Semiconductor Quantum Cascade Lasers (QCLs), in particular mid-IR lasers emitting at wavelengths of about 3-50 μm, are often designed as deep etched buried heterostructure QCLs. The buried heterostructure configuration is favored since the high thermal conductivity of the burying layers, usually of InP, and the low losses guarantee devices high power and high performance. However, if such QCLs are designed for and operated at short wavelengths, a severe disadvantage shows up: the high electric field necessary for such operation drives the operating current partly inside the insulating burying layer. This reduces the current injected into the active region and produces thermal losses, thus degrading performance of the QCL. The invention solves this problem by providing, within the burying layers, effectively designed current blocking or quantum barriers of, e.g. AIAs, InAIAs, InGaAs, InGaAsP, or InGaSb, sandwiched between the usual InP or other burying layers, intrinsic or Fe-doped. These quantum barriers reduce the described negative effect greatly and controllably, resulting in a QCL operating effectively also at short wavelengths and/or in high electric fields.

A vertical cavity surface emitting laser (VCSEL) has a shortened overall laser cavity by combining the gain section with a distributed Bragg reflector (DBR). The overall cavity length can be contracted by placing gain structures inside the DBR. This generally applies to a number of semiconductor material systems and wavelength bands, but this scheme is very well suited to the AlGaAs/GaAs material system with strained InGaAs quantum wells as a gain medium, for example.

An edge-emitting multi-beam semiconductor laser device includes a layered structure including a substrate, an n-type cladding layer, a light-emitting layer, and a p-type cladding layer. The layered structure has m regions (m≥2) that are adjacent in a first direction, and a sum of a height of the substrate and a height of the first conductive cladding layer is different in each of the m regions, n laser resonators (2≤n≤m) each having a ridge stripe structure extending in a second direction orthogonal to the first direction are formed in the n regions among the m regions, and at least two of the n laser resonators have different oscillation wavelengths among the n laser resonators.

A photonic chip. In some embodiments, the photonic chip includes a waveguide; and an optically active device comprising a portion of the waveguide. The waveguide may have a first end at a first edge of the photonic chip; and a second end, and the waveguide may have, everywhere between the first end and the second end, a rate of change of curvature having a magnitude not exceeding 2,000/mm.sup.2.

Building blocks are provided for on-chip chemical sensors and other highly-compact photonic integrated circuits combining interband or quantum cascade lasers and detectors with passive waveguides and other components integrated on a III-V or silicon. A MWIR or LWIR laser source is evanescently coupled into a passive extended or resonant-cavity waveguide that provides evanescent coupling to a sample gas (or liquid) for spectroscopic chemical sensing. In the case of an ICL, the uppermost layer of this passive waveguide has a relatively high index of refraction that enables it to form the core of the waveguide, while the ambient air, consisting of the sample gas, functions as the top cladding layer. A fraction of the propagating light beam is absorbed by the sample gas if it contains a chemical species having a fingerprint absorption feature within the spectral linewidth of the laser emission.

An optical semiconductor device outputting a predetermined wavelength of laser light includes a quantum well active layer positioned between a p-type cladding layer and an n-type cladding layer in thickness direction. The optical semiconductor device includes a separate confinement heterostructure layer positioned between the quantum well active layer and the n-type cladding layer. The optical semiconductor device further includes an electric-field-distribution-control layer positioned between the separate confinement heterostructure layer and the n-type cladding layer and configured by at least two semiconductor layers having band gap energy greater than band gap energy of a barrier layer constituting the quantum well active layer. The optical semiconductor device is applied to a ridge-stripe type laser.

The invention relates to a tunable laser source, and the reduction in the loss and the size can both be achieved in a tunable laser source having a power monitor and a wavelength locker function. A tunable laser is formed of a semiconductor optical amplifier and a resonator, and one of the two output light beams split from part of the light within the tunable laser by a 2×2 type optical splitter is incident into a light intensity monitor, and the other is incident into a wavelength locker.

A disclosed surface-emitting laser module includes a surface-emitting laser formed on a substrate to emit light perpendicular to its surface, a package including a recess portion in which the substrate having the surface-emitting laser is arranged, and a transparent substrate arranged to cover the recess portion of the package and the substrate having the surface-emitting laser such that the transparent substrate and the package are connected on a light emitting side of the surface-emitting laser. In the surface-emitting laser module, a high reflectance region and a low reflectance region are formed within a region enclosed by an electrode on an upper part of a mesa of the surface-emitting laser, and the transparent substrate is slanted to the surface of the substrate having the surface-emitting laser in a polarization direction of the light emitted from the surface-emitting laser determined by the high reflectance region and the low reflectance region.

In an embodiment, a laser includes a gain section. The gain section includes an active region, an upper separate confinement heterostructure (SCH), and a lower SCH. The upper SCH is above the active region and has a thickness of at least 60 nanometers (nm). The lower SCH is below the active region and has a thickness of at least 60 nm.

A strained quantum well structure of the present disclosure is a type I strained quantum well structure grown by using an InP crystal as a substrate and including a luminescence wavelength of 1.9 μm or longer and 2.5 μm or shorter, in which a well layer is an InGaAs, InAs, or InGaAsSb crystal including a compression strain, a barrier layer is an InGaAsSb crystal including a tensile strain, and a band discontinuity in a conduction band is 100 meV or greater.