Patent classifications
H05K1/097
Inserting ad elements
Systems and methods are provided for presenting branding elements with electronic content. In one implementation, a method is provided that includes receiving, from a user device, a request that identifies a segment of electronic content and that contains information specifying a display configuration of the user device. The method further includes selecting first metadata including information defining how at least one branding element is to be presented based on the display configuration of the user device, and selecting second metadata for the requested segment of electronic content, the second metadata including information related to presenting the requested segment of electronic content. Additionally, the method includes instructing the user device to generate a presentation based on the selected first metadata and the selected second metadata, the presentation including the requested segment of electronic content and the at least one branding element.
Printing system architecture for encoding chip-less RFID tags in real time
Provided is a method for encoding chipless RFID tags in real-time. The method includes exposing a chipless RFID transponder to a conductive material, the RFID transponder comprising an antenna and a plurality of resonant structures, the plurality of resonant structures together defining a first spectral signature. Each of the plurality of resonant structures includes a respective one of a frequency domain. The method also includes depositing a conductive material on at least one of the resonant structures to short the at least one of the resonant structures. The remainder of the plurality of resonant structures that are not shorted by the conductive material define a second spectral signature for the RFID transponder.
FLEXIBLE TRANSPARENT ELECTRODE AND METHOD FOR MANUFACTURING SAME
A method for manufacturing a flexible transparent electrode includes: preparing a substrate made of a flexible and transparent material, a metal nanocolloidal solution and an electrohydrodynamic jet printing device; fixing the substrate at a position spaced apart from an injection nozzle of the electrohydrodynamic jet printing device at a predetermined interval in order to print a metal pattern on the substrate using the electrohydrodynamic jet printing device; applying AC voltage of a predetermined power to the substrate and the injection nozzle of the electrohydrodynamic jet printing device; printing the metal pattern on an upper side of the substrate by the metal nanocolloidal solution using the electrohydrodynamic jet printing device in a state where the AC voltage of the predetermined power is applied to the substrate and the injection nozzle; and sintering the metal pattern formed on the substrate.
Method for Enhancing Adhesion of Silver Nanoparticle Inks Using a Functionalized Alkoxysilane Additive and Primer Layer
An alkoxysilane comprising a functional group is used as an additive in the silver nanoparticle ink, and as an adhesion promoter (or primer layer) on the surface of the substrate in order to enhance the adhesion of silver nanoparticle inks on temperature-sensitive plastic substrates. The combination of the functionalized alkoxysilane both in the ink and on the substrate's surface provides enhanced adhesion after annealing the ink at a low temperature. The adhesion of the annealed films improves from a 0B-3B level to 4B-5B when tested according to ASTM D3359. No degradation of adhesion and no change of color are observed after aging the annealed films in a humidity chamber.
Method of Enhancing Adhesion of Silver Nanoparticle Inks on Plastic Substrates Using a Crosslinked Poly(vinyl butyral) Primer Layer
A primer layer comprising a polyvinyl butyral resin enhances adhesion of silver nanoparticle inks onto plastic substrates. The primer layer comprises a polyvinyl butyral (PVB) resin having a polyvinyl alcohol content between about 18 wt. % to about 21 wt. %. The PVB resin may also have a glass transition temperature greater than about 70° C. Optionally, the PVB primer layer may further be enhanced by cross-linking using a melamine-formaldehyde resin. Conductive traces formed on plastic substrates having the PVB primer layer exhibit an acceptable cross-hatch adhesion rating with little to no degradation of adhesion being observed after exposure to 4-days salt mist aging or 1-day high humidity aging.
Method of Fabricating Highly Conductive Features with Silver Nanoparticle Ink at Low Temperature
A method of fabricating highly conductive (low resistive) features with silver nanoparticle inks at low processing temperature including room temperature is provided, The method includes 1) printing a silver nanoparticle ink to form a conductive feature on a substrate; 2) drying/annealing the printed feature at a temperature compatible with the substrate; 3) treating the annealed feature in a humidity environment; and 4) optionally drying the treated conductive feature. The silver nanoparticle conductive features exhibit a decrease in resistivity from about a factor of 2 up to about a few orders of magnitude after exposure to the humidity treatment.
Additive manufactured reactive beamformer
A reactive beamformer includes a radiator disposed within a substrate and configured to radiate a received electromagnetic signal, a plurality of receptors disposed within the substrate, each of the plurality of receptors configured to receive a portion of the radiated electromagnetic signal, and a plurality of signal lines. Each signal line of the plurality of signal lines is coupled to a respective receptor of the plurality of receptors to convey the portion of the radiated electromagnetic signal from the respective receptor and to provide the portion of the radiated electromagnetic signal to an output.
COPPER PARTICLE, METHOD FOR PRODUCING COPPER PARTICLE, COPPER PASTE, SEMICONDUCTOR DEVICE, AND ELECTRICAL/ELECTRONIC COMPONENT
Copper particles coated with at least one kind of a nitrogen-containing compound selected from hydrazinoethanol and a hydrazinoethanol salt.
FLEXIBLE CIRCUITS ON SOFT SUBSTRATES
An article includes a solid circuit die on a first major surface of a substrate, wherein the solid circuit die includes an arrangement of contact pads, and wherein at least a portion of the contact pads in the arrangement of contact pads are at least partially exposed on the first major surface of the substrate to provide an arrangement of exposed contact pads; a guide layer including an arrangement of microchannels, wherein the guide layer contacts the first major surface of the substrate such that at least some microchannels in the arrangement of microchannels overlie the at least some exposed contact pads in the arrangement of exposed contact pads; and a conductive particle-containing liquid in at least some of the microchannels. Other articles and methods of manufacturing the articles are described.
Conductive paste and method for producing conductive film using same
After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, coarse copper particles having an average particle diameter of 0.3 to 20 μm, a glycol solvent, such as ethylene glycol, and at least one of a polyvinylpyrrolidone (PVP) resin and a polyvinyl butyral (PVB) resin and wherein the total amount of the fine copper particles and the coarse copper particles is 50 to 90% by weight, the weight ratio of the fine copper particles to the coarse copper particles being in the range of from 1:9 to 5:5, the conductive paste thus prepared is applied on a substrate by screen printing to be preliminary-fired by vacuum drying, and then, fired with light irradiation by irradiating with light having a wavelength of 200 to 800 nm at a pulse period of 500 to 2000 μs and a pulse voltage of 1600 to 3800 V to form a conductive film on the substrate.