A circuit board according to the present disclosure includes a substrate that is composed of a ceramic(s), and an electrically conductive layer that is positioned in contact with the substrate. The substrate includes a groove around the electrically conductive layer. Furthermore, an electronic device according to the present disclosure includes a circuit board with a configuration as described above, and an electronic component that is positioned on the electrically conductive layer.

The flexible printed circuit includes a first insulator including a first insulating layer, a second insulator including a second insulating layer, and a wiring layer formed of a conductive material. Each of the first insulator and the second insulator meets IEC 60950. The flexible printed circuit includes a region where insulation of the wiring layer is required, the region is hermetically sealed by the first insulator and the second insulator.

An organic circuit carrier including an organic insulation layer and at least one metallization layer arranged on an upper side, a lower side, or the upper side and the lower side of the organic insulation layer is provided. Side surfaces of the at least one metallization layer are embodied in a convexly curved fashion. A circuit arrangement and a power converter including such an organic circuit carrier are also provided. A vehicle such as an aircraft, including such a power converter, is also provided.

A substrate includes a primary circuit; a secondary circuit; and a ground (GND) patterns. In a path between the primary circuit and the secondary circuit without passing through the GND pattern, reinforced insulation is provided between the primary circuit and the secondary circuit. In a path between the primary circuit and the secondary circuit through the GND pattern, one of 1) a combination of reinforced insulation and functional insulation and 2) a combination of basic insulation, additional insulation, and functional insulation is provided between the primary circuit and the secondary circuit.

Provided is a physiological information detection sensor capable of implementing miniaturization by substantially securing a creepage distance and an air distance (e.g., implementing defibrillation protection). The physiological information detection sensor includes: a plurality of first substrates arranged in multiple tiers; a second substrate; a first connecting portion that electrically connects adjacent first substrates to each other among the plurality of first substrates; and an insulating member. Each of the plurality of first substrates has a defibrillation protection resistor mounted thereon and electrically connected to a physiological information detection unit. The second substrate has a circuit mounted thereon to process physiological information input from the physiological information detection unit via the defibrillation protection resistor. The insulating member is disposed between adjacent first substrates among the plurality of first substrates.

A partially molded substrate and a partial molding apparatus and a method thereof, which cover and mold each of one or more conductors formed on the substrate with the insulator to prevent the sizes of the substrate from being increased due to molding, thereby efficiently preventing high voltage between the conductors on the substrate from being applied, and thereby preventing interference around the conductor.

An interface circuit includes: a connector connectable to a PC; a communication circuit capable of generating a transmission signal to another electronic device; a first region that is set between the connector and the communication circuit to allow an electrical isolation device to be mounted therein; wiring lines used to connect the communication circuit and the connector to each other through the first region; and wiring lines used to connect the electronic circuit and the connector to each other through a region other than the first region.

A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

An interface circuit includes: a connector connectable to a PC; a communication circuit capable of generating a transmission signal to another electronic device; a first region that is set between the connector and the communication circuit to allow an electrical isolation device to be mounted therein; wiring lines used to connect the communication circuit and the connector to each other through the first region; and wiring lines used to connect the electronic circuit and the connector to each other through a region other than the first region.

According to some aspects of the present disclosure, circuit board assemblies and methods of circuit board assembly are disclosed. Example circuit board assemblies include a circuit board and a magnetic component coupled to the circuit board. The magnetic component includes a primary winding and a secondary winding. The assembly also includes a winding interconnect terminal electrically coupled to the magnetic component. The winding interconnect terminal is disposed on the circuit board remote from the magnetic component, and the circuit board defines an air gap between the winding interconnect terminal and the magnetic component to provide electrical isolation between the winding interconnect terminal and the magnetic component. Corresponding methods of assembling circuit boards and magnetic components are also disclosed.