A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.

Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for producing meander-line polarizers. In some implementations, a meander-line polarizer includes a dielectric substrate made of a polyester polymer material and meander-line arrays formed on a surface of the dielectric substrate. Each meander-line array includes a sequence of alternating perpendicular conductive traces that are formed the surface of the dielectric substrate by applying conductive ink to the surface of the dielectric substrate using a template that defines a location and dimensions of each conductive trace of each meander-line array.

A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.

A screen-printing screen for printing electrically conductive patterns on glass sheets, includes a main mask, the aperture size of the main mask being larger in a lateral portion than in the central portion, the screen furthermore including, in at least one double-mask zone, located in the central portion, at least one secondary mask fastened to a face of the main mask, the aperture size of the or each secondary mask being larger than the aperture size of the main mask in the central portion, and the mesh of the or each secondary mask making, with the mesh of the main mask, an angle α comprised between 1 and 89°.

An alignment system for a workpiece printing machine comprises a stencil support and a workpiece support, and a planarity control mechanism having at least two actuators arranged to effect relative rotation of the stencil support and workpiece support about both the horizontal axes.

A method for applying at least one electronic component to a surface is described. The method includes placing a component stencil on a support. At least one electronic component is arranged in a corresponding opening of the component stencil with a top surface of the electronic component on the support. A contact material stencil is positioned on the component stencil such that at least one opening in the contact material stencil is over a corresponding contact region on the bottom surface of the at least one electronic component. A contact material is applied on the at least one contact region of the at least one electronic component within the corresponding opening of the contact material stencil. The contact material stencil is removed from the component stencil. The component stencil is removed from the support. The at least one electronic component is applied to the surface.

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

A framed stencil for surface mount technology (SMT) is provided. The frame assembly includes a frame member and a binding insert. The frame member includes an inner perimeter portion and an outer perimeter portion that cooperates with the inner perimeter portion to define an elongated channel. The outer perimeter portion includes a first cantilever portion that extends over the elongated channel and towards the inner perimeter portion. The binding insert is configured for releasable insertion into the elongated channel. The binding insert includes a base and a tongue. The base configured to interface with a mesh substrate to facilitate coupling therebetween. The tongue is coupled to the base and extends substantially horizontally from the base. When the binding insert is inserted into the elongated channel, the tongue extending beneath the first cantilever portion to facilitate retention of the binding insert to the frame member. Methods are also provided.

A process for producing a structured surface, in which a composition comprising nanowires is applied to a surface and structured, especially by partial displacement of the composition. When the solvent is removed, the nanowires aggregate to form structures. These may be transparent and also conductive.