The disclosure provides a printed circuit board structure. The printed circuit board structure includes a printed circuit board, a semiconductor chip, a first pad, a second pad, a conductive wire, and a third pad. The semiconductor chip is disposed on the printed circuit board. The first pad is disposed on the semiconductor chip. The second pad is disposed on the printed circuit board. The conductive wire electrically connects the first pad and the second pad. The third pad is disposed between the first pad and the second pad. The conductive wire has a portion located on the third pad.

A semiconductor device having a base circuit board, a case surrounding the base circuit board to demarcate, in a plan view, an opening area in which the base circuit board is disposed, and a sealing member that seals the base circuit board disposed in the case. The base circuit board includes a metal base substrate, a resin layer formed on the metal base substrate, and a circuit pattern formed on the resin layer. The case has an inner wall surface that faces an outer peripheral side surface of the base circuit board, and that includes a first inner wall portion which is in surface contact with an outer peripheral side surface of the metal base substrate, and a second inner wall portion that is separate from the outer peripheral side surface of the base circuit board, to thereby have a first gap therebetween filled with the sealing member.

A semiconductor package is disclosed. The disclosed semiconductor package includes a substrate having bonding pads at an upper surface thereof, a lower semiconductor chip, at least one upper semiconductor chip disposed on the lower semiconductor chip, and a dam structure having a closed loop shape surrounding the lower semiconductor chip. The dam structure includes narrow and wide dams disposed between the lower semiconductor chip and the bonding pads. The wide dam has a greater inner width than the narrow dam. The semiconductor packages further includes an underfill disposed inside the dam structure and being filled between the substrate and the lower semiconductor chip.

Methods of forming a semiconductor package. Implementations include providing a leadframe, coupling a semiconductor die or an electronic component to the leadframe, and encapsulating at least a portion of the semiconductor die or the electronic component using a mold compound leaving two or more leads of the leadframe exposed. The method may also include coating the two or more leads of the leadframe with an electrically conductive layer. The method may include fully electrically and physically singulating one or more tie bars between two or more leads of the leadframe, a lead of the two or more leads and a leadframe flag, or any combination thereof. The method may also include singulating the leadframe to form one or more semiconductor packages.

The present invention provides a semiconductor device including an insulating layer, a conductive layer bonded to one main surface of the insulating layer, a semiconductor element arranged such that the upper surface of the semiconductor element faces a direction same as the one main surface of the insulating layer, an upper electrode provided on the upper surface of the semiconductor element, a wiring member that has one end electrically bonded to the upper electrode of the semiconductor element and has another end electrically bonded to the conductive layer, and has a hollow portion, a first sealing material, and a second sealing material, in which the first sealing material seals at least part of the semiconductor element so as to be in contact with the semiconductor element, and the second sealing material seals the wiring member so as to be in contact with the wiring member.

Memory devices are disclosed. A memory device may include a bonding pad region for coupling command-and-address (CA) input signals and a memory cell region for storing information in memory cells. The memory device may also include a centralized CA interface region including input circuits coupled to the CA input signals. At least two of the input circuits are configured in pairs. Each pair includes a swap circuit configured to select one of a first CA output and a second CA output for a first internal CA signal and select the other of the first CA output and the second CA output for a second internal CA signal responsive to a control signal. Memory systems and systems are also disclosed.

A semiconductor package includes a pad and leads having a planar profile shaped from a planar base metal, a semiconductor die attached to the pad, a wire bond extending from the semiconductor die to a respective lead, and mold compound covering the semiconductor die, the wire bond, and a first portion of the respective lead, wherein a second portion of the respective lead extends beyond the mold compound. A shape of the respective lead within the planar profile includes a notch indented relative to a first elongated side of the shape of the respective lead and a protrusion protruding outwardly relative to a second elongated side of the shape of the respective lead. The notch and the protrusion are each partially covered by the mold compound and partially outside the mold compound.

A flat no-leads package, the flat no-leads package includes a leadframe for electrically connecting an integrated circuit (IC) chip which in a mounted configuration is arranged in a center portion of the flat no-leads package, The leadframe has at least one RF lead pin; and an isolating encapsulation which is at least partially encapsulating the leadframe such that contact surfaces of the leadframe are electrically contactable at least from a bottom side of the flat no-leads package; wherein at least one of the RF lead pin has a first and second contact surfaces. A cross-section of the RF lead pin increases from the first contact surface to the second contact surface both in a horizontal direction and in a direction vertical thereto. Further, a printed circuit board having a flat no-leads package and a measurement device having a flat no-leads package are provided.

Systems, methods, and devices for 3D packaging. In some embodiments, a semiconductor package includes a first die and a second die. The first die includes a first bonding pad on a top of the first die and near a first edge of the first die. The second die includes a second bonding pad on a top of the second die and near a second edge of the second die. A pillar is located on the second bonding pad. The first die is mounted on top of the second die such that the first edge is parallel to the second edge and offset from the second edge such that the pillar is exposed. A wire is bonded to a bonding surface of the pillar and bonded to a bonding surface of the first bonding pad.

The present invention provides a semiconductor device including an insulating layer, a conductive layer bonded to one main surface of the insulating layer, a semiconductor element arranged such that the upper surface of the semiconductor element faces a direction same as the one main surface of the insulating layer, an upper electrode provided on the upper surface of the semiconductor element, a wiring member that has one end electrically bonded to the upper electrode of the semiconductor element and has another end electrically bonded to the conductive layer, and has a hollow portion, a first sealing material, and a second sealing material, in which the first sealing material seals at least part of the semiconductor element so as to be in contact with the semiconductor element, and the second sealing material seals the wiring member so as to be in contact with the wiring member.