An electronic assembly is provided, including a wiring board, a control element, and a pair of first internal electrical connectors. The wiring board includes a mounting surface, a first patterned conductive layer, a plurality of second patterned conductive layers, a plurality of near conductive holes, a plurality of far conductive holes, and a first conductive path. The first patterned conductive layer is located between the mounting surface and the second patterned conductive layers. The control element is mounted on the mounting surface of the wiring board. The pair of first internal electrical connectors are mounted on the mounting surface of the wiring board, and are adapted for mounting a pair of memory modules. The first conductive path extends from the control element at least through the corresponding second patterned conductive layer and the first patterned conductive layer to the pair of first internal electrical connectors.

A substrate structure, a manufacturing method thereof, and an electronic device. The substrate structure includes a substrate, conductive wires and conductive members. Multiple through holes penetrate through the substrate body of the substrate. Multiple first conductive pads are arranged on the first surface of the substrate body. Multiple second conductive pads are arranged on the second surface of the substrate body. The conductive wires are accommodated in the through holes and each has a first end in the first opening of corresponding through hole and a second end in the second opening of corresponding through hole. The conductive members are distributed on the first and second surfaces, and both ends thereof are connected to the corresponding first and second conductive pads through the conductive members. At least part of each conductive wire does not contact the hole wall of each through hole in a direct manner.

Certain aspects of the present disclosure generally relate to a circuit board with ground vias offset from associated ground bumps. One example circuit board generally includes a first signal connection terminal configured to connect a signal line of the circuit board to an integrated circuit (IC); a ground plane having a first ground connection terminal disposed adjacent to the first signal connection terminal, the first ground connection terminal being configured to provide a ground connection between the ground plane and the IC; and a first ground via associated with and disposed adjacent to the first ground connection terminal and coupled to the ground plane, wherein, from an overhead view of the circuit board, the first ground via is located at a position that is offset from a first axis on which the first signal connection terminal and the first ground connection terminal are disposed.

A wiring substrate includes an insulating layer, a conductor layer formed on the insulating layer and including a conductor pad having a rectangular planar shape, and a solder resist layer formed on the insulating layer such that the solder resist layer is covering the conductor layer formed on the insulating layer. The solder resist layer has an opening formed such that the opening is exposing 50% or more of an area of a surface of the conductor pad on the opposite side with respect to the insulating layer and exposing a side surface and the surface of the conductor pad at side portions of a peripheral edge of the conductor pad and that the solder resist layer is covering the side surface and the surface of the conductor pad at one or more of corner portions of the peripheral edge of the conductor pad.

This disclosure provides systems, methods, and apparatus related to printed circuit boards. In one aspect, a device includes a first board and a second board. The first board includes at least two pins defined at an end of the first board. The first pin and the second pin are positioned along a first line and parallel to the first line. The second board includes at least two slots defined at an end of the second board. The first slot and the second slot are positioned along a second line and are angled from the second line by about ±10° to 15° . Each of the pins in the first board is engaged with each of the slots in the second board and forms an electrical connection between the first pin and the first slot and the second pin and the second slot.

An apparatus is provided which comprises: a cavity made in a substrate of a printed circuit board (PCB); a plurality of solder balls embedded in the cavity; and a horizontal trace within the substrate, wherein the horizontal trace is partially directly under the plurality of solder balls and is coupled to the plurality of solder balls and another trace or via in the substrate such that a substrate region under the plurality of solder balls is independent of a stop layer under the cavity.

A stacked-layer board includes a base material including a plurality of dielectric layers stacked on each other, a first main surface being a surface at one end in a stacking direction of the plurality of dielectric layers, and a second main surface being a surface at the other end in the stacking direction, and a first conductor provided on the first main surface, and a first groove is in a surface of the first conductor.

The disclosure relates to research (No. GK17N0100, millimeter wave 5G mobile communication system development) that was conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017. An Radio Frequency (RF) package module according to various embodiments and an electronic device including the RF package module are provided. The RF package module according to an embodiment includes a sub module including an Radio Frequency Integrated Chip (RFIC); an antenna configured to transmit and receive a signal wirelessly through a predetermined metal pattern; and a multi-layer circuit board including a plurality of layers in which a signal via for transferring the signal between the RFIC and the antenna and one or more ground vias are formed, wherein the antenna is spaced from the one or more ground vias by one or more anti-pads.

A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a conductive structure and at least one conductive through via. The conductive structure includes a plurality of dielectric layers, a plurality of circuit layers in contact with the dielectric layers, and a plurality of dam portions in contact with the dielectric layers. The dam portions are substantially arranged in a row and spaced apart from one another. The conductive through via extends through the dam portions.

For example, an apparatus may include a Printed Circuit Board (PCB) including a Ball Grid Array (BGA) on a first side of the PCB, the BGA configured to connect a Surface Mounted Device (SMD) to the PCB; an antenna disposed on a second side of the PCB opposite to the first side, the antenna to communicate a Radio Frequency (RF) signal of the SMD; and an RF transition to transit the RF signal between the BGA and the antenna, the RF transition including a plurality of signal buried-vias; a first plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and a ball of the BGA, the first plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias; and a second plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and the antenna.