An image capturing apparatus includes an image capturing element, a first circuit board to mount the image capturing element on the first circuit board, a second circuit board facing the first circuit board, a fan, and a first flexible board electrically connect the first circuit board and the second circuit board. The image capturing element moves within a movable range in a direction different from an optical axis direction. The first flexible board is bent in an area that overlaps with the movable range of the image capturing element in the optical axis direction. When viewed from a direction orthogonal to an optical axis, an orientation of an exhaust opening of the fan is arranged toward an inner surface of a bending portion of the first flexible board closest to the first circuit board at a center position of the movable range of the image capturing element.

A heat sink for cooling at least one power electronics device in a coil unit includes a base plate having a first portion and a second portion. The second portion is arranged vertically beneath the first portion. A plurality of fins extends from a surface of the base plate. The plurality of fins is located at the second portion of the base plate. A height of the plurality of fins measured perpendicular to the surface varies across a width of the base plate.

A heat sink for cooling at least one power electronics device in a coil unit includes a base plate having a first surface and a plurality of fins extending from the first surface. A height of the plurality of fins measured perpendicular to the first surface varies across a width of the base plate.

A system and method for maintaining a temperature of a power system using a cooling system that includes an impeller and a phase change material. During normal operation of the cooling system, heat that is generated by the operation of an electronic device(s) of the power system can be transferred primarily by conduction through an upper base plate and fins of a heat sink, and dissipated via forced convection that is generated by the impeller. Additionally, the phase change material is positioned outside of a main heat flux path of the heat sink such that, during normal operation of the cooling system, the phase change material does not provide a heat flux obstruction. In the event of an impeller failure, the phase change material provides at least a temporary cooling source for an extended period of time via the relatively large latent heat capacity of the phase change material.

A heat dissipation assembly can be applied to the electronic device. By providing a heat dissipation fan and a temperature sensor for the heat dissipation assembly, and arranging the heat dissipation assembly in an accommodation space defined by a processor cover plate and a control mainboard, the heat dissipation fan can improve a heat dissipation effect on the processor by utilizing air flow generated by the heat dissipation fan in the accommodation space in cooperation with heat dissipation openings in the processor cover plate.

Embodiments of an enclosure assembly to enhance cooling of a hydraulic fracturing direct drive unit (DDU) during operation are included. The enclosure assembly may include an enclosure body extending at least partially around an enclosure space to house the DDU for driving a fluid pump. The enclosure assembly may include one or more heat exchanger assemblies connected to the enclosure body for cooling a process fluid associated with one or more of the DDU and the fluid pump, and which may be configured to draw air into the enclosure space from and external environment, toward one or more radiator assemblies to cool the process fluid, and along an airflow path through the enclosure space. One or more outlet fan assemblies may be operative to discharge air from the enclosure space to the external environment to maintain a desired temperature of the enclosure space.

Liquid-cooled notebook computer and power supply device thereof, includes a power supply line set including AC power supply line, transformer device set in adapter and electrically connected to AC power supply line and DC power supply line electrically connected to the other side of transformer device, a water cooling device installed in adapter, and a notebook computer with infusion inlet and infusion outlet thereof respectively connected to water outlet and water inlet of water cooling device. The infusion inlet and the infusion outlet are connected to the internal chip surface of notebook computer through infusion pipeline, and a heat conduction source is attached to the chip surface. After the water pump in water cooling device is actuated, the heat conduction source transports the heat generated by the chip from the notebook computer to water cooling device for circulating exchange of cold and hot liquids for heat dissipation.

Embodiments of an enclosure assembly to enhance cooling of a hydraulic fracturing direct drive unit (DDU) during operation are included. The enclosure assembly may include an enclosure body extending at least partially around an enclosure space to house the DDU for driving a fluid pump. The enclosure assembly may include one or more heat exchanger assemblies connected to the enclosure body for cooling a process fluid associated with one or more of the DDU and the fluid pump, and which may be configured to draw air into the enclosure space from and external environment, toward one or more radiator assemblies to cool the process fluid, and along an airflow path through the enclosure space. One or more outlet fan assemblies may be operative to discharge air from the enclosure space to the external environment to maintain a desired temperature of the enclosure space.

An energy storage system may include a battery pack having a plurality of battery cells, a power converter, a pump which supplies a fluid to the battery pack or the power converter, a radiator which heat-exchanges the fluid flowing by the pump with air, a first valve which sends a fluid discharged from the pump to the power converter or the battery pack, and a second valve which sends the fluid discharged from the power converter to the battery pack or the radiator.

A panelboard assembly for a harsh and/or hazardous environment is provided. The panelboard assembly includes a core assembly. The core assembly includes a main breaker assembly configured to be electrically connected to a power supply, and a branch breaker assembly electrically connected to the main breaker assembly and configured to be electrically connected to one or more loads, and a power distribution heatsink assembly. The power distribution heatsink assembly includes an electrically-conductive heatsink having a first end and an opposing second end, the first end electrically connected to the core assembly and an electrically-nonconductive isolator electrically insulating the heatsink.