Various teachings of the present disclosure include a switchgear cabinet for power electronics. An example cabinet may include a cooling apparatus for cooling the power electronics including a main cooling circuit and a secondary cooling circuit for a cooling medium. The secondary cooling circuit includes a heat exchanger arranged on a rear wall and/or between rails of the switchgear cabinet.

A rack mounted cooling system operable to cool a computing system is provided. The rack mounted cooling system includes a pump unit operable to pump fluid and a plurality of heat exchangers. The heat exchangers include an input heat exchanger and an outlet heat exchanger. The input heat exchanger is operable to receive the fluid from the pump unit, lower a temperature of the fluid, and provide the fluid to a liquid cooled computing unit. The outlet heat exchanger is operable to receive the fluid from the liquid cooled computing unit, lower the temperature of the fluid, and provide the fluid to the pump unit. The heat exchangers are operable to be coupled to a rack of the computing system such that the rack with the plurality of heat exchangers fits within a rack keep in area.

A high power RF or microwave amplifier may amplify an RF or microwave input signal. The high power RF or microwave amplifier may include an input signal divider (DIV) that has an input port that receives the RF or microwave input signal and that divides this input signal into multiple sub-input signals; multiple power amplifier units (PAUs), each having an input port that receives an RF or microwave signal, an output port that delivers an amplified version of the received RF or microwave signal, and an interface port; an interface control unit (ICU) that communicates with each PAU through its interface port; and an output signal switching combiner unit (SCU) that coherently sums the outputs of the on-line PAUs and delivers this to an output port. The ICU may set one or more of the PAUs to amplify one of the multiple sub-input signals (hereinafter referred to as on-line PAU in on-line mode); monitor each on-line PAU to verify that it is operating within one or more pre-determined PAU specifications; and upon detecting that one of the on-line PAUs is no longer operating within the one or more pre-determined PAU specifications (malfunctioning PAU), set the malfunctioning PAU not to amplify one of the multiple sub-input signals and not to be available to be switched to the on-line mode by the ICU (hereinafter referred to as off-line PAU in off-line mode).

Cooled electronic circuitry may include multiple and substantially parallel circuitry surfaces, each containing power amplifier circuitry, having a side edge, and includes material between at least a portion of the base plate and the side edge that provides a level of thermal conductivity of at least 167 W/m-k; and a cooling plate having a flat surface attached to each of the side edges of the circuitry surfaces in a thermally-conductive manner.

Embodiments of the invention provide a system and method for housing electrical components of a high-density liquid cooling unit to liquid cool electrical components. The system includes a first electrical cabinet housing at least one electrical switch and a controller. The first electrical cabinet is swingable outward to open, and the first electrical cabinet opens while the high density liquid cooling system continues to operate to liquid cool electrical components. The system includes a second electrical cabinet housing a first motor drive and a second motor drive. The second electrical cabinet is accessible when the first electrical cabinet swings outward. One of the first motor drive and the second motor drive are replaceable while the high density liquid cooling unit continues to operate.

A mounting assembly is provided for mounting a liquid cooling adaptor manifold to a server rack. The mounting assembly includes the liquid cooling adaptor, a mounting adaptor, and a mounting bracket. The liquid cooling adaptor provides a cooling liquid from a source via first connectors of a first type to a device via second connectors of a second type. The mounting adaptor is affixed to the liquid cooling adaptor manifold and to the mounting bracket. The mounting bracket is affixed to a side wall of a server rack.

Embodiments of the invention provide a system and method for housing electrical components of a high-density liquid cooling unit to liquid cool electrical components. The system includes a first electrical cabinet housing at least one electrical switch and a controller. The first electrical cabinet is swingable outward to open, and the first electrical cabinet opens while the high density liquid cooling system continues to operate to liquid cool electrical components. The system includes a second electrical cabinet housing a first motor drive and a second motor drive. The second electrical cabinet is accessible when the first electrical cabinet swings outward. One of the first motor drive and the second motor drive are replaceable while the high density liquid cooling unit continues to operate.

A liquid cooling system for cooling heating units each having an identical cooling flow channel includes a cooling liquid circulating supply device which is provided with a liquid supply port and a liquid return port and a pipeline system which includes a liquid supply pipe, a liquid return pipe, and a flow distribution subsystem. One end of the liquid supply pipe communicates with the liquid supply port, and the other end is connected to the flow distribution subsystem at a total flow distribution end. One end of the liquid return pipe communicates with the liquid return port, and the other end is connected to the flow distribution subsystem at a total liquid collection end. The flow distribution subsystem connects the total flow distribution end and the liquid inlet of each heating unit and connects the total liquid collection end and the liquid outlet of each heating unit.

A liquid cooling device for cooling at least one target component that includes: a base member to be in thermal contact with the at least one target component to be cooled by the liquid cooling device, the base member including a lower surface configured to be placed in contact with the at least one target component, the base member defining a plurality of pockets spaced apart from one another on an upper side thereof and defining a plurality of fluid conduits configured to internally circulate a cooling liquid therethrough. Each of the plurality of pockets arranged to accommodate a corresponding fluid conduit and an interconnecting channel defined by the base member and extending between two neighboring pockets of the plurality of pockets for distributing the cooling fluid from the fluid conduit of one pocket to the fluid conduit of a neighboring pocket.

Embodiments of the invention provide a high density liquid cooling system and various monitoring and control methods. Some methods include calculating a heat transfer efficiency of a heat exchanger based on a temperature difference and calculating a total heat rejection value based on the heat transfer efficiency. Some methods include increasing a secondary flow rate in a secondary coolant loop as a maximum allowable pressure is approached to extend an operating time period and avoid thermal shut down of the high density liquid cooling system.