Embodiments of the present disclosure describe selective metallization of an integrated circuit (IC) substrate. In one embodiment, an integrated circuit (IC) substrate may include a dielectric material and metal crystals having a polyhedral shape dispersed in the dielectric material and bonded with a ligand that is to ablate when exposed to laser light such that the metal crystals having the ablated ligand are activated to provide a catalyst for selective electroless deposition of a metal. Other embodiments may be described and/or claimed

Embodiments of the present disclosure are directed to a doped tin oxide. The doped tin oxide includes a tin oxide and at least one oxide of a doping element. The doping element includes at least one of vanadium and molybdenum. The doped tin oxide includes an amount of the tin oxide ranging from 90 mol % to 99 mol %, and an amount of the at least one oxide ranging from 1 mol % to 10 mol %.

A package structure including a substrate, a first lead frame, a first metal layer, at least one chip, a base and a second metal layer is provided. The base includes a plurality of openings. The first lead frame is embedded in the substrate and includes a plurality of first pads, where the openings expose the first pads. The first metal layer covers the exposed first pads. The chip is disposed on the substrate and electrically connected to the first metal layer and the first pads. The base covers the substrate with its bonding surface. The second metal layer covers a base surface of the base.

A package structure including a substrate, a first lead frame, a first metal layer, at least one chip, a base and a second metal layer is provided. The base includes a plurality of openings. The first lead frame is embedded in the substrate and includes a plurality of first pads, where the openings expose the first pads. The first metal layer covers the exposed first pads. The chip is disposed on the substrate and electrically connected to the first metal layer and the first pads. The base covers the substrate with its bonding surface. The second metal layer covers a base surface of the base.

Embodiments describe the selective electroless plating of dielectric layers. According to an embodiment, a dielectric layer is patterned to form one or more patterned surfaces. A seed layer is then selectively formed along the patterned surfaces of the dielectric layer. An electroless plating process is used to deposit metal only on the patterned surfaces of the dielectric layer. According to an embodiment, the dielectric layer is doped with an activator precursor. Laser assisted local activation is performed on the patterned surfaces of the dielectric layer in order to selectively form a seed layer only on the patterned surfaces of the dielectric layer by reducing the activator precursor to an oxidation state of zero. According to an additional embodiment, a seed layer is selectively formed on the patterned surfaces of the dielectric layer with a colloidal or ionic seeding solution.

A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material. A layer of catalytic adhesive coats walls within the hole. The patterned metal layer is placed over the catalytic adhesive within the hole.

A package structure includes a substrate, an insulator, a plurality of pads and a patterned circuit layer. The substrate includes a plurality of through holes. The insulator covers the substrate and is filled in the through hole. The conductive vias are located in the through holes and penetrate the insulator filled in the through holes. The pads are disposed on an upper surface and a lower surface of the insulator and electrically connected to the conductive vias. A bottom surface of each pad is lower than the top surface of the insulator. The patterned circuit layer is disposed on the top surface of the insulator and connected to the conductive vias and the pads. A bottom surface of the patterned circuit layer is lower than the top surface of the insulator.

A polymer product with a metal layer coated on the surface thereof is provided. The polymer product includes a polymer substrate and a metal layer formed on at least a part of a surface of the polymer substrate. The surface of the polymer substrate covered by the metal layer is formed by a polymer composition comprising a polymer and a doped tin oxide. A doping element of the doped tin oxide comprises niobium. The doped tin oxide has a coordinate L* value of about 70 to about 100, a coordinate a value of about 5 to about 5, and a coordinate b value of about 5 to about 5 in a CIELab color space.

Provided is a doped tin oxide that can be used as a chemical plating promoter in a method for selectively metallizing a surface of an insulating substrate. Also provided are a polymer composition that includes the doped tin oxide, a polymer molded body, an ink composition, and a method for selectively metallizing a surface of an insulating substrate. The doped tin oxide has a light color, and does not interfere with the color of the substrate while presetting thereof. The doped tin oxide has a strong ability of promoting chemical plating. Using the disclosed doped tin oxide as a chemical plating promoter, a continuous metal layer can be formed with a high plating speed, together with enhanced adhesivity between the metal layer and the insulating substrate.

This invention relates to products of aqueous and other chemical synthetic routes for encapsulation of a core material with an inorganic shell and finished compositions of a core-shell particulate material for application in thermoplastic, thermoset, and coatings resins prior to compounding or application or subsequent thermal processing steps. Disclosed is a composition of particles containing a shell of inorganic oxides or mixed-metal inorganic oxides and a core material of complex inorganic colored pigment, laser direct structuring additives, laser marking, or other beneficial metal oxides, metal compounds, or mixed-metal oxide materials, wherein the shell material is comprised of any single oxide or combination of oxides is taught. Preferred elements of composition for the shell are oxides and silicates of B, Ni, Zn, Al, Zr, Si, Sn, Bi, W, Mo, Cr, Mg, Mn, Ce, Ti, and Ba (or mixtures thereof). Applications may include, but are not limited to, coatings or plastic articles or materials for molded interconnect devices, durable goods, housings, assemblies, devices, and articles that are to be exposed to additional thermal processing. The resulting core-shell materials function in plastic and coatings formulations by minimizing or eliminating detrimental interactions with the resins and metal containing additives resulting in loss of mechanical properties.