In one embodiment, an apparatus generally comprises a power delivery board for integration with a printed circuit board, the power delivery board comprising a power plane for delivering power from a voltage regulator module to an application specific integrated circuit (ASIC) mounted on a first side of the printed circuit board. The power plane in the power delivery board interconnects with power vias in the power delivery board for vertical alignment with the ASIC through power vias in the printed circuit board to electrically couple the voltage regulator module and the ASIC when the power delivery board is mounted on a second side of the printed circuit board.

In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.

The present invention relates to a single board computer system with an improved memory and layout. The unique layout of the printed circuit board of the present invention allows for different parts to be placed in a back-to-back configuration to minimize the dimensions of the printed circuit board. This includes a high-performance radiation-hardened reconfigurable FPGA, for processing computation-intensive space systems, disposed on both sides of the printed circuit board. Four dual double data rate synchronous dynamic random-access memories (DDR2 SDRAMs) disposed on both the top side and on the bottom side of the printed circuit board reduce an operating voltage of said printed circuit board. A layout stack-up of the printed circuit board includes twenty-two symmetrical layers including ten ground layers, four power layers, six signal layers, a top layer, and a bottom layer.

A battery module may include a housing, a plurality of battery cells disposed in the housing, a battery terminal extending from the battery module for coupling the battery module with electrical components in the vehicle, and a contactor. A voltage supplied to a relay coil in the contactor may generate a magnetic field to actuate a contactor switch. The battery module may also include a printed circuit board (PCB) disposed in the housing. The PCB may include a relay control circuit configured to control a current flowing across the relay coil, and the relay control circuit may operate in a pull-in mode to transition the contactor switch into a closed position and in a hold mode to maintain the contactor switch in the closed position.

An embodiment provides a printed circuit board and an electronic component package including the same, the printed circuit board comprising: a data line layer; a ground layer disposed on the data line layer; a power line layer disposed on the ground layer; and insulation layers disposed between the data line layer and the ground layer and between the ground layer and the power line layer, respectively, wherein the ground layer comprises a common ground and a chassis ground electrically insulated from the common ground.

Disclosed are a method and a structure for layout and routing of a PCB. The method includes: arranging signal lines, a power plane and a ground plane of the PCB in combination, where a portion of a reference plane for the signal lines is configured as a ground plane for providing a reference plane and return paths for the signal lines, to save routing spates. Layout of regions for the power supply, the ground and signal lines is appropriately designed, thereby improving the design density of a board, reducing the number of layers of the PCB, and saving cost.

The present subject matter relates to a battery module for use in a vehicle. The battery module may include a housing, a plurality of battery cells disposed within the housing, and solid state pre-charge control circuitry that pre-charges a direct current (DC) bus that may be coupled between the battery module and an electronic component of the vehicle. Furthermore, the solid state pre-charge control circuitry may include solid state electronic components as well as passive electronic components.

A battery module may include a housing, a plurality of battery cells disposed in the housing, a battery terminal extending from the battery module for coupling the battery module with electrical components in the vehicle, and a contactor. A voltage supplied to a relay coil in the contactor may generate a magnetic field to actuate a contactor switch. The battery module may also include a printed circuit board (PCB) disposed in the housing. The PCB may include a relay control circuit configured to control a current flowing across the relay coil, and the relay control circuit may operate in a pull-in mode to transition the contactor switch into a closed position and in a hold mode to maintain the contactor switch in the closed position.

A battery module includes a housing and battery cells disposed in the housing, each of the battery cells including two terminals. The battery module also includes bus bar cell interconnects including a first material, where each bus bar cell interconnect is configured to electrically couple two adjacent battery cells via an electrical coupling with a first terminal of one of the adjacent battery cells and a second terminal of the other adjacent battery cell, where at least one of the first and second terminals includes the first material. The battery module includes welds, each weld being disposed at a corresponding welding point to directly couple one of the bus bar cell interconnects with the corresponding at least one terminal including the first material. Each welding point is accessible for welding from a position above the battery cells when the interconnects are disposed over the battery cells.

Systems, apparatus, methods for manufacturing and techniques for interconnecting integrated circuit devices are disclosed. A flexible printed circuit (FPC) provides EMI shielding with reduced insertion loss. The FPC includes a first signal layer fabricated from a planar conductive material and having traces configured to carry signals between a circuit boards. The FPC may include a first non-conductive layer disposed in a plane above the first signal layer, a second non-conductive layer disposed in a plane below the first signal layer, a first copper ground plane disposed in a plane above the first non-conductive layer, a second copper ground plane disposed in a plane below the second non-conductive layer, and a second signal layer provided in a plane above the first copper ground plane or below the second copper ground plane. Signals carried in the first signal layer may have a higher frequency than signals carried in the second signal layer.