A method for producing a housing cover for a laser component, a housing for a laser component, and a laser component are provided. The method includes providing an at least partially radiation-permeable window including an aluminum oxide, provide a copper carrier for the window, and forming a copper oxide in an oxide region on the copper carrier. The method further includes arranging the window at the oxide region, forming a eutectic bond between the window and the copper oxide in the oxide region, and thereby fixing the window to the copper carrier.

A method for producing a housing cover for a laser component, a housing for a laser component, and a laser component are provided. The method includes providing an at least partially radiation-permeable window including an aluminum oxide, provide a copper carrier for the window, and forming a copper oxide in an oxide region on the copper carrier. The method further includes arranging the window at the oxide region, forming a eutectic bond between the window and the copper oxide in the oxide region, and thereby fixing the window to the copper carrier.

An example beacon system includes a housing, a laser module at least partly retained within the housing, and a controller operable to control the laser module.

A semiconductor laser module that includes a package accommodating therein a plurality of optical components, includes: a semiconductor laser device that emits laser light toward one end side in the package; an optical fiber having an incident end of the laser light on another end side in the package, the another end being in an opposite direction of an emission direction in which the semiconductor laser device emits the laser light; and a turn-back unit that turns back the laser light toward the another end side in the package, the another end being in the opposite direction of the emission direction in which the semiconductor laser device emits the laser light, and outputs the laser light to the incident end of the optical fiber.

The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.

In various embodiments, the concentration and deposition of siloxane materials within components of laser systems, such as laser resonators, is reduced or minimized utilizing mitigation systems that may also supply gas having low siloxane levels into multiple different components in series or in parallel.

In various embodiments, the concentration and deposition of siloxane materials within components of laser systems, such as laser resonators, is reduced or minimized utilizing mitigation systems that may also supply gas having low siloxane levels into multiple different components in series or in parallel.

A semiconductor laser device includes: a package includes a recess and an upper surface that has an outer peripheral surface and a bonding surface positioned between the recess and the outer peripheral surface, the bonding surface having inner corners on the recess side and outer corners on the outer peripheral surface side; at least one semiconductor laser element disposed in the recess of the package; and a light-transmissive member bonded to the bonding surface of the package. The radius of curvature of inner corners is greater than the radius of curvature of outer corners.

A light emitting device includes: a base member; a first semiconductor laser element disposed on an upper surface of the base member, wherein the first semiconductor laser element is configured to emit laser light from a first light emitting surface; a first light-reflecting member disposed on the upper surface of the base member, wherein the first light-reflecting member has a first light-reflecting surface configured to reflect the first laser light; a second semiconductor laser element disposed on the upper surface of the base member, wherein the second semiconductor laser element is configured to emit laser light from a second light emitting surface; and a second light-reflecting member disposed on the upper surface of the base member, wherein the second light-reflecting member has a second light-reflecting surface configured to reflect the second light.

A light emitting device includes: a base member; a laser element disposed on or above a mounting surface of the base member; a fluorescent member including a first main surface and a second main surface respectively positioned on opposite sides of the fluorescent member, the second main surface being fixed to the mounting surface of the base member; a first optical member configured to change a traveling direction of laser light emitted by the laser element to be directed toward the first main surface of the fluorescent member; and a lid connected to the base member and enclosing the laser element, the fluorescent member, and the first optical member in a space beneath the lid, the lid being configured to transmit light from the fluorescent member.