According to the present disclosure, a substrate for manufacturing a display device has a structure in which a semiconductor light-emitting device package composed of a plurality of electrodes and semiconductor light-emitting devices can be uniformly aligned. As a result, according to the present disclosure, a semiconductor light-emitting device package that has been transferred by a pick-and-place method in the related art may be allowed to be transferred through self-assembly, thereby having an effect of improving process efficiency (improving process speed and reducing time).

Discussed is an assembly board for use in a method for manufacturing a display device which allows semiconductor light emitting diodes to be seated at preset positions on the assembly board using an electric field and a magnetic field, the assembly board including a base portion; a plurality of assembly electrodes extending in one direction and disposed on the base portion; a dielectric layer stacked on the base portion to cover the plurality of assembly electrodes; and barrier ribs having a plurality of grooves for guiding the semiconductor light emitting diodes to the preset positions and formed on the base portion, wherein each of the plurality of grooves is arranged to overlap only one assembly electrode of the plurality of assembly electrodes such that an electric field is formed between the plurality of grooves adjacent to each other.

The present invention relates to a display device manufacturing method and, particularly, to a chip tray for supplying a micro-LED. The present invention provides a chip tray for carrying semiconductor light emitting diodes in a fluid received in an assembly chamber. The chip tray includes a tray unit for receiving a plurality of semiconductor light emitting diodes; a chip alignment unit disposed on one side of the tray unit and having a plurality of magnets; and a transfer unit configured to move the tray unit and the chip alignment unit, wherein the transfer unit can vertically move one of the tray unit and the chip alignment unit with respect to the other one thereof.

Discussed is a display device and a method for manufacturing the display device, and more particularly, to a display device using a semiconductor light emitting element having a size of several μm to several tens of μm, and a method for manufacturing the display device. The display device can include a board including a wiring electrode; and a plurality of semiconductor light emitting diodes electrically connected to the wiring electrode. Each of the plurality of semiconductor light emitting diodes an include a first conductivity type semiconductor layer, an active layer formed on the first conductivity type semiconductor layer, and a second conductivity type semiconductor layer formed on the active layer. The first conductivity type semiconductor layer can include a plurality of recessed portions.

A display device may include a light emitting element including a first end having a first surface, and a second end having a second surface parallel to the first surface, an organic pattern that overlaps the light emitting element and exposes the first and second surfaces, a first electrode disposed on a substrate and electrically contacting the first end, and a second electrode disposed on the substrate and spaced apart from the first electrode, and electrically contacting the second end. A surface area of the first surface may be less than that of the second surface. A top surface of the organic pattern may be a curved surface.

A display device may include a conductive pattern disposed on a substrate. A passivation layer may be disposed on the conductive pattern. A first shielding electrode and a second shielding electrode that may be disposed on the passivation layer may be spaced apart from each other. A first electrode may be disposed on the first shielding electrode. A second electrode may be disposed on the second shielding electrode. A light emitting element may be electrically connected between the first electrode and the second electrode. A first distance between the first shielding electrode and the second shielding electrode may be less than a second distance between the first electrode and the second electrode.

Discussed is an assembly chamber containing a fluid. The assembly chamber includes a bottom portion, a side wall portion formed at a predetermined height on the bottom portion and disposed to surround the bottom portion, and a partition wall part formed on the bottom portion and extending from one inner surface of a plurality of inner surfaces provided in the side wall portion to another inner surface facing the one inner surface. The vertical height of at least a portion of the partition wall part is variable with respect to the bottom portion.

A method of manufacturing display device is disclosed. A substrate includes a basal layer and metal contacts on the top surface. An insulation layer is disposed on the top surface and includes a first mounting surface and a bottom surface. Multiple grooves are formed on the insulation layer and each extends from the first mounting surface to the bottom surface. The grooves respectively correspond to the metal contacts and expose respective metal contacts. An electromagnetic force is provided with a direction from the basal layer toward the insulation layer. A droplet containing multiple micro components is provided on the first mounting surface. A configuration of an electrode of the micro component corresponds to a configuration of one of the grooves. The electrode is attracted to the corresponding groove by the electromagnetic force so as to electrically contact the metal contact.

An overlapping assembly substrate structure for semiconductor light emitting devices, includes a first assembly substrate structure and a second assembly substrate structure disposed spaced apart from each other. The first assembly substrate structure can include a first electrode and a second electrode spaced apart by a first distance and a first partition wall having a circular first assembly hole to accommodate a semiconductor light emitting device having a circular shape. Further, the second assembly substrate structure can include a third electrode and a fourth electrode spaced apart by a second distance greater than the first distance and a second partition wall having an elliptical second assembly hole to accommodate a semiconductor light emitting device having an elliptical shape.

The present invention relates to a method of manufacturing a display device, and more particularly, to a chip dispenser for supplying a micro-LED. The present invention provides a chip dispenser including a body part for accommodating the fluid and the semiconductor light emitting device, and discharging the accommodated fluid and the semiconductor light emitting device, a pressure controller for varying the pressure inside the body; and a stirring part disposed in at least one of the inside and outside of the body, agitating the fluid accommodated in the body and the pressure controller increases the internal pressure of the body part so that the fluid and the semiconductor light emitting device are discharged to the outside in a state in which the agitating part stirs the fluid.