED chip array is bonded to the array substrate through the adhesive film layer. Then, unnecessary portions of the adhesive film layer and unnecessary LED chips are removed. It is not necessary to attach LED chips in the LED chip array one by one to the substrate by soldering, in which case the process of fabricating the Micro LED display panel is simplified, the difficulty in fabricating the Micro LED display panel is reduced, the influence of the high temperature generated by the soldering process on the LED chips is avoided, and damage to the LED chips during the transfer process is avoided.

MicroLED devices can be transferred in large numbers to form microLED displays using processes such as pick-and-place, thermal adhesion transfer, or fluidic transfer. A blanket solder layer can be applied to connect the bond pads of the microLED devices to the terminal pads of a support substrate. After heating, the solder layer can connect the bond pads with the terminal pads in vicinity of each other. The heated solder layer can correct misalignments of the microLED devices due to the transfer process.

An electronic structure is provided with a redistribution structure and the following elements. A first supporting structure has a first opening and is disposed on a first surface of the redistribution structure. A second supporting structure has a second opening and is disposed on a second surface of the redistribution structure opposite to the first surface. A first bonding protruding portions are disposed on the first surface of the redistribution structure and located in the first opening. A second bonding protruding portions are disposed on the second surface of the redistribution structure and located in the second opening. A first encapsulated material is filled between the first opening and the first bonding protruding portions. A second encapsulated material is filled between the second opening and the second bonding protruding portions. An electronic structure array is also provided.

An electronic structure is provided with a redistribution structure and the following elements. A first supporting structure has a first opening and is disposed on a first surface of the redistribution structure. A second supporting structure has a second opening and is disposed on a second surface of the redistribution structure opposite to the first surface. A first bonding protruding portions are disposed on the first surface of the redistribution structure and located in the first opening. A second bonding protruding portions are disposed on the second surface of the redistribution structure and located in the second opening. A first encapsulated material is filled between the first opening and the first bonding protruding portions. A second encapsulated material is filled between the second opening and the second bonding protruding portions. An electronic structure array is also provided.