A radio frequency module includes a wiring substrate, a plurality of components mounted on an upper surface of the wiring substrate, a sealing resin layer laminated on the upper surface of the wiring substrate and covering the plurality of components, a groove formed in an upper surface of the sealing resin layer and extending between predetermined components of the plurality of components, and a shielding wall made of conductive paste in the groove. The sealing resin layer has a stepped area defining the higher portion and lower portion in the upper surface. The groove intersects the stepped area when the wiring substrate is seen in plan view.

Electromagnetic shields for sub-modules of electronic modules are disclosed. Electronic modules may include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged to conformally cover the sub-modules as well as portions of the substrate that are uncovered by the sub-modules. Electromagnetic shields are disclosed that are configured to extend between sub-modules to form one or more divider walls. The one or more divider walls may be configured to extend below mounting surfaces of electronic components in the sub-modules to provide improved reduction of electromagnetic interference (EMI) or crosstalk between various sub-modules. Electromagnetic shields are also disclosed that form perimeter sidewalls that extend below mounting surfaces of electronic components of sub-modules to provide improved reduction of EMI from other modules or other external sources.

An electronic device is disclosed. The electronic device includes a shield that provides thermal and electromagnetic interference (EMI) shielding benefits. The shield is secured with fan assemblies by airtight seals to prevent air leakage and promote a pressured volume when the fan assemblies are running. Further, the shield can direct airflow from the fan assemblies to one or more thermally conductive components, where the airflow can convectively cool the thermally conductive components and exit the electronic device. The shield is made from a metal, and when the shield covers a circuit board, the shield protects an EMI barrier for integrated circuits located on the circuit board. Moreover, the shield can provide a single-piece, monolithic body that provides advantages over multiple shields, such as eliminating gaps in the shield for air leakage and EMI intrusion, increasing air circulation efficiency, and decreasing costs.

A leakage of electromagnetic waves is suppressed effectively on the periphery of a heat radiating device. A heat radiating device (80) includes a plurality of fins (81) that are arranged on the inside of an opening (52a), a heat pipe (83) that includes a connecting portion (83a) being located between the plurality of fins (81) and a circuit board (50) and extending in a left-right direction along the circuit board (50), and a base plate (82) that supports the plurality of fins (81). The base plate (82) includes a plate left portion (82c). The plate left portion (82c) covers a lower surface of the heat pipe (83), the lower surface facing a side of a board shield (52), and closes a gap (G1) between a left end of the plurality of fins (81) and a left edge of the opening (52a) of the board shield (52).

An electrical device according to the present invention has a case (1), a metallic heat sink plate (4) disposed an opening portion (OP) of the case and a circuit board (5) arranged on the heat sink plate. The heat sink plate (4) is interposed between a capacitor (2) and the circuit board (5) so that the circuit board (5) is separated from the capacitor (2) by not only the resinous case (1) but also the metallic heat sink plate (4). Thus, electromagnetic space noise generated from the capacitor (2) is shielded or reduced by the metallic heat sink plate (4) whereby a malfunction of the circuit board (5) is prevented from occurring due to electromagnetic space noise generated from the capacitor (2).

In a method of manufacturing an electronic package, first grooves are formed on a circuit structure and a second groove is formed in each of the first grooves to allow the circuit structure to become circuit layers. Owing to the second groove is narrower than the first groove, each of the circuit layers has an encircled surface and a notch located on the encircled surface. When a shielding layer is provided to cover an encapsulating body located on the circuit layer, a space of the notch is not covered by the shielding layer such that a portion to be removed of the shielding layer will not remain on the electronic package to become burr after removing the portion to be removed.

A method for providing wireless telecommunications. The method includes providing a modular remote radio unit (RRU) capable of wirelessly transmitting data, placing the modular RRU on a boom truck with a boom arm, transporting the remote radio unit to a deployment location, setting the modular RRU on a structure at the deployment location by lifting the modular RRU off the boom truck with the boom arm, electrically coupling a power input of the modular RRU to a power source to power the modular RRU, and transmitting and receiving wireless data with the modular RRU unit after the power input is coupled to the power source.

An electronic component module includes: electronic components mounted on a substrate, each of the electronic components having terminals located on a side, upper, and/or lower surface thereof; and a shield that is located on the substrate, has side plates surrounding the electronic components, and is supplied with a ground potential, wherein in an electronic component closest to one side plate of the side plates among one or more electronic components, in each of which at least one terminal of the terminals is located on the side and/or upper surface, a terminal a first distance of which to the one side plate is shortest among the at least one terminal is a first terminal supplied with the ground potential, and a second distance each of second terminals not supplied with the ground potential to the one side plate is greater than the first distance.

Techniques and apparatuses directed to component shielding are described in this document. A first aspect relates to a system including a printed circuit board (PCB) oriented along a first plane, a device on the PCB, and a component shield having a wall structure oriented perpendicular to the first plane and a cover structure connected to the wall structure. The system includes a housing structure oriented along a second plane that is substantially parallel to the first plane. The first and second planes define a shielded space within which the component shield and the device reside. The system further includes a shielding layer residing at least partially between the cover and housing structures. The shielding layer has an irregular cross-section along a fourth plane perpendicular to at least one of the first or second planes and a third plane. The irregular cross-section includes a protrusion that extends from the third plane.

A surge protection circuit for an electronic device such as an HVAC controller. In one example, the surge protection circuit may include a first voltage clamp, a second voltage clamp, a resistor, and an output port. The first voltage clamp may provide a first clamping voltage between a power input terminal and a common terminal. The second voltage clamp may provide a second clamping voltage that is less than the first clamping voltage. The resistor may be connected in series with the second voltage clamp, and the series connected resistor and second voltage clamp may be connected in parallel with the first voltage clamp. As such, a surge current at the power input terminal may be split between the first voltage clamp and the second voltage clamp. The amount of surge current that is provided to the second voltage clamp may be set by the value of the resistor.