A method of manufacturing the semiconductor device includes: preparing a lead member including a bonding part and a beam part continuously connected to the bonding part; preparing a pressing jig provided with an opening; placing the bonding part, with sintering material interposed, on a semiconductor chip provided on a conductive layer of an insulated circuit substrate, the insulated circuit substrate including an insulating plate and the conductive layer provided on the insulating plate; placing the pressing jig on the bonding part, the sintering material, the semiconductor chip, and the conductive layer so that the opening overlaps with the beam part; and applying pressure and heat to the bonding part, the sintering material, the semiconductor chip, and the conductive layer by the pressing jig.