A method is provided for the selective harvest of microLED devices from a carrier substrate. Defect regions are predetermined that include a plurality of adjacent defective microLED devices on a carrier substrate. A solvent-resistant binding material is formed overlying the predetermined defect regions and exposed adhesive is dissolved with an adhesive dissolving solvent. Non-defective microLED devices located outside the predetermined defect regions are separated from the carrier substrate while adhesive attachment is maintained between the microLED devices inside the predetermined defect regions and the carrier substrate. Methods are also provided for the dispersal of microLED devices on an emissive display panel by initially optically measuring a suspension of microLEDs to determine suspension homogeneity and calculate the number of microLEDs per unit volume. If the number of harvested microLED devices in the suspension is known, a calculation can be made of the number of microLED devices per unit of suspension volume.

Microperturbation fluidic assembly systems and methods are provided for the fabrication of emissive panels. The method provides an emissive substrate with a top surface patterned to form an array of wells. A liquid suspension is formed over the emissive substrate top surface, comprising a first liquid and emissive elements. Using an array of micropores, a perturbation medium, which optionally includes emissive elements, is injected into the liquid suspension. The perturbation medium may be the first liquid, a second liquid, or a gas. A laminar flow is created in the liquid suspension along the top surface of the emissive substrate in response to the perturbation medium, and emissive elements are captured in the wells. The ejection of the perturbation medium can also be used to control the thickness of the liquid suspension overlying the top surface of the emissive substrate.

Discussed is an assembly substrate used for a display device manufacturing method of mounting semiconductor light-emitting diodes on the assembly substrate at preset positions using electric field and magnetic field. The assembly substrate includes a base portion, a plurality of assembly electrodes on the base portion, a dielectric layer on the base portion to cover the assembly electrodes, a barrier wall on the base portion, and a metal shielding layer on the base portion, wherein the metal shielding layer overlaps the barrier wall.

A display device and a manufacturing method thereof are provided. The display device comprises: a substrate in which a first region and a second region that is a region other than the first area, are defined; a first electrode and a second electrode that are at least partially spaced apart from each other in the first area on the substrate; a coating layer disposed on the substrate so as to cover at least a portion of the first electrode and the second electrode; and at least one light-emitting element disposed between the first electrode and the second electrode in the first region, wherein the coating layer comprises: an opening exposing at least portion of the first electrode and the second electrode in the first region, wherein the coating layer comprises: an opening exposing at least portion of the first electrode and the second electrode; and a first coating layer disposed in a region other than the opening and including a material having a first polarity.

A back plate for rapid and fluid-assisted assembly of micro light emitting elements thereon includes a substrate with a driving circuit, and blocking walls made to protrude from a top surface of the substrate. The top surface of the substrate defines grooves for accommodating and powering micro light emitting elements. Each of the blocking walls semi-surrounds one groove and defines a notch. The notches defined by each blocking wall all face a single direction and the blocking walls and notches impede and gather micro light emitting elements which are made to flow in a fluid suspension and render them much more likely to tumble into the groove.

The present disclosure provides a display device, including a substrate, a plurality of semiconductor light emitting devices arranged on the substrate, a first wiring electrode and a second wiring electrode extended from the semiconductor light emitting devices, respectively, to supply an electric signal to the semiconductor light emitting devices, a plurality of pair electrodes arranged on the substrate to generate an electric field when an electric current is supplied, and provided with first and second pair electrodes formed on an opposite side to the first and second wiring electrodes with respect to the semiconductor light emitting devices, and a dielectric layer formed to cover the pair electrodes, wherein the plurality of pair electrodes are arranged in parallel to each other along a direction.

A display device includes a first electrode disposed on a substrate, a second electrode disposed on the substrate and spaced apart from the first electrode, at least one light-emitting element extending in a direction, disposed between the first electrode and the second electrode, and electrically connected to the first electrode and the second electrode, and an insulating pattern layer disposed on the first electrode and the second electrode, the insulating pattern layer including a fixer disposed on at least part of the at least one light-emitting element, and a barrier surrounding the at least one light-emitting element.

A display device comprises a plurality of first banks disposed on a substrate to extend in a first direction and spaced apart from one another, a plurality of first patterns disposed between the plurality of first banks and spaced apart from one another in the first direction, a first electrode and a second electrode extending in the first direction and disposed on different first banks of the plurality of first banks and spaced apart from each other, a first insulating layer overlapping the plurality of first patterns, disposed on the first substrate, and to partially overlapping the first and second electrodes, and a plurality of light-emitting elements disposed on the first insulating layer so that first and second ends of each of the plurality of light-emitting elements are disposed on the first and second electrodes, respectively.

An apparatus for manufacturing a light emitting display device includes a substrate transfer stage including a plurality of support plates arranged at an interval in a first direction, each of the plurality of support plates extending in a second direction; and at least one electric-field application module disposed on at least one side of the substrate transfer stage. The at least one electric-field application module includes a probe head including at least one probe pin; and a driver connected to the probe head to move the probe head at least up and down.

A light emitting device includes: a substrate; a first electrode and a second electrode on the substrate and spaced apart from each other; a light emitting diode between the first electrode and the second electrode and connected to the first and second electrodes; a first contact on the first electrode; and a second contact on the second electrode. The first contact contacts the first electrode and a first portion of the light emitting diode, and the second contact contacts the second electrode and a second portion of the light emitting diode.