One or both of a module cover and a heat sink for a circuit card module includes a multi-level cooling structure formed by a body, sidewalls extending from edges of the body and, together with the body, partially enclosing a volume, flanges projecting from ends of the sidewalls opposite the body and away from the volume, and an oscillating heat pipe within the body, the sidewalls, and the flanges. The oscillating heat pipe fluid path repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges. The oscillating heat pipe provides cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between an evaporator adjacent a first of the flanges and a condenser adjacent a second of the flanges.

A current converter apparatus includes a multi-phase current converter having current-converter modules for each phase that are electrically connected to one another and arranged in a current-converter cabinet. Each current-converter module has at least one semiconductor component arranged on a heat sink and includes just two semiconductor components connected to each other and connected to be controlled by a control component. The current-converter modules in the current-converter cabinet are arranged so that the current-converter modules of each current-converter phase form a horizontal row of modules arranged one beside the other and the rows are arranged vertically one above the other.

According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

One or both of a module cover and a heat sink for a circuit card module includes a multi-level cooling structure formed by a body, sidewalls extending from edges of the body and, together with the body, partially enclosing a volume, flanges projecting from ends of the sidewalls opposite the body and away from the volume, and an oscillating heat pipe within the body, the sidewalls, and the flanges. The oscillating heat pipe fluid path repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges. The oscillating heat pipe provides cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between an evaporator adjacent a first of the flanges and a condenser adjacent a second of the flanges.

A system, including a first pipeline and a second pipeline, where the first pipeline includes a first steam pipe, a first liquid pipe, and an evaporation section connected between the first steam pipe and the first liquid pipe, and the second pipeline includes a second steam pipe, a second liquid pipe, and a heat exchanger connected between the second steam pipe and the second liquid pipe. Two pairs of quick connectors are respectively connected between the first steam pipe and the second steam pipe and between the first liquid pipe and the second liquid pipe. The loop heat pipe includes a valve and a nozzle that are configured for vacuum pumping. Refrigerant is provided inside the loop heat pipe. A capillary structure is provided inside the evaporation section to provide a capillary suction force to enable the refrigerant to circulate in the loop heat pipe.

According to one embodiment, a thermal management system is provided that includes at least one chassis frame configured to minimize a thermal spreading resistance of the thermal management system. The chassis frame included at least one chassis body, at least one thermal skeleton embedded into the chassis body, and a working fluid contained within the thermal skeleton and used to dissipate heat from the chassis body.

In accordance with one aspect of the invention, a thermal management system for electronics includes a vapor chamber that at least partially envelops the electronics, a working fluid contained within the vapor chamber and used to dissipate heat from a part of a heated portion of the electronics and a precision sintered 3D wick structure independently created on some of the interior of the vapor chamber. The precision sintered 3D wick structure transports the working fluid by capillary action from at least one working fluid receptacle to a part of the heated portion of the electronics. In one embodiment of the invention, the 3D vapor chamber may be formed by the additive manufacturing processes. A further example includes precision sintered 3D support structures integrated into the closed 3D vapor chamber. The support structures mainly facilitate to support the 3D closed vapor chamber envelope from collapsing during operation, and add overall structural strength and additionally facilitate transfer of liquids and gas through their internal 3D porous zones.

An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.

A thermosiphon system includes a condenser and an evaporator fluidly coupled to the condenser by a condensate line. The evaporator includes a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a working fluid from the condensate line onto a portion of the wick

The present disclosure relates to a cold plate and vapor chamber for conduction cooling of one or more printed circuit boards in a printed circuit board (PCB) enclosure. The cold plate may include a planar surface at an oblique angle relative to an axis along which the PCB assembly is inserted into the enclosure. The PCB assembly may include a vapor chamber having a complementary obliquely angled surface. The complementary angled surfaces of the cold plate and vapor chamber may exert forces against each other upon insertion of the printed circuit board assembly into the enclosure and contact between the cold plate and vapor chamber.