Stacked semiconductor die assemblies with die support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a support member attached to the package substrate. The support member can be separated from the first semiconductor die, and a second semiconductor die can have one region coupled to the support member and another region coupled to the first semiconductor die.

Provided are an optical fingerprint apparatus and an electronic device, applied to an electronic device having a display screen, where the optical fingerprint apparatus is configured to be disposed under the display screen, and the optical fingerprint apparatus includes: an optical fingerprint chip, where the optical fingerprint chip is configured to receive a fingerprint light signal returned from a finger above the display screen, and the fingerprint light signal is used to obtain a fingerprint image of the finger; and a light blocking layer formed on an upper surface of an edge region of the optical fingerprint chip, where the light blocking layer partially blocks the edge region of the optical fingerprint chip and does not block a sensing region of the optical fingerprint chip, and the light blocking layer is configured to block interference light entering the sensing region from the edge region of the optical fingerprint chip.

A manufacturing method of a semiconductor device according to the technology disclosed in the present specification includes: providing at least one semiconductor element; connecting, to the semiconductor element, a plurality of first terminals and at least one second terminal that is a control terminal to which a voltage lower than that of the first terminal is applied; and forming a first bent part in the first terminal, in which the first bent part does not protrude on the surfaces, facing each other, of the plurality of first terminals that are adjacent to each other.

A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

A semiconductor device includes: a chip unit, a conductive wire unit, and a cover unit. The chip unit includes a substrate formed with an interconnect structure, and a semiconductor chip disposed on the substrate. The conductive wire unit includes a conductive wire that interconnects the semiconductor chip and the interconnect structure. The cover unit includes a cover member that covers the conductive wire. The cover member includes an insulating layer formed by atomic layer deposition. A method for making the semiconductor device is also disclosed.

A semiconductor package includes a package substrate having a first insulating layer, a wiring layer disposed on the first insulating layer, and a second insulating layer disposed on the first insulating layer and covering at least a portion of the wiring layer, a pair of support members disposed to face each other on the second insulating layer of the package substrate, and a pair of semiconductor chips disposed between the pair of support members and electrically connected to the wiring layer, wherein the second insulating layer has an opening surrounding at least a portion of each of the pair of semiconductor chips.

A semiconductor package includes a package substrate which includes a substrate base and a plurality of wiring patterns, a lower semiconductor chip, and an upper semiconductor chip. The substrate base includes a chip-accommodating cavity and the plurality of wiring patterns include a plurality of bottom wiring patterns on a bottom surface of the substrate base and a plurality of top wiring patterns on a top surface of the substrate base. The lower semiconductor chip is disposed in the chip-accommodating cavity and is connected to the plurality of bottom wiring patterns through a plurality of lower bonding wires. The upper semiconductor chip includes a first portion which is attached to the lower semiconductor chip and a second portion which overhangs the lower semiconductor chip.

A semiconductor device according to the present embodiment includes a wiring substrate having a wiring layer. A first semiconductor chip is provided above the wiring substrate. A metallic wire connects the first semiconductor chip and the wiring substrate to each other. A silicon chip is provided above the first semiconductor chip and covers above the metallic wire. A resin layer seals the first semiconductor chip and the silicon chip, and the metallic wire. The silicon chip is insulated from the wiring substrate.

A semiconductor package includes a substrate that includes a bonding pad, a first semiconductor chip disposed on the substrate, a second semiconductor chip disposed on a top surface of the first semiconductor chip that is opposite to the substrate, a chip pad disposed on the top surface of the first semiconductor chip, and a bonding wire that connects the chip pad to the bonding pad. The bonding wire includes a first upward protrusion and a second upward protrusion that are convexly curved in a direction away from the substrate. The second semiconductor chip has a first side surface between the first upward protrusion and the second upward protrusion.

We disclose an optoelectronic module comprising an optoelectronic device operable to emit or detect a wavelength of radiation, an optical element arranged on the optoelectronic device, the optical element being transparent to the wavelength of radiation capable of being emitted or detected by the optoelectronic device, and a wall configured to laterally enclose the optoelectronic device and the optical element, the wall being opaque to the wavelength of radiation capable of being emitted or detected by the optoelectronic device.