A flat plate assembly is provided from at least a pair of plates with at least one surface of one plate have one or more relief channels provided therein around epoxy bonded signal channels. The relief channels are provided having a size and shape selected to control the flow of a liquid bonding adhesive. Adhesive location can thus be controlled through geometry of the relief channels rather than through process controls. Thus, this approach reduces dependence on adhesive process control, reduces wicking of adhesive into signal channels and reduces the number of voids in a bond line of a bonded flat plate assembly.

Conventional coaxial wiring devices present a problem in that the management of the manufacturing process therefor is difficult. A coaxial wiring device according to the present invention includes a first member, a second member, and a conductor plate. The first member (10) and the second member (30) include, when a line that connects a first port and a second port is denoted by a reference line, a first groove (11) that has a central point on the reference line and extends in a direction that intersects with the reference line; a second groove (12) that connects one end (FN1) of the first groove (11) and the first port; a third groove (13) that connects the other end (FN2) of the first groove (11) and the first port and has a shape that is line symmetrical to the second groove (12) with respect to the reference line; a fourth groove (14) that connects one end (FN1) of the first groove (11) and the second port; and a fifth groove (15) that connects the other end (FN2) of the first groove (11) and the second port and has a shape that is line symmetrical to the fourth groove (14) with respect to the reference line.

The disclosure discloses a low-loss transmission line structure, which belongs to the field of radio frequency transmission lines and includes at least two metal layers stacked in a vertical manner. A dielectric layer is filled between the metal layers. The metal layers include a signal transmission strip in a middle portion. Ground strips are provided on both sides of the signal transmission strip. Through holes are evenly distributed on the dielectric layer, and the signal transmission strips on each of the metal layers are connected through the through holes to form a signal transmission line. The ground strips on each metal layer are connected through the through holes.

A phase shifter includes a printed circuit board and a trace located on the printed circuit board that is configured to transmit signals. The printed circuit board includes a first part covered by the trace and a second part not covered by the trace, where the second part includes at least one hollowed out area near the trace.

A transmission line is provided and includes a center conductor suspended above a ground plane and comprising a line of printed, self-supporting metallic material, ground walls disposed on either side of the center conductor and comprising stacked lines of printed metallic material and a lid suspended above the center conductor between the ground walls and comprising arrayed lines of the printed, self-supporting metallic material.

A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

A substrate-based circuit (31) provides a carrier substrate (2), wherein a bond layer (5) is embodied on at least one part of the carrier substrate (2), and wherein a contact layer (6) which forms at least one conductor line (7) and/or at least one antenna element (8) is embodied on at least one first part (5.sub.1) of the bond layer (5). The carrier substrate (2) provides at least one fastening element (20), which is deposited at the outer region of the carrier substrate (2) and projects beyond the outer region of the carrier substrate (2).

An antenna device includes a center substrate including a dielectric substrate and a center conductor on the dielectric substrate, and two ground plates sandwiching via an air layer the center substrate therebetween to form a feeder line. A hole is formed in the dielectric substrate on at least one side of the center conductor along a longitudinal direction of the center conductor.

An automated double-decker slide screw impedance tuner uses two tuning probes, independently movable inside two stacked circular slablines, which lie flat on the bench table. The eccentrically self-rotating disc probes are mounted at the end of rotating radial arm-carriages, the total mechanism operating in a planetary configuration. The radial arms are mounted one above and one below the whole structure. The rotation of the arms control the phase of Gamma and the self-rotation of the disc probes controls the amplitude. The length (footprint) of the tuner, compared with traditional linear tuners, is reduced by a factor of 5 to 9, depending of the minimum frequency of operation.

A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.