A disclosed surface-emitting laser module includes a surface-emitting laser formed on a substrate to emit light perpendicular to its surface, a package including a recess portion in which the substrate having the surface-emitting laser is arranged, and a transparent substrate arranged to cover the recess portion of the package and the substrate having the surface-emitting laser such that the transparent substrate and the package are connected on a light emitting side of the surface-emitting laser. In the surface-emitting laser module, a high reflectance region and a low reflectance region are formed within a region enclosed by an electrode on an upper part of a mesa of the surface-emitting laser, and the transparent substrate is slanted to the surface of the substrate having the surface-emitting laser in a polarization direction of the light emitted from the surface-emitting laser determined by the high reflectance region and the low reflectance region.

A structure for cooling a semiconductor element includes an element body and a lead terminal extending from one surface of the element body in a direction intersecting the one surface. The semiconductor element cooling structure includes a heat sink. The heat sink includes a contact surface that is in contact with the one surface of the element body, a through-hole which is formed in the contact surface and through which the lead terminal passes, and a space portion that communicates with the through-hole and that is configured to house a substrate connected to the lead terminal.

The first capacitor is opposed to and electrically connected to the first back electrode. The second capacitor is opposed to and electrically connected to the second back electrode. Each of the first circuit and the second circuit has a main region that overlaps with a corresponding one of the first capacitor and the second capacitor. At least one circuit of the first circuit and the second circuit has an extension region extending from the main region toward another circuit of the first circuit and the second circuit. At least one of one of the pair of first wires and the second wire is bonded to the extension region.

A metal stem includes a cylindrical portion in which an FPC inserting portion is formed, and a base standing upright from one plane of the cylindrical portion. A tubular lens cap with one open end is fixed to a peripheral portion of the one plane of the cylindrical portion, and has a lens mounted on a bottomed portion. A substrate mounted on one plane of the base includes a signal wiring layer and a ground wiring layer. An optical semiconductor element is mounted on the substrate and has a signal terminal connected to the signal wiring layer of the substrate, and a ground terminal connected to the ground wiring layer of the substrate. An FPC substrate is disposed so as to pass through the FPC inserting portion and to face the one plane of the base. The FPC substrate includes a signal wiring layer connected to the signal wiring layer of the substrate with a metal wire.

An apparatus of structured light generation is equipped with a light source and a lens unit. The lens unit is installed in a compact housing of the apparatus of structured light generation. Moreover, the lens unit constructed two different optical path lengths within the housing. By the lens unit, light beams from the light source are collimated and converted into linear light beams. The linear light beams are locally overlapped or globally overlapped. Consequently, the light beam from the light source is shaped into a linear structured light or a linearly-overlapped structured light for detection.

A technology of effectively interrupting light reflected from a wavelength selective filter so as not to be fed back to a laser diode chip in a semiconductor laser package having a function of adjusting a relative intensity ratio of a signal of “1” and a signal of “0” using an optical filter. Since an optical interruption device may effectively interrupt a light feedback to the laser diode chip by adjusting characteristics of a 45 degree partial reflection mirror in an existing TO-can type laser device having the 45 degree partial reflection mirror and additionally disposing one λ/4 waveplate, unlike previously known optical isolators using an existing Faraday rotator, the signals of “1” and “0” may be effectively adjusted in a TO-can type laser device having a small volume, thereby improving a function of communication.

A laser illumination or dazzler device and method. More specifically, examples of the present invention provide laser illumination or dazzling devices power by one or more violet, blue, or green laser diodes characterized by a wavelength from about 390 nm to about 550 nm. In some examples the laser illumination or dazzling devices include a laser pumped phosphor wherein a laser beam with a first wavelength excites a phosphor member to emit electromagnetic at a second wavelength. In various examples, laser illumination or dazzling devices according to the present invention include polar, non-polar, or semi-polar laser diodes. In a specific example, a single laser illumination or dazzling device includes a plurality of violet, blue, or green laser diodes. There are other examples as well.

Systems, devices, and methods for focusing laser projectors are described. A laser projector includes N≧1 laser diodes, each of which emits laser light having a divergence. Each laser diode is paired with a respective primary or collimation lens to at least reduce a divergence of the laser light that the laser diode produces. Downstream from the primary lens(es) in the optical path(s) of the laser light, a single dedicated secondary or convergence lens converges the laser light to a focus. By initiating the convergence of the laser light at the secondary or convergence lens as opposed to at the primary or collimation lens(es), numerous benefits that are particularly advantageous in laser projection-based wearable heads-up displays are realized.

A transistor outline package is provided that includes a header with a mounting area for an optoelectronic component. The header has a signal pin disposed in a feedthrough. The feedthrough is filled with an insulating material made of glass and/or glass ceramic. The feedthrough has a recessed area on at least one side that is not completely filled up with the insulating material. The recessed area defines a cavity at least partially around the signal pin and the signal pin has an enlarged portion in the recessed area.

A transistor outline package is provided that includes a header with a mounting area for an optoelectronic component. The header has a signal pin disposed in a feedthrough. The feedthrough is filled with an insulating material made of glass and/or glass ceramic. The feedthrough has a recessed area on at least one side that is not completely filled up with the insulating material. The recessed area defines a cavity at least partially around the signal pin and the signal pin has an enlarged portion in the recessed area.