Waveguide assemblies are described that utilize a surface-mount waveguide for vertical transitions of a printed circuit board (PCB). The surface-mount waveguide enables low transmission-loss (e.g., increased return-loss bandwidth) by utilizing a waveguide cavity positioned over a plated slot to efficiently transfer electromagnetic energy from one side of the PCB to another side. The waveguide cavity is designed to excite two resonant peaks of the EM energy to reduce a return-loss of power and increase power delivered to an antenna while supporting a high bandwidth of EM energy. Furthermore, the surface-mount waveguide does not require precise fabrication often required for vertical transitions, allowing the surface-mount waveguide to be compatible with low-cost PCB materials (e.g., hybrid PCB stack-ups).

Methods and apparatuses for vertically transitioning signals between substrate integrated waveguides within a multilayered printed circuit board (PCB) are disclosed. A first substrate integrated waveguide (SIW) is provided in a first layer of the PCB, the first SIW having a first terminal portion. A second SIW is provided in a second layer of the PCB, the second SIW having a second terminal portion that overlaps with the first terminal portion, wherein a first ground plane separates the first SIW and the second SIW. A vertical transition comprising an aperture in the first ground plane that is disposed in an area defined by the overlap of the first terminal portion and the second terminal portion, such that a signal propagated in the first SIW transitions to the second SIW in a different layer through the aperture.

A printed circuit board includes a coreless substrate including an insulating body and a plurality of core wiring layers disposed on or within the insulating body, a build-up insulating layer covering at least a portion of each of an upper surface and a lower surface of the coreless substrate, and a build-up wiring layer disposed on at least one of an upper surface and a lower surface of the build-up insulating layer. A through-opening penetrates through the insulating body and is configured to receive an electronic component therein, and the first build-up insulating layer extends into the through-opening to embed the electronic component.

An object of the present invention is to provide a conductive film that is excellent in flexibility while maintaining its sufficient transparency and conductivity, and a conductive film roll, an electronic paper, a touch panel, and a flat-panel display having the same.

A conductive film having a transparent substrate and a conductive part having a fine metal wire pattern disposed on one side or both sides of the transparent substrate, wherein the fine metal wire pattern is constituted by a fine metal wire, and the conductive film satisfies the following condition (i) or (ii): (i) the fine metal wire has voids, and when the cross-sectional area of the fine metal wire is defined as S.sub.M and the total cross-sectional area of the voids included in the cross-section of the fine metal wire is defined as S.sub.Vtotal on the cross-section of the fine metal wire perpendicular to the direction of drawing of the fine metal wire, S.sub.Vtotal/S.sub.M is 0.10 or more and 0.40 or less; and (ii) when the maximum thickness of the fine metal wire on the cross-section of the fine metal wire perpendicular to the direction of drawing of the fine metal wire is defined as T, the width of the fine metal wire at a height of 0.90T from the fine metal wire interface on the transparent substrate side is defined as W.sub.0.90 and the width of the fine metal wire on the fine metal wire interface on the transparent substrate side is defined as W.sub.0, W.sub.0.90/W.sub.0 is 0.40 or more and 0.90 or less.

A method of manufacturing a component carrier. The method includes forming a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and embedding a filament in the stack.

A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.

System, apparatuses and methods are disclosed which relate to the use of substrate integrated waveguide technology in front-end modules. An example circuit card assembly for use as a cellular base station front-end is disclosed which includes at least one component printed circuit board (PCB) layer having front-end module hardware components and at least one filter PCB layer including at least one substrate integrated waveguide (SIW) filter.

Methods and apparatuses for vertically transitioning signals between substrate integrated waveguides within a multilayered printed circuit board (PCB) are disclosed. A first substrate integrated waveguide (SIW) is provided in a first layer of the PCB, the first SIW having a first terminal portion. A second SIW is provided in a second layer of the PCB, the second SIW having a second terminal portion that overlaps with the first terminal portion, wherein a first ground plane separates the first SIW and the second SIW. A vertical transition comprising an aperture in the first ground plane that is disposed in an area defined by the overlap of the first terminal portion and the second terminal portion, such that a signal propagated in the first SIW transitions to the second SIW in a different layer through the aperture.

A printed circuit board (PCB) including a substrate integrated waveguide (SIW) formed using two ground planes representing the top and bottom walls of the waveguide, tightly pitched ground vias to act as two side walls and two back walls, and a pair of monopole antennas placed at each end of the SIW acting as signal feeding/receiving structures is disclosed. The waveguide dominant mode cut off frequency is determined by the spacing between the two side walls. Within each monopole antenna pair, the first monopole antenna operates at a first frequency while the second monopole antenna operates at another frequency. For each monopole antenna pair, the first monopole antenna and the second monopole antenna are located in the SIW at a distance from the back wall optimal for each operating frequency.

A component carrier which includes a stack having at least one electrically conductive layer structure, at least one electrically insulating layer structure, and a recess being at least partially formed in the stack, optionally having an electrically conductive coating, and being configured as waveguide, wherein a plurality of edges delimiting the recess are formed by electrically conductive material of the at least one electrically conductive layer structure and/or of the optional electrically conductive coating.