Patent classifications
H05K1/097
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR PRODUCING SUBSTRATE FOR PRINTED CIRCUIT BOARD
A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.
Stretchable Electrically Conductive Layer Formation By Aerosol Jet Printing On Flexible Substrate
Methods of forming an electrically conductive layer on a flexible substrate, such as a stretchable electrode, by aerosol jet printing on the flexible substrate while the substrate is strained. In general, a stretchable substrate is initially deformed so that a first surface thereof is under tension. While the substrate is in the strained state, an ink is aerosol jet printed onto the first surface. The ink includes carbon nanotubes, and advantageously other materials such as reduced graphene oxide. Further, while the substrate is still in the strained state, the ink is cured after its application to the substrate. Thereafter, the strain is decreased so that the stretchable substrate contracts, self-organizing into a configuration wherein the substrate's first surface, with the cured ink thereon, has a wrinkled profile. The flexible substrate can then be mechanically expanded and contracted, advantageously repeatedly, with the ink layer maintaining electrical conductivity.
INK FOR SCREEN PRINTING
Provided is an ink for use in electronic component production making use of screen printing, which is suitable for actually allowing fine lines with high precision to be drawn in screen printing, and for actually allowing successive screen printing operations to be performed. The ink for screen printing of the present invention includes surface-modified silver nanoparticles (A) and a solvent (B), and has a viscosity at a shear rate of 10 (1/s) and 25° C. of 60 Pa.Math.s or more. The surface-modified silver nanoparticles (A) each include a silver nanoparticle and an amine-containing protective agent coating the silver nanoparticle. The solvent (B) includes at least a terpene solvent. In solvent (B), a content of solvents having a boiling point of less than 130° C. is 20 wt % or less based on the total amount of solvents.
SILVER POWDER
A silver powder includes a large number of particles. The particles include polyhedral particles 2. The ratio P1 of the number of the polyhedral particles 2 to the total number of the particles is equal to or greater than 80%. Each polyhedral particle 2 has a body containing silver as a main component, and a coating layer covering a surface of the body and containing organic matter as a main component. Each polyhedral particle 2 has an aspect ratio of equal to or less than 3.0. The content P2 of the organic matter in the silver powder is preferably equal to or less than 0.5% by weight. The silver powder preferably has a median diameter D50 of equal to or less than 0.5 μm. The silver powder preferably has a tap density TD of equal to or greater than 5.0 g/cm.sup.3.
Electrically Conductive PTC Screen Printable Ink with Double Switching Temperatures and Method of Making the Same
The invention provides an electrically conductive screen-printable PTC ink with double switching temperatures, which comprising by weight based on total composition, 10-30 wt % conductive particles; 5-15 wt % polymer resin 1; 5-15 wt % polymer resin 2; 40-80 wt % organic solvent; e) 1-5 wt % other additives.
Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device
A composition for forming a conductive film includes at least one of a metal salt (A1) and a metal particle (A2) as component (A) that serves as a metal source of the conductive film, and a metalloxane compound (B). The metal salt (A1) and the metal particle (A2) contain one or more metals selected from the group consisting of Ni, Pd, Pt, Cu, Ag, and Au. The metalloxane compound (B) has at least one metal atom selected from the group consisting of Ti, Zr, Sn, Si, and Al in its main chain. Preferably, the metal salt (A1) is a carboxylate containing a metal selected from the group consisting of Cu, Ag, and Ni. Preferably, the metal particle (A2) has an average particle diameter of 5 nm to 100 nm and comprises a metal selected from the group consisting of Cu, Ag, and Ni.
METHOD OF MANUFACTURING A HYBRID METAL PATTERN BY USING WIRE EXPLOSION AND LIGHT-SINTERING, AND A HYBRID METAL PATTERN MANUFACTURED THEREBY
The inventive concepts relate to a method of manufacturing a hybrid metal pattern and a hybrid metal pattern manufactured thereby. In the method, the hybrid metal pattern may be manufactured on a substrate (e.g., a flexible substrate), formed of various materials, at room temperature without damaging the substrate, by a wire explosion method in liquid and light-sintering. In more detail, when performing the wire explosion method in liquid according to conditions of the inventive concepts, metal particles having uniform nano-sizes and uniform micro-sizes can be formed by a simple process, and additional dispersing and collecting processes can be omitted. In addition, conductive hybrid ink is formed by adding a metal precursor and then is light-sintered. In this case, the hybrid metal pattern can be manufactured by a very simple process.
Transparent conductive coatings for optoelectronic and electronic devices
The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.
Electronic assembly with fiducial marks for precision registration during subsequent processing steps
An electronic assembly includes a substrate having in a first zone a low contrast first conductive pattern; a high contrast fiducial mark in a second zone of the substrate different from the first zone, wherein the fiducial mark and the first conductive pattern are in registration; and a second conductive pattern aligned with the first conductive pattern.
SILVER PARTICLE COATING COMPOSITION
The present invention provides a silver coating composition that develops excellent conductivity (low resistance value) by low-temperature and short-time calcining, and that is excellent in fine-line drawing performance and suitable for intaglio offset printing. A silver particle coating composition comprising: silver nano-particles (N) whose surfaces are coated with a protective agent containing an aliphatic hydrocarbon amine; a surface energy modifier; and a dispersion solvent. The surface energy modifier may be selected from the group consisting of a silicon-based surface energy modifier and an acrylic surface energy modifier. The coating composition preferably further comprises silver microparticles (M). The silver coating composition is suitable for intaglio offset printing.