Apparatuses and systems associated with a server rack to hold a plurality of rack components may include a cabinet having a front opening of width W, and a first mounting pole and a second mounting pole located parallel to each other at the front opening to facilitate receipt and to hold the plurality of rack components. The server rack may further include the first and second mounting poles having a spacing of x inches or centimeters from each other, with the mid-point of the spacing being offset from the mid-point of width W, that defines a first mounting space to receive a first subset of the rack components in a first orientation and a second mounting space to receive a second subset of the rack components in a second orientation that differs from the first orientation. Other embodiments may be described and/or claimed.

Embodiments of systems, devices, and methods relate to a modular diagnostics interface system. An example modular diagnostics interface system includes one or more insertable measurement boards configured to communicably couple with a backplane of a modular measurement rack, and configured to collect a measured current from a component of a beamline.

An electronic module carrier in one embodiment comprises a carrier housing having a front portion and a rear portion, and a plurality of sub-carriers configured for separate insertion into and removal from respective sub-carrier slots in the front portion of the carrier housing. Each of the sub-carriers is configured to support at least one non-volatile memory module. The electronic module carrier is configured with a designated standard form factor for insertion into and removal from a carrier slot in a front portion of an electronic equipment chassis. For example, the standard form factor may be a 2.5 storage drive form factor. The non-volatile memory modules may comprise respective flash drives or other types of non-volatile memory modules implemented using an M.2 form factor.

A modular equipment chassis for an electronic equipment rack is disclosed. The modular equipment chassis can include a first top support, a first bottom support, a first side member, a second side member, and a first guide rail. The first side member can be coupled to a first end of each of the first top support and the first bottom support. The second side member can be coupled to an opposite second end of each of the first top support and the first bottom support. The first guide rail can be coupled with at least one of the first top support and the first bottom support at one or more of the mount locations, and the first guide rail can be configured to receive and retain at least a portion of a first electronic appliance mount.

A flow-through card rail module is provided in a circuit module chassis assembly for an embedded computing system. A set of elongated guide rails are formed on a base plate and define a card channel for receiving a circuit card. Each guide rail has a cooling passage extending from a fluid inlet to a fluid outlet. A corrugated structure is formed on an opposite side of the base plate and includes a set of elongated cells. Each elongated cell has a cooling passage formed therein extending from the fluid inlet to the fluid outlet. Internal walls subdivide the cooling passages formed in the guide rails and the elongated cells to form a honeycomb structure. The flow-through card rail module including the base plate, the guide rails and the corrugated structure may be formed as a monolithic component.

A flow-through card rail module is provided in a circuit module chassis assembly for an embedded computing system. A set of elongated guide rails are formed on a base plate and define a card channel for receiving a circuit card. Each guide rail has a cooling passage extending from a fluid inlet to a fluid outlet. A corrugated structure is formed on an opposite side of the base plate and includes a set of elongated cells. Each elongated cell has a cooling passage formed therein extending from the fluid inlet to the fluid outlet. Internal walls subdivide the cooling passages formed in the guide rails and the elongated cells to form a honeycomb structure. The flow-through card rail module including the base plate, the guide rails and the corrugated structure may be formed as a monolithic component.

A gravimetric measuring system (10), includes a balance (12) with a weighing chamber (22) surrounded by a weighing chamber wall (23, 24, 26, 28); an electromechanical weighing system (181); an electronic control apparatus (36) for controlling the system operation according to algorithms stored in a memory (363) thereof; and a plurality of functional modules (14, 16) configured to be inserted into module receptacles (283) arranged on the weighing chamber wall (28). Each module receptacle (283) has a device-side identification interface component (30a); and each functional module has a corresponding module-side identification interface component (30b). The control apparatus (36) identifies each functional module (14, 16) inserted into a module receptacle (283), through interaction between the respective device-side and module-side identification interface components (30a, 30b) and selects one of a plurality of operating routines according to algorithms stored in the memory.

An example adapter assembly may comprise an adapter cage to removably mount to a riser board of a computer system. Further, the example adapter assembly may comprise an adapter board disposed on the adapter cage, wherein the adapter cage is to receive multiple computer components, and the adapter board is to engage with the multiple computer components.

An electronic device capable of being configured flexibly with modules of different specifications includes: a main body having a slot opening formed at the front of the main body and communicated with a slot space in the main body, slot rails disposed on at least one sidewall of the slot space of the main body and module slots communicated with the slot rails respectively; and a modular device, including electronic modules, each having at least one module rail slidably coupled to the slot rail. The module slots in the slot space are configured to be corresponsive to the module spaces respectively, and the module spaces serve as plug-in spaces for installing the electronic module and the module spaces are communicated with one another. The electronic device provides module application spaces for multifunctional applications and installing and applying modules of different specifications flexibly.

A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.