A cartridge for an electronic cigarette comprises a liquid store and a vaporizer. The vaporizer includes at least one heating element and an absorbing structure. The absorbing structure has at least one channel fluidically connected to the liquid store by a supply conduit. The at least one channel is open in a direction perpendicular to a capillary flow direction within the at least one channel, and the at least one channel is configured to conduct liquid from the liquid store to the at least one heating element.

An atomizing assembly, comprising a base comprising an atomizing surface for atomizing liquid to form smoke; a heating body for connecting to a power supply to heat the surface, and directly or indirectly disposed on the surface, wherein the projection area of the heating body is less than the area of the surface, so that the atomizing surface is divided into a heating area occupied by the projection of the heating body, and a blank area surrounding the heating area; and a heat conductor at least partially disposed in the blank area of the atomizing surface and connected to the heating body. The heat conductor can transfer a large variety of energies from the heating area into the blank area, so that the temperature of the blank area rises to the same level as the temperature of the heating area, ensuring that the temperatures of all parts on the entire.

A vaporization core of an electronic vaporization device includes: a porous ceramic substrate; a ceramic covering layer; and a heating film. The ceramic covering layer is combined on a surface of the porous ceramic substrate. The heating film is combined on a surface of the ceramic covering layer away from the porous ceramic substrate. A porosity of the ceramic covering layer is lower than a porosity of the porous ceramic substrate. A plurality of penetrating holes are formed on the ceramic covering layer.

The disclosure discloses an atomizing assembly of an electronic cigarette and a preparation method thereof. The preparation method includes steps of: S1, providing a substrate; S2, plating a plurality of heating layers on a plurality of to-be-plated positions by vacuum plating according to the plurality of selected to-be-plated positions on a surface of the substrate; S3, cutting the substrate into a plurality of separated base bodies according to positions of the plurality of heating layers, each base body and the heating layer thereon form one atomizing assembly. The heating layers are attached to the substrate by vacuum plating, thus the plating is uniform and compact, high in size precision, strong in adhesive force and difficult to fall off. The substrate with the heating layers is cut into a plurality of separated atomizing assemblies, thus the production efficiency is higher, the product consistency is better and the product is more stable.

A vaporizing assembly for an aerosol-generating system may comprise a delivery device and a heater assembly. The heater assembly may comprise a heat resistive substrate and a heating element. The delivery device is configured to deliver an aerosol-forming substrate to at least a surface of the heat resistive substrate, wherein the heating element is isolated or separated from the aerosol-forming substrate by the heat resistive substrate. The present disclosure is also directed to a method for generating an aerosol.

The present invention provides a thick film element having a coated substrate with high heat conductivity, which comprises a carrier, a thick film coating deposited on the carrier and a covering layer overlaid on the coating. The thick film coating is a heating material, and the mode of heating is electrical heating. The carrier, the thick film coating and the covering layer are selected from a material that fulfills every of the following equations: ${\lambda }_{3}A\frac{T_3-T_0}{d_3}=a\times {\lambda }_{1}A\frac{T_1-T_0}{d_1},{\lambda }_{2}A\frac{T_2-T_0}{d_2}=b\times {\lambda }_{1}A\frac{T_1-T_0}{}$

Disclosed is a ceramic heater and a ceramic plate for a ceramic heater, wherein, in order to prevent crack development at a ceramic surface around an electrode part and thereby improve durability, the end of a support part for an electrode rod is spaced apart from the ceramic surface opposite thereto, and a space for placing a filler mass is provided around the end of the support part for the electrode rod, whereby force or stress applied to the ceramic surface due to the expansion of the support part or by the filler mass is removed.

An electric heater includes a substrate and a plane heating element disposed on one surface of the substrate. The plane heating element includes a first pattern portion including a start point and an end point, a second pattern portion that surrounds at least a portion of the first pattern portion and includes a start point and an end point, which are located at an innermost side of the second pattern portion, and a third pattern portion that surrounds at least a portion of the second pattern portion and includes a start point and the end point, which are located at an outermost side of the third pattern portion. The first pattern portion includes a plurality of first tracks that are space apart from each other and have an arc shape that is increasing in length from a center to an outermost side of the first pattern portion, the second pattern portion includes a plurality of second tracks spaced apart from each other and having an arc shape that is increasing in length from the innermost side to an outermost side of the second pattern portion, the third pattern portion includes a plurality of third tracks spaced apart from each other and having an arc shape that is increasing in length from an innermost side to the outermost side of the third portion, and a width of a third track is wider than a width of a first track.

A wafer support table includes a ceramic base having a wafer placement surface, and a plurality of heaters embedded in the ceramic base. The ceramic base has a first heater formation surface, a second heater formation surface, and a third heater formation surface in a stated order from the wafer placement surface toward a surface opposite from the wafer placement surface. A first heater is provided on the first heater formation surface so as to be located at a center of the ceramic base. A second heater is provided on the second heater formation surface so as to be located around a periphery of the first heater. A third heater is provided on the third heater formation surface so as to overlap the second heater and is provided in each of a plurality of zones divided from the third heater formation surface by a radial line segment.

A method of providing power to a plurality of heaters in multiple zones for wafer-processing equipment may include causing a voltage to be supplied to a plurality of power leads configured to supply the voltage to a plurality of different heating zones in a pedestal, causing current to be received from the plurality of different heating zones through a return lead that is shared by the plurality of power leads, and causing a polarity of the voltage provided to the plurality of power leads to switch. The switching frequency may be configured such that a DC chucking operation can be active at the same time to hold a substrate to the pedestal. Duty cycling the heating zones that share the return lead may minimize the current through the shared return lead.