A heat dissipation apparatus includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base. The first surface and the second surface are disposed opposite to each other. A pressing plate is configured to fasten the heat-conducting plate in the accommodation cavity. The pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, and the sealing cavity is configured to accommodate the liquid channel A liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.

An electronic module assembly includes a circuit card assembly (CCA) with heat generating electronic components. A connector is electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA, connected in thermal communication with the electronic components. An undulating channel feature is defined along a lateral edge of the heatsink relative to the connector. One or more channels of the undulating channel feature are aligned with an insertion axis defined by the connector.

A method of maintaining a server rack within a predetermined temperature range, including the removal of heat from the server rack by both conductive and convective heat transfer. Thermal contact structure is placed between the server rack and a heat sink. The heat sink may be in the form of a housing containing a radiator in one wall, and a bank of fans in an opposite wall to draw a coolant gas through the radiator. The coolant gas contacts the heat sink and a portion of the coolant gas is directed towards the server rack. Cooling liquid is supplied to the radiator by a chiller, which can be adjacent to the heat sink or located remotely from the heat sink.

A system includes a pair of chassis, a housing, and a cooling module. Each chassis including multiple rails with adjacent rails defining card slots. The housing connected to the chassis in first card slots on the pair of chassis and formed to contain electronic components including a heat generating component. The cooling module connected to the chassis in second card slots on the pair of chassis and formed to contact the heat generating component through an aperture in the housing.

Phased array antennas, such as a multi-function aperture, are limited in performance and reliability by traditional air-cooled thermal management systems. A fuel-cooled multi-function aperture passes engine fuel through channels within the ribs of the multi-function aperture to provide better heat transfer than can be achieved through air cooled systems. The increased heat transfer and thermal management results in a multi-function aperture with improved performance and reliability.

A cooling system including a cooling unit that cools a heat-generating component; a supply connection tube that is connected to the cooling unit and that supplies a cooling medium to the cooling unit; and a discharge connection tube that is connected to the cooling unit and that discharges the cooling medium from the cooling unit, wherein the supply connection tube and the discharge connection tube have different lengths.

An apparatus and method relating to a cooling adapter having a housing with at least one mounting aperture and including at least one cooling manifold comprising an inlet plenum having at least one inlet for entry of a cooling fluid, an outlet plenum having at least one outlet for exhausting the cooling fluid, and a plurality of channels disposed between the inlet channel and the outlet channel for allowing the cooling fluid to move therebetween.

Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.

An electronic rack includes an array of server shelves inserted into at least some of a plurality of standard slots of the electronic rack. Each server shelf contains one or more servers and each server includes one or more processors. At least some of the processors are mounted on cold plates for liquid cooling. The electronic rack further includes a liquid manifold shelf inserted into one of the standard slots. The liquid manifold shelf includes a pair of an upstream supply port and an upstream return port and further includes one or more pairs of a downstream inlet port and a downstream outlet port. The upstream supply port is coupled to a facility liquid supply line to receive cooling liquid from an external cooling liquid source and the upstream return port to return the cooling liquid back to the external cooling liquid source. At least some of the pairs of the downstream inlet port and downstream outlet port are coupled to the cold plates of some of the server shelves to circulate the cooling liquid to provide liquid cooling to the corresponding processors. A multifunction sectional pipes are assembled for connecting the fluid loops.

A heat exchanger for cooling a component includes a heat transfer chamber containing a heated substance having a first density and a liquid coolant having a second density. The heat exchanger can also include a circulation circuit that recirculates the heated substance through the heat transfer chamber for mixing with the liquid coolant.