A micro-hotplate comprises a Si substrate having a cavity and a support layer over the cavity; at least an electrode; and a heater, both provided on the support layer. The electrode surrounds the heater and the heater is disposed inside the electrode. The power efficiency of the micro-hotplate is improved.

Devices and methods are described for preparing, managing, and/or administering metered doses of substances for vaporized administration. In some embodiments, dose cartridges comprising at least one botanical substance include a heating element integrated into the cartridge in close contact with the botanical substance. In some embodiments, cartridge-mounted doses are stored in a magazine, optionally in carousel form, before use. Transport of a cartridge from a magazine to an electrically operated vaporizing chamber which activates the heating element is provided by a mechanical pickup means.

An infrared emitter with a glass lid for emitting infrared radiation comprises a package enclosing a cavity, wherein a first part is transparent for infrared radiation and a second part comprises a glass material and a heating structure configured for emitting the infrared radiation, wherein the heating structure is arranged in the cavity between the first part and the second part of the package.

A ceramic heater includes a ceramic plate, a main resistance heating element, and sub resistance heating elements. The main resistance heating element is a heating element that is disposed on a first plane parallel with a wafer placement surface in the ceramic plate and that has a coil shape. The sub resistance heating elements are heating elements that are disposed on a second plane parallel with the first plane in the ceramic plate between the first plane and the wafer placement surface, that complement heating with the main resistance heating element, and that have a two-dimensional shape.

Multi-point thermocouples and assemblies are disclosed for ceramic heating structures. The disclosed embodiments provide multi-point connections in distinct areas to provide good temperature-sensing contacts between metal thermocouples and ceramic bodies while also providing improved flexibility. As such, cracking of ceramic bodies for heating structures is avoided. For one embodiment, assemblies including a multi-point thermocouple and a ceramic body are used in bake plates for processing systems that process microelectronic workpieces. The metal thermocouple has a flat surface used for connections to the ceramic body. Preferably, the thermocouple is relatively thin and provides improved connection sites and flexibility.

A toaster dripping tray is placed within a traditionally configured toaster and removably disposed there beneath. The tray covers the entire bottom of the toaster. When incorporated into a toaster, the normally present dripping channel gate resting above the narrow dripping removal tray is not present.

The ceramic heater of the present invention includes: an alumina substrate having a wafer placement surface; resistance heating elements disposed in respective zones; multistage jumpers that supply electric power to the resistance heating elements, the resistance heating elements and the jumpers being embedded in the alumina substrate in this order from a wafer placement surface side; heating element connecting vias that vertically connect the resistance heating elements to the jumpers; and power supply vias exposed to the outside in order to supply electric power to the jumpers. The specific resistance of the heating element connecting vias is smaller than that of the resistance heating elements, and the absolute value of the difference between CTE of the heating element connecting vias and CTE of the alumina substrate is smaller than the absolute value of the difference between CTE of the resistance heating elements and CTE of the alumina substrate.

A heating assembly according to one example embodiment includes a thermally conductive heat transfer plate and a plurality of modular heaters mounted to the heat transfer plate. Each modular heater includes a ceramic substrate having at least one electrically resistive trace thick film printed on the ceramic substrate and at least one electrically conductive trace thick film printed on the ceramic substrate. Each modular heater is configured to generate heat when an electric current is supplied to the at least one electrically resistive trace, and the heat transfer plate is positioned to transfer heat from the plurality of modular heaters for heating a desired heating area.

A cooking device according to one example embodiment includes a plurality of modular heaters. Each modular heater includes a ceramic substrate and an electrically resistive trace positioned on the ceramic substrate. Each modular heater is configured to generate heat when an electric current is supplied to the electrically resistive trace. The cooking device includes a thermally conductive heating plate. The plurality of modular heaters are positioned against a bottom surface of the heating plate. The heating plate includes a top surface positioned to transfer heat provided by the plurality of modular heaters to a cooking vessel for cooking an item held by the cooking vessel.

A ceramic heater includes a ceramic plate having a front surface that serves as a wafer placement surface, resistance heating elements that are embedded in the ceramic plate, a tubular shaft that supports the ceramic plate from a rear surface of the ceramic plate, and a thermocouple passage that extends from a start point in a within-shaft region of the rear surface of the ceramic plate, the within-shaft region being surrounded by the tubular shaft, to a terminal end position in an outer peripheral portion of the ceramic plate. The thermocouple passage includes a curved portion between the start point and the terminal end position.