A container for one or more electronic devices is provided with a heat exchanger usable in extreme conditions to keep the contained electronic device(s) within a desired temperature range. The container has an external enclosure, insulation, an interior enclosure, and a heat exchanger. The electronic devices or components can be a board, a card or other type of electronic component, and they are contained within the interior enclosure. The interior enclosure is filled with a dielectric fluid. The heat exchanger is a passive heat exchanger and can be made of heat pipes. The heat exchanger has a first section within the interior enclosure and a second section exterior of the interior enclosure. Heat is drawn out of the interior enclosure through the interior enclosure shell and via the heat exchanger. Any water within the interior enclosure falls to the bottom of the interior enclosure.

An optical module includes a processor and light engines on a substrate and a heat sink in thermal communication with the processor and the light engines. The light engines are configured to transmit and receive optical data and are disposed at different locations around the processor on the substrate. The processor is configured to control each of the plurality of light engines. During operation, each of the processor and the light engines is operable to generate a different amount of heat relative to each other as the optical data is transmitted and received. The heatsink comprises a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove, from the substrate, the different amounts of the heat generated by the processor and each of the plurality of light engines.

According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

The present system provides an improved architecture for cooling server cabinets as well as adapting operations based on dynamic energy costs. The system utilizes a small oil-free compressor, which is distributed on the top of the cabinet, reducing the distance from the evaporator outlet to the compressor suction port, and combines phase change energy storage material and free cooling control technology to achieve further energy-saving effects. The technical scheme adopted by the invention to solve the technical problem is an oil-free direct-expansion cooled communication cabinet, characterized in that it is comprised of an oil-free compressor, with at least one condenser and one evaporator, a throttling device, a gas-liquid separation device, and a communication cabinet. The system stores cold capacity when energy costs are low and releases stored cold capacity when energy costs are high.

Systems and methods for providing an electronic cooling apparatus comprising a chassis having an internal space that is sized/shaped to receive/structurally support circuit card(s). The internal space defined by sidewalls with a channel formed therein in which a coolant is disposed. The coolant is in thermal communication with the circuit card(s) via the sidewall(s) when the circuit card(s) is(are) disposed in the chassis. A refrigerant-based cooling system is disposed in the chassis and comprises an evaporator having inlet/outlet ports coupled to the channel of the chassis to define a first closed-loop channel for the coolant within the chassis. The evaporator facilitates heat transfer from the coolant to a refrigerant flowing through a second closed-loop channel of the chassis at least partially defined by the evaporator. A pump is disposed in the chassis and configured to cause the coolant to flow through the first closed-loop channel.