A touch sensor having conductive circuits on both surfaces of a substrate is fabricated by including UV-blocking material into the substrate or depositing UV-blocking layer on the substrate. This can be used for fabricating sensors having transparent conductor circuits, or having metallic circuits, which are opaque to visible light. Photoresist is applied to both surfaces of the substrate and patterns are transferred to the photoresist by exposure to UV radiation. The UV-blocking layer prevents UV-radiation applied to one side from exposing the opposite side. If desired, both photoresist layers may be exposed simultaneously by splitting one UV beam.

Disclosed is a thin film circuit substrate and a manufacturing method thereof, which are capable of forming a pattern having a feature size of less than 10 μm by forming a seed layer and a plating layer on a base substrate and then forming, through electrospinning, a photoresist layer having a thickness in a set range. The disclosed thin film circuit substrate comprises: a base substrate; a thin film seed layer formed on the top surface of the base substrate; a metal layer formed on the top surface of the thin film seed layer; and a photoresist layer formed on the top surface of the metal layer, wherein the thickness of the photoresist layer is in a range of 1 μm to 5 μm.

Embodiments are directed to short and/or near short etch rework. A microfluidic device is positioned on a portion of a circuit having a defect. The microfluidic device is caused to dispense etchant that removes the defect of the circuit, where a flow of the etchant is controlled to access the portion of the circuit having the defect to thereby etch away the defect, the flow of the etchant being obstructed from accessing other portions of the circuit. The microfluidic device is used to extract the etchant from the portion of the circuit such that the etchant avoids contact with the other portions of the circuit. The microfluidic device is removed from the circuit.

A wiring circuit board assembly sheet includes a support sheet having two end edges parallel with each other and a plurality of wiring circuit boards disposed at spaced intervals to each other in the support sheet. The wiring circuit board includes a metal-based portion having a generally rectangular frame shape. The metal-based portion includes a first piece along a first direction perpendicular to a thickness direction of the support sheet, and a second piece along a second direction perpendicular to the thickness direction and the first direction. Both the first piece and the second piece are inclined with respect to the end edge of the support sheet.

The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps: Provision of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer, Embedding of at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer, Application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component, Clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist, by application of a semi-additive process, deposition of a layer of conductor material onto the cleared end faces of the contacts and the cleared areas of the conductor layer and formation of a conductor pattern on at least the one outer surface of the core on which the component is arranged, as well as the interconnecting paths between the contacts and the conductor pattern, and Removal of the areas of the conductor layer not belonging to the conductor pattern.

The main technical problem solved by the present disclosure is to provide a circuit board preparation method. The method includes: obtaining a to-be-processed plate comprising an insulating layer, a first copper layer, a second copper layer opposite to the first copper layer, a blind metalized hole, and a first tab facing the blind metalized hole; obtaining a white insulating material; laminating the white insulating material to a surface of the insulating layer, a surface of the first copper layer, a surface of the first tab, and a surface of the second copper layer to form a first white insulating medium layer and a second white insulating medium layer opposite to the first while insulating medium layer; and performing surface polishing for the first white insulating medium layer and grinding the first white insulating medium layer until the first tab is exposed to form a first white reflective layer.

Disclosed are a method of directly patterning a stretchable substrate; and a stretchable electrode fabricated by the method. More particularly, the method of directly patterning a stretchable substrate includes: forming a hydrophilic group on a surface of a stretchable substrate by UV-ozone treatment; forming at least one layer to be etched on the hydrophilic group-formed stretchable substrate, wherein the at least one layer to be etched includes an adhesion enhancing material; forming a photoresist layer on the at least one layer to be etched; exposing the photoresist layer; and patterning the at least one layer to be etched using the exposed photoresist layer, wherein a carbon chain included in the adhesion enhancing material forms ether bonding (R—O—R) with a hydrophilic group formed on the surface of the stretchable substrate.

Flexible electrical devices comprising electrode layers on softening polymers and methods of manufacturing such devices, including lift-off processes for forming electrodes on softening polymers, processes for forming devices with a patterned double softening polymer layer, and solder reflow processes for forming electrical contacts on softening polymers.

In a method of manufacturing a printed wiring board with a pattern formed using a printing process, a pattern of a portion requiring position accuracy can be accurately formed at a predetermined position.

A method of manufacturing a printed wiring board 10 according to the present invention includes preparing a laminated board 12 including a metal layer 16 formed on a surface of a base material 14, forming a first etching resist layer 20a by printing a pattern of a portion 18a requiring position accuracy on the metal layer of the laminated board using a metal mask 32, forming a second etching resist layer 20b by printing a pattern of a portion 18b other than the portion requiring position accuracy on the metal layer of the laminated board using a screen plate 34, removing, by etching, the metal layer of the laminated board where the first etching resist layer and the second etching resist layer are not formed, and stripping the first etching resist layer and the second etching resist layer.

A method of manufacturing a printed circuit board a includes preparing an insulating substrate on which a first metal layer is formed, stacking a resist laminate having a plurality of layers on the first metal layer, forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers, forming a second metal layer on the exposed portion of the first metal layer, removing the patterned resist laminate having the plurality of layers, and etching at least another portion of the first metal layer.