A wiring board includes an insulating substrate, at least one external electrode disposed on a first surface of the insulating substrate, and wiring that is disposed in the insulating substrate and that is electrically connected to the at least one external electrode. The wiring includes a portion where an extension direction of the wiring is inclined relative to the first surface of the insulating substrate.

An apparatus includes a transmitter circuit configured to provide a transmitted waveform at a transmitter output, and a first microstrip differential trace extending from a first microstrip differential trace first end to a first microstrip differential trace second end. A first resistor has a first resistor first end coupled to the transmitter output and a first resistor second end coupled to the first microstrip differential trace first end. A second microstrip differential trace extends from a second microstrip differential trace first end to a second microstrip differential trace second end. A second resistor has a second resistor first end coupled to the transmitter output and a second resistor second end coupled to the second microstrip differential trace first end. A first receiver circuit has a first receiver circuit input coupled to the first microstrip differential trace second end, the first receiver configured to provide a first received signal. A second receiver circuit has a second receiver circuit input coupled to the second microstrip differential trace second end, the second receiver configured to provide a second received signal. A processor may receive the first received signal and the second received signal and perform digital signal processing on the first received signal and the second received signal, detect a coolant leak, and provide an alert upon detection of the coolant leak.

A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

In one or more embodiments, a circuit board may include a trace pair and a serpentine region of the trace pair, which may include: a first subregion in which the first trace includes a first portion that has a third width and a first length and in which the second trace includes a second portion, at least substantially parallel to the first portion, that has a fourth width, greater than the second width, and a second length; and a second subregion, adjacent to the first subregion, in which the first trace includes a third portion that has the third width and a third length and in which the second trace includes a third portion that has the fourth width and a third length, different from the second length.

A circuit substrate includes an insulating body, a wiring enclosed by the insulating body, a conductive layer formed within the insulating body on a same plane as the wiring, and electrically insulated from the wiring by the insulating body, and one or more conductive vias extending through an edge portion of the conductive layer in a thickness direction intersecting the plane. A first width of the insulating body between the wiring and the conductive layer at a first position in the plane direction that does not correspond to any of said one or more conductive vias is smaller than a second width of the insulating body between the wiring and the conductive layer at a second position in the plane direction that corresponds to one of said one or more conductive vias.

A flexible substrate includes a plurality of unit wiring structures. Each of the unit wiring structures includes: a central section; and at least four curved strips disposed at an outer side of the central section, each of the curved strips having a first end connected to the central section. The central section includes: an insulation layer; interlayer connection via that passes through the insulation layer; first wiring section connected to the interlayer connection via; and second wiring section electrically connected to the first wiring section by way of the interlayer connection via. The first wiring section, insulation layer and second wiring section are disposed in this order, and two of the at least four curved strips extending in a first direction are connected to the first wiring section, other two of the at least four curved strips extending in a second direction are connected to the second wiring section.

Method for providing an electrical connection, comprising connecting a first cable to a first conducting structure on a printed circuit board, connecting a second cable to a second conducting structure on the printed circuit board, comparing a propagation delay of a first signal path comprising the first cable and the first conducting structure on the printed circuit board, and a propagation delay of a second signal path comprising the second cable and the second conducting structure on the printed circuit board; and removing conductive material of the first conducting structure and/or of the second conducting structure, in order to modify an electrical length of the first conducting structure and/or of the second conducting structure, to obtain a first conducting path and a second conducting path, in dependence on a result of the comparison, in order to reduce a difference of the propagation delays between the first signal path and the second signal path.

A flexible substrate includes unit wiring structures including first and second unit wiring structures that are mutually adjacent. Each of the unit wiring structures includes a central section and one or more strips. Each of the one or more strips has first and second ends. The first end is connected to the central section. The second end of at least one of the one or more strips of the first unit wiring structure and the second end of at least one of the one or more strips of the second unit wiring structure are mutually connected. The flexible substrate includes a gap between a side surface of the mutually connected strips and a side surface of the central section of the first or the second unit wiring structure, and/or between a side surface of the mutually connected strips and a side surface of another strip.

A liquid crystal apparatus includes a first wiring substrate on which a first driving IC is mounted, a second wiring substrate disposed to overlap the first wiring substrate, a first terminal group electrically connected to the first wiring substrate and including a terminal electrically connected to the first driving IC, a second terminal group electrically connected to the second wiring substrate and including another terminal electrically connected to the terminal, and a monitoring pad provided on the second wiring substrate and electrically connected to the other terminal.

A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.