An assembly includes a circuit board having at least two conductor traces formed thereon, each of the conductor traces having at least one hole associated therewith, a circuit breaker having at least two conductive terminals, each of the conductive terminals having a screw-receiving threaded opening, the threaded openings being aligned with the holes formed in the circuit board, and a spacing bracket comprising a floor positioned between the circuit board and the circuit breaker when the circuit breaker is attached to the circuit board, the floor having at least two terminal receiving openings passing therethrough, the openings separated from one another by a barrier and being aligned with the threaded openings of the circuit breaker and the holes of the circuit board. The spacing bracket further includes an affixation member that affixes the spacing bracket to at least one of the printed circuit board and the circuit breaker.

A substrate includes a primary circuit; a secondary circuit; and a ground (GND) patterns. In a path between the primary circuit and the secondary circuit without passing through the GND pattern, reinforced insulation is provided between the primary circuit and the secondary circuit. In a path between the primary circuit and the secondary circuit through the GND pattern, one of 1) a combination of reinforced insulation and functional insulation and 2) a combination of basic insulation, additional insulation, and functional insulation is provided between the primary circuit and the secondary circuit.

A voltage determination device includes: a printed wiring board on which first to third substrate terminals are arranged in substantially one line; first and second voltage determination circuits mounted on the printed wiring board and disposed on a first side of the printed wiring board divided by a line passing through the first to third substrate terminals; a first printed wiring connecting the first substrate terminal and the first voltage determination circuit; a second printed wiring connecting the second substrate terminal and the first voltage determination circuit; a third printed wiring connecting the third substrate terminal and the second voltage determination circuit; and a fourth printed wiring connecting the second substrate terminal and the second voltage determination circuit, in which the first to fourth printed wirings are provided without intersecting each other and without bypassing a second side of the printed wiring board divided by the first arrangement line.

An electronic arrangement (100) and a method of manufacturing an electronic arrangement are provided. The electronic arrangement comprises an array of electronic components (110) arranged along a first axis, A, and a carrier (120) arranged to support the array of electronic components, wherein the carrier comprises, a first metal layer (130), a second metal layer (140), and an at least partially insulating layer (150) arranged between the first and second metal layers. The electronic arrangement further comprises a partition portion (160) arranged between two adjacently arranged electronic components for partitioning the electronic arrangement, wherein the second metal layer comprises a void (180) intersected by the second axis, wherein the void has a width (190) which extends parallel to the first axis, such that, at the second axis, the second metal layer is undercut with respect to the first metal layer, in a direction parallel to the first axis.

A circuit board (10, 10, 10) includes at last one insulating substrate layer (SL1, SL2, SL3, SL4, SL5) and a plurality of electrically conductive copper coats (C1, C2, C3) arranged on the at least one insulating substrate layer (SL1, SL2, SL3, SL4, SL5), wherein at least one of the electrically conductive copper coats (C1, C2, C3) is coated at least on both sides with a layer (HSI, HS2, HS3) made of a material for inhibiting electromigration, wherein on a layer (HS1, HS2) made of a material for inhibiting electromigration a further metal layer (M1, M2, M3, M3) is provided, which is in turn coated with a further layer (HS3, HS3) made of a material for inhibiting electromigration.

A multi-phase busbar for conducting electric energy includes: an insulating base layer made of an insulating material; a first conducting layer made of a sheet metal arranged on and adhesively bonded to the base layer; a first connecting pin mounted to the first conducting layer which extends in a direction with respect to the first conducting layer; a first insulating layer arranged on and adhesively bonded to the first conducting layer; a second conducting layer made of a sheet metal arranged on and adhesively bonded to the first insulating layer, the second conducting layer including a second connecting pin which extends in a direction parallel to the first connecting pin; and a second insulating layer arranged on and adhesively bonded to the second conducting layer. The second conducting layer and the first and second insulating layer each include at least one pinhole through which the first connecting pin projects.

System and method of applying pulsed electromagnetic fields (PEMF) to a human user's body. Here an electrically isolated antenna is applied to a portion of the body. This antenna is connected to a PEMF power source comprising a modified Blumlein dual transmission line transformer circuit with emphasis on miniaturization. Each transmission line comprises a substantially planar PC board mounted conducting strip configured in a meander pattern, and separated from at least one split ground plane by at least one substantially planar dielectric material and at least one split ground plane. This in turn is powered by a low voltage power supply, resonant transformer. The Blumlein circuit is charged and discharged by a processor controlled high-speed switch according to user selected time settings, and can produce outputs substantially above 1 kV. Relative to prior art devices, the system enables much smaller, lighter, and less costly PEMF implementations.

A method for producing a circuit board includes a first step of arranging a circuit alignment jig having a pierced portion for receiving a circuit conductor corresponding to a circuit pattern on an insulating layer formed on a metal substrate, a second step is inserting the circuit conductor into the pierced portion, and a third step is pressing the circuit conductor to the insulating layer together with the circuit alignment jig.

A radiofrequency transmission line configured so as to allow a radiofrequency electrical signal to be transmitted between a first end and a second end, the transmission line including a main conductor and a ground plane electrically connected to an electrical ground of the transmission line.

The ground plane includes a set of portions that are connected in series between the first end and the second end and a set of second capacitors, the set of portions including a set of second portions, each second capacitor being inserted between two contiguous second portions.

The application relates to a galvanic separating apparatus, including a printed circuit board, the printed circuit board including a first soldering pad, a second soldering pad and a recess, whereby the pads are arranged on a lower side of the printed circuit board thereby defining a clearance and/or creepage distance between the pads, and the recess is arranged between the pads, a primary insulated winding layer connected to the first soldering pad and a second insulated winding layer connected to the second soldering part, whereby the winding layers are arranged on an upper side of the printed circuit board, and an insulating layer, whereby the insulating layer extends from the upper side through the recess and protrudes on the lower side beyond the printed circuit board thereby increasing the clearance and/or creepage distance.