A flow-through card rail module is provided in a circuit module chassis assembly for an embedded computing system. A set of elongated guide rails are formed on a base plate and define a card channel for receiving a circuit card. Each guide rail has a cooling passage extending from a fluid inlet to a fluid outlet. A corrugated structure is formed on an opposite side of the base plate and includes a set of elongated cells. Each elongated cell has a cooling passage formed therein extending from the fluid inlet to the fluid outlet. Internal walls subdivide the cooling passages formed in the guide rails and the elongated cells to form a honeycomb structure. The flow-through card rail module including the base plate, the guide rails and the corrugated structure may be formed as a monolithic component.

An electronic system includes a chassis. The chassis includes a first endwall, a second endwall, and a sidewall. The electronic system also includes at least one circuit card cartridge coupled to the chassis. The at least one circuit card cartridge is positioned between the first endwall and the second endwall. The at least one circuit card cartridge includes a printed circuit board including a first surface and at least one electronic component. The at least one electronic component is mounted on the first surface. The at least one circuit card cartridge further includes at least one heat transfer assembly coupled to the printed circuit board. The at least one heat transfer assembly is configured to contact the at least one electronic component and extend adjacent the printed circuit board across the first surface.

A flow-through card rail module is provided in a circuit module chassis assembly for an embedded computing system. A set of elongated guide rails are formed on a base plate and define a card channel for receiving a circuit card. Each guide rail has a cooling passage extending from a fluid inlet to a fluid outlet. A corrugated structure is formed on an opposite side of the base plate and includes a set of elongated cells. Each elongated cell has a cooling passage formed therein extending from the fluid inlet to the fluid outlet. Internal walls subdivide the cooling passages formed in the guide rails and the elongated cells to form a honeycomb structure. The flow-through card rail module including the base plate, the guide rails and the corrugated structure may be formed as a monolithic component.

A device for cooling electronic boards grouped together in an electronic unit. The principle is that of providing at least one distinct cooling board that is introduced into the unit in place of one or more electronic board(s). The manufacture, use and maintenance of such a cooling device are thereby greatly optimized.

According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

A wickless heat pipe including a first tube and a second tube. The first tube may form a first shape extending longitudinally in a first direction. The second tube may form a second shape extending longitudinally in a second direction different from the first direction. The first tube and the second tube intersect at at least one location. The two tubes may intersect at a right angle or an oblique angle. The first and second tube may intersect at a plurality of locations. The tubes may be formed from a metal plate used as a thermal ground plane.

A system may include a removable board that is adapted for inserting into and removing from an enclosure, an electronic component that is attached to the removable board, and a cooling system that is attached to the removable board. The cooling system may include a first heat exchanger that is attached to the electronic component by a physical interface. The cooling system may include a coolant pipe that that is at least partially filled with a working fluid to receive heat, generated by the electronic component, via the first heat exchanger. The cooling system may include a second heat exchanger, attached to the coolant pipe and situated to be located outside of the enclosure when the removable board is inserted into the enclosure. The cooling system may be adapted to remain attached to the removable board when inserting and removing the removable board.

An electronic system includes a chassis. The chassis includes a first endwall, a second endwall, and a sidewall. The electronic system also includes at least one circuit card cartridge coupled to the chassis. The at least one circuit card cartridge is positioned between the first endwall and the second endwall. The at least one circuit card cartridge includes a printed circuit board including a first surface and at least one electronic component. The at least one electronic component is mounted on the first surface. The at least one circuit card cartridge further includes at least one heat transfer assembly coupled to the printed circuit board. The at least one heat transfer assembly is configured to contact the at least one electronic component and extend adjacent the printed circuit board across the first surface.

An example device in accordance with an aspect of the present disclosure includes a sensor, a controller, and an injector. The sensor is to provide sensor output regarding fluid chemistry of a fluid of a cooling system. The controller is to identify attributes of the fluid. The injector is to inject at least one additive into the fluid to bring at least one attribute into a threshold range.

A two-phase immersion cooling system can include a pressure vessel with one or more processors, a two-phase refrigerant, and one or more condenser tubes within the vessel. The refrigerant can flow past the processor(s) by thermosyphon. The refrigerant can be configured to extract heat from the processor(s). In at least one embodiment, a liquid phase of the refrigerant can fully, or at least partially, cover the processor(s). The condenser tube(s) can be configured to receive cooling fluid into and transmit cooling fluid out of the vessel, thereby removing heat from the vessel.