A modular system for containing electronic components has at least one storage bin and a plurality of Radio Frequency Interference (RFI) shielded electronics enclosures. Each RFI shielded electronics enclosure is at least one hollowed-out body; at least one hollowed-out cover, wherein the at least one hollowed-out cover is adapted to mate with the at least one hollowed-out body; and a plurality of fastening devices adapted to secure the at least one hollowed-out cover to the at least one hollowed-out body.

A first trench is formed in a first sealing resin layer, which seals first electronic components and second electronic components on one main surface of a circuit board, and a second trench is formed in a second sealing resin layer, which seals third electronic components and fourth electronic components on another main surface. The first trench is formed between the first electronic components and the second electronic components when viewed in plan view, extending from an upper surface of the first sealing resin layer toward a surface opposite from the one main surface of the first sealing resin layer, and the second trench is formed between the third electronic components and the fourth electronic components when viewed in plan view, extending from a lower surface of the second sealing resin layer toward a surface opposite from the other main surface of the second sealing resin layer.

A housing for a circuit assembly includes a housing interior chamber, an electromagnetic radiation-impermeable partition wall that divides the housing interior chamber into (a) a first housing interior chamber partial region configured to receive a first electrical component designed as a filter component and (b) a second housing interior chamber partial region configured to receive a second electrical component, an electromagnetic radiation-impermeable cover plate, and an electromagnetic radiation-impermeable housing section directly adjacent to the first housing interior chamber region. The partition wall, the cover plate, and the housing section enclose the first housing interior chamber partial region in three dimensions, creating a complete electromagnetic shielding of the first housing interior chamber partial region from the second housing interior chamber partial region. A circuit assembly having such a housing can be cost-effectively produced and has a reduced scope.

An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. The EMI shielding device is adopted to be mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.

An SFP transceiver with a die-casting metal housing and a metallic upper cover formed via sheet metal and assembled to the housing to commonly form therebetween a receiving cavity in which a printed circuit board assembly is received. The printed circuit board assembly includes an optical module with a lens structure, around a mating port, including a front face with a pair of tubular structures extending forwardly. A metallic EMI shielding device includes a plate with a pair of sleeves unitarily extending therefrom via a deep drawing method to cover the front face and the tubular structures, respectively. Each sleeve further includes a flange to cover a ring type front end face of the corresponding tubular structure in the front-to-back direction.

An electronic device is disclosed. The electronic device includes a casing that includes a first part and a second part. The electronic device also includes a shield part as well as a printed circuit board that is placed between the shield part and the first part of the casing. The electronic device also includes at least one connecting element that is connected to the printed circuit board. The connecting element includes a connecting head that cooperates with a complementary fastening means that is formed on the shield part so that the connecting element is fixed on the shield part.

A circuit board assembly for association with an aircraft includes a circuit board and an electromagnetic interference component connected to the circuit board. The circuit board assembly may further include an enclosure having an electromagnetic signal permissive layer and an electromagnetic signal blocking layer. The electromagnetic signal permissive layer may include a housing that define a volume. The housing may enclose the electromagnetic interference component on the circuit board. The electromagnetic signal blocking layer defines a conductive barrier about the electromagnetic interference component.

A shield can for an electronic eyewear device is described that reduces RF signals emanating from the electronic eyewear device. The shield can is attached to a ground plate of the electronic eyewear device using leaf springs on a side of the shield can. The leaf springs do not add to the stack-up thickness of the shield can assembly and provide a balanced force against the ground plate. The shield can is attached to a printed circuit board and encompasses radio frequency (RF) electronic components to prevent RF signals emanating from the RF electronic components. The leaf springs have a pair of fingers providing the balanced mechanical point force. A conductive pressure sensitive adhesive is also provided to secure a top surface of the shield can to the ground plate along with a thermal paste.

A walled structure surrounds a primary interference-generating component. The walled structure is configured to confine or shield substantially the electromagnetic interference within the one or more metallic walls or within a cavity formed by the one or more metallic walls and a metallic side of the first enclosure portion. A primary electrically conductive pedestal projects above a base of the first enclosure portion within the one or more metallic walls to facilitate contact between the primary electrically conductive pedestal and the primary interference-generating component to provide a viable or possible low impedance path to electrical ground for a portion of the electromagnetic interference within the one or more metallic walls.

An assembly includes a metallic housing, an electromagnetic (EM) device, and a bobbin in which the EM device is supported. The bobbin has a non-metallic, inner bobbin body, a non-metallic, outer bobbin body, and a metallic shield sandwiched between the inner and outer bobbin bodies. The EM device and the bobbin are mounted in the housing with the bobbin being between the EM device and the housing for heat from the EM device to thermally conduct through the inner and outer bobbin bodies and the shield to the housing while the shield shields noise of the EM device from the housing.