Disclosed herein are techniques for transferring particles in a pattern. In one implementation, a particle-transferring system includes a first substrate comprising a first surface configured to support a plurality of particles in a non-uniform pattern, and a particle transfer unit configured to remove the plurality of particles from the first surface in response to the plurality of particles being within a first gap. The system also includes a second substrate configured to remove the plurality of particles from the particle transfer unit and secure the plurality of particles to the second surface in response to the plurality of particles being within a second gap. The particle transfer unit is configured to transfer the plurality of particles and maintain the non-uniform pattern regardless of the positions of the plurality of particles, which are not predefined to fit features of the particle transfer unit.

An electronic device is provided, including a substrate and a plurality of electronic units disposed on the substrate. The substrate includes a first edge extending along a first direction and a second edge extending along a second direction. The electronic units include first, second, and third electronic units arranged adjacently along the first direction. The first electronic unit is closer to the second edge than the third electronic unit. A pitch between the second and third electronic units is greater than a pitch between the first and second electronic units. The electronic units include fourth, fifth and sixth electronic units arranged adjacently along the second direction. The fourth electronic unit is closer to the first edge than the sixth electronic unit. A pitch between the fourth and fifth electronic units is greater than a pitch between the fifth and sixth electronic units.