A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

The present disclosure discloses a socket connector including an insulating base and a number of socket terminals. The insulating base includes an outer plastic frame defining a receiving channel and an inner plastic block received in the receiving channel. The inner plastic block includes two sidewalls opposite to each other in a left-and-right direction. The socket terminals are arranged in two rows by positioning symmetrically and respectively on the two sidewalls of the inner plastic block. The socket terminals of each row are arranged in an upper-and-lower direction and spaced away from each other in the upper-and-lower direction. Each socket terminal extends along a front-and-back direction perpendicular to both the left-and-right direction and the upper-and-lower direction. A connector assembly including the socket connector and the mated plug connector is also disclosed in the present disclosure.

A socket includes a housing with a bottom plate portion and a frame body portion standing at edges of the bottom plate portion and extending along the edges. The frame body portion serves as a locator in an in-plane direction of the bottom plate portion in mounting an electronic component. The bottom plate portion and the frame body portion are integrally molded into the housing. The socket includes a plurality of contacts supported by the bottom plate portion. The socket includes a spring member including a supported portion supported by a first side of the frame body portion and a spring portion that elastically deforms by being pushed by the electronic component, pressing the electronic component against a second side opposite to the first side.

A board-edge plug connector establishes an electrical connection between at least one electrical conductor and at least one printed circuit board. The board-edge plug connector has a housing which accommodates at least one contact element and has at least one cavity which receives both the conductor and also the printed circuit board at least partially in the housing. The contact element both encloses and makes contact with the printed circuit board in a spring-elastic manner and also clamps the conductor against the housing and makes contact with it in a spring-elastic manner.

An electrical connector includes an insulating body with multiple accommodating slots, and multiple terminals accommodated in the accommodating slots. Each terminal has an elastic arm, a floating contact portion and a conducting portion. The elastic arm and the floating contact portion are provided at an interval. One end of the elastic arm is connected with the floating contact portion through an insulating block. When each terminal is mated with a first electronic component and a second electronic component, the conducting portion is electrically connected to the first electronic component, the floating contact portion is electrically connected to the second electronic component, the elastic arm provides an elastic force such that the floating contact portion moves downward, and the floating contact portion and the conducting portion are directly electrically connected.

An electrical connector includes: a housing defining plural passageways arranged in a matrix pattern; and plural contacts in the corresponding passageways, respectively, each of the contacts including a main vertical plate having a retaining flange proximate to a middle side of the main vertical plate and retained in the passageway, an inverted V-shaped plate and a first abutting plate extending from an upper end of the main vertical plate in order, and an V-shaped plate and a second abutting plate extending from a lower end of the main vertical plate in order, each of the inverted V-shaped plate and the V-shaped plate defining a peak contacting portion, wherein the first and the second abutting plates are separated from an inner side of the passageway with a gap even upon urging the inverted V-shaped plate and the V-shaped plate to partly move into the passageway.

A semiconductor apparatus includes a semiconductor device configured to include a first pad, and a socket provided over a first pad side of the semiconductor device, and configured to include, a base configured to face the semiconductor device, a first terminal provided over a semiconductor device side of the base, configured to include flexibility against a load in a direction from the semiconductor device toward the base, and coupled to the first pad, a first tubular barrier provided over the semiconductor device side and configured to surround the first terminal, and a first elastic body provided over the semiconductor device side, and configured to support the first tubular barrier and energize the first tubular barrier in a direction from the base toward the semiconductor device.

An interposer includes a housing having a plurality of through-holes penetrating a first surface and a second surface and a signal contact pair composed of a pair of signal contacts. Each of the signal contacts includes a base portion press-fitted in one of the through-holes, a first contact beam extending from the base portion beyond the first surface, and a second contact beam extending from the base portion beyond the second surface. The pair of signal contacts are positioned adjacently to each other widthwise and are each asymmetrical with respect to a width direction. The signal contact pair has a plane-symmetrical shape with respect to the width direction.

An electronic assembly is provided and includes a host circuit board having an upper surface and board contacts on the upper surface. The upper surface has a mounting area. The electronic assembly includes a socket connector mounted to the host circuit board at the mounting area. The socket connector includes a socket housing holding a plurality of socket contacts. Each socket contact has an upper contact portion and a lower contact portion. The lower contact portion is electrically connected to the corresponding board contact of the host circuit board. The socket contact is compressible between the upper contact portion and the lower contact portion. The socket housing includes coolant channels configured to receive coolant. The electronic assembly includes an electronic package coupled to the socket connector. The electronic package has a lower surface and package contacts on the lower surface. The package contacts are electrically connected to the upper contact portions of the socket contacts.

An electrical terminal includes a base, a first elastic arm and a second elastic arm formed side by side by extending upwardly from an upper end of the base, and a protruding portion. The first elastic arm has a mating portion, and the second elastic arm has a contact portion. The protruding portion protrudes and extends from a first side of the first elastic arm, and the first side of the first elastic arm is adjacent to the second elastic arm. A lower surface of the protruding portion has a contact surface overlapping with the contact portion in a vertical direction, such that the contact portion upwardly abuts the contact surface. When the chip module presses downwardly on the electrical terminal, the contact portion can move on the contact surface, such that the chip module does not need to press downwardly on the contact portion with a relatively large pressure.