Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.

A method of forming solder paste on an object is provided. The method includes providing a multilayered stencil, each stencil layer having an aperture formed therethrough from a top surface of the respective stencil layer to a bottom surface of the stencil layer. The method also includes applying the stencil to a surface of the object. The method also includes filling a void space formed by a combination of the apertures in the stencil layers with solder paste. The method also includes removing the stencil layers in a sequential manner to leave the solder paste.

A method for producing a circuit board arrangement includes: providing a first circuit board substrate, providing a second circuit board substrate, arranged substantially planar-parallel to the first circuit board substrate, the first circuit board substrate having an underside and the second circuit board substrate having an upper face, the upper face and the underside being arranged opposite one another, providing first terminal contacts, applied to the underside of the first circuit board substrate, providing second terminal contacts, applied to the upper face of the second circuit board substrate, applying solder paste cylinders to the first terminal contacts, the solder paste cylinders applied to the first terminal contacts by a solder-paste application process with solder paste, the applied solder paste cylinders having in each case a solder-paste-cylinder upper face, and arranging the second terminal contacts of the second circuit board substrate on the solder-paste-cylinder upper faces of the solder paste cylinders.

To provide a screen plate that can allow printing accuracy to be improved. A screen plate comprising a plate frame and a screen gauze formed of warp and weft fibers each made of a synthetic fiber, wherein the screen gauze is stretched on the plate frame under application of a predetermined tensile force, and the thickness of the screen gauze stretched on the plate frame is 88% or less based on the thickness of the screen gauze under application of no tensile force.

A solder paste printer for which a pressing force of squeegee towards a stencil when spreading solder paste is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.

In a printing device, a second storage position is displaced from a first storage position so as to enable a moving member to move a second mask arranged in a second storage in a state in which a first mask is arranged in the first storage position by movement of the first mask from an operation position to the first storage position by the moving member.

Methods and devices that identify a silkscreen data file associated with a physical printed circuit board and use an image of the physical printed circuit board to display a virtual silkscreen over the image of the physical printed circuit board.

A tooling vacuum unit for a circuit board assembly machine, such as a printing machine, which enables two different vacuum sources to be connected to tooling. The tooling vacuum unit may be a retrofittable unit configured to sit on top of a standard tooling table in the machine, or an integrated part of the machine, and provides a tooling support surface for a workpiece being machined. Also described are suction nozzles for securing a printing screen relative to the workpiece.

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

A storage device is used in a printing device includes a storage section having a transfer stage for loading and unloading the exchange target object to and from the printing section, the storage section being configured to accommodate multiple placement sections, each for placing the exchange target object, and to store the exchange target object, a placement section moving section configured to move any one of the placement sections to the transfer stage, and a target object moving section disposed on the transfer stage, the target object moving section being configured to move between a retracted position allowing the placement section to pass and an abutting position abutting against the exchange target object on the placement section and to move the exchange target object in a loading/unloading direction while abutting against the exchange target object at the abutting position.