An electronic device includes a package structure, conductive leads, first and second semiconductor dies, and a metal clip, The package structure has opposite longitudinal ends, opposite lateral sides, a middle portion midway between the longitudinal ends, a first portion that extends between the middle portion and one longitudinal end, and a second portion that extends between the middle portion and the other longitudinal end. The metal clip extends in the package structure from the first portion to the second portion through the middle portion and electrically couples the first electronic component of the first semiconductor die to the second electronic component of the second semiconductor die.