Current measurement devices for printed circuit board mounting are disclosed herein. The current measurement devices include a hollow and flexible core to improve response to a primary signal and decrease weight. The current measurement device includes a housing with guides to maintain alignment of the core. An electromagnetic shield may be placed between the circumference of the core and the housing. The housing may include apertures to facilitate washing. The current measurement device may include a primary conductor external to the housing.

The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.

A module includes: a substrate including a first surface and including first and second sides; a component as a first component mounted on the first surface; a first sealing resin arranged to cover the first surface and the first component; and a first shield film. An inclined portion is formed in the substrate. The substrate includes a first lead electrode arranged to be exposed to the inclined portion along the first side, and a second lead electrode arranged to be exposed to the inclined portion along the second side, and each of these is connected to the first shield film. A height of the second lead electrode is different from a height of the first lead electrode.

A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

A circuit board structure includes a dielectric substrate, at least one embedded block, at least one electronic component, at least one first build-up circuit layer, and at least one second build-up circuit layer. The dielectric substrate includes a through cavity penetrating the dielectric substrate. The embedded block is fixed in the through cavity. The embedded block includes a first through hole and a second through hole. The electronic component is disposed in the through hole of the embedded block. The first build-up circuit layer is disposed on the top surface of the dielectric substrate and covers the embedded block. The second build-up circuit layer is disposed on the bottom surface of the dielectric substrate and covers the embedded block.

A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

A circuit module includes: a main substrate; a submodule that is mounted on a top surface of the main substrate; a main sealing resin that is provided on the top surface of the main substrate, and covers at least part of the submodule; and a conductive shield film that covers at least part of the main sealing resin. The submodule includes a sub-substrate, an electronic part that is mounted on a top surface of the sub-substrate, a plurality of conductive members that have linear shapes, and are connected to the top surface of the sub-substrate and the shield film, and a subsealing resin that is provided on the top surface of the sub-substrate, and covers the electronic part and part of each of the plurality of conductive members.

This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

A compact portable electronic device packaged into a System-in-Package assembly and thermal solutions for the device is disclosed. The compact portable electronic device can be assembled into a single package to reduce size and enhance form factor. Several tens or hundreds of components including multiple dies, passive components, mechanical or optical components can be packaged into a single system on a printed circuit board. One or more of the components can dissipate a lot of power resulting in the generation of excess heat. To remove the excess heat, the device can include one or more thermal solutions such as internal thermal plugs, heat spreaders, internal embedded heat sinks, and/or external heat sinks. In some examples, the thermal solutions can dissipate heat via conduction to the bottom of the substrate or via convection to the top of the system or a combination of both.

A data transmission circuit board, a mobile industry processor interface and a device are provided. The data transmission circuit board includes: a wiring substrate; a plurality of data transmission line pairs on one side of the wiring substrate; and a plurality of transient voltage suppression diodes on the one side of the wiring substrate. Data transmission lines of the data transmission line pairs are coupled to the transient voltage suppression diodes in a one-to-one correspondence, the line width of at least one data transmission line is within a line width threshold range; and the transient voltage suppression diode is configured to discharge when a voltage to ground on the corresponding data transmission line is greater than a discharge voltage threshold, wherein the discharge voltage threshold is not less than a maximum voltage value of the differential signal transmitted on the data transmission line.