An electronic assembly includes a printed circuit board (PCB) and an electromagnetic interference (EMI) shield. The PCB includes a plurality of electronic components and a plurality of electrically-conductive traces. The EMI shield is sized and shaped to form a perimeter around at least one of the plurality of electronic components on the PCB. The plurality of electrically-conductive traces cross the perimeter formed by the EMI shield. The EMI shield includes a plurality of decoupling, filtering, or matching components electrically connected between the EMI shield and the plurality of electrically-conductive traces such that the plurality of decoupling, filtering, or matching components are configured to shunt signal noise from the plurality of electrically-conductive traces. The EMI shield is electrically connected to the PCB via the plurality of decoupling, filtering, or matching components to encapsulate and electromagnetically isolate the plurality of electronic components.

A shielding cover is provided. The shielding cover is adapted to be disposed on a circuit board and covers at least one electronic element. The shielding cover includes a cover body and a first spacer. The cover body includes a top sheet and a plurality of sidewalls, wherein a plurality of sidewall connecting portions are formed on the sidewalls. The first spacer includes a first spacer body, a first connection portion and a second connection portion, wherein the first connection portion and the second connection portion are formed on two ends of the first spacer body, and the first connection portion and the second connection portion are detachably connected to the sidewall connecting portions.

A wireless communication module with improved performance and a mobile object that is equipped with the wireless communication module with the improved performance are provided. The mobile object is equipped with a wireless communication module. The wireless communication module includes a substrate, a first element, and a second element. The substrate includes ground layers. The first element is arranged on the substrate and amplifies an input RF signal. The second element is arranged on the substrate and different from the first element. Each of the ground layers has a groove formed between the first element and the second element.

In embodiments, a device may include a single electromagnetic interference (EMI) shield plate that defines an enclosed area. The EMI shield plate may have an inner surface and an outer surface opposite the inner surface. The device may further include a first printed circuit board (PCB) coupled with the inner surface, wherein the first PCB is within the enclosed area. Other embodiments may be described and/or claimed.

A shield assembly can enclose an electronic component in a chamber of a mobile communication device. The shield assembly can include a chassis having a slot and a conductive rail adjacent to the slot. A covering can be mounted over the electronic component and coupled to the chassis via a spring contact disposed in the slot. The covering can include a shield element configured to cover a chamber enclosing the electronic component. The covering can further include a first tab connected to the shield element, and a second tab connected to the shield element and spaced apart from the first tab by a gap. A spring contact can be disposed in the gap and electrically connected to the shield element via at least one of the first tab and the second tab.

A charging apparatus (2) for a vehicle (1) has a power section (3) and a control signal interface (4) for connecting control signals (102) to the power section (3). A filter circuit (5), in particular an EMC filter circuit, is arranged between the power section (3) and the control signal interface (4). A vehicle (1) having such a charging apparatus (2) also is provided.

An electrical device (1) is provided, comprising an electrical high-frequency filter (9) and a shield (6) separating the filter from at least one further electrical component (9, 13) of the device, a signal conductor (17) which operably connects the filter (9) to the further component (9, 13) and traverses the shield (6) for transmitting a signal from the filter (9) to the component (9, 13) and a feedthrough capacitor system (19) being electrically arranged between the signal conductor (17) and the shield (6). The feedthrough capacitor system (19) comprises, in particular being formed essentially by, a plurality of surface mount capacitors (41) electrically arranged between the signal conductor (17) and the shield (6), the surface mount capacitors (41) in particular being surface mounted on a circuit board (11), which may be a printed circuit board.

A modular remote radio unit assembly that has a frame assembly, electrical components coupled to the frame assembly and configured to provide wireless data transfer, and a single power input for the electrical components. Wherein, when the power input is coupled to a power source, the electrical components are powered to provide wireless data transfer.

A housing and an electronic apparatus having the housing are disclosed. The housing includes a shielding component and an insulating component fixedly connected with the shielding component; the insulating part is configured to arrange an antenna.

A shield assembly can enclose an electronic component in a chamber of a mobile communication device. The shield assembly can include a chassis having a slot and a conductive rail adjacent to the slot. A covering can be mounted over the electronic component and coupled to the chassis via a spring contact disposed in the slot. The covering can include a shield element configured to cover a chamber enclosing the electronic component. The covering can further include a first tab connected to the shield element, and a second tab connected to the shield element and spaced apart from the first tab by a gap. A spring contact can be disposed in the gap and electrically connected to the shield element via at least one of the first tab and the second tab.