A printed circuit board according to various embodiments of the present disclosure can include a first substrate layer, a dielectric layer stacked below the first substrate layer, and a second substrate layer stacked below the dielectric layer. The second substrate layer can include: a power line; a ground part disposed to have an isolated area along the power line; and a ground line which extends from the ground part so as to be disposed in the isolated area, and which separates the isolated area into a first area and a second area so as to generate electromagnetic waves for canceling the electromagnetic waves generated by a current flowing through the power line. Other embodiments are also possible.

An electronic assembly is provided, including a wiring board, a control element, and a pair of first internal electrical connectors. The wiring board includes a mounting surface, an outer patterned conductive layer, a plurality of inner patterned conductive layers, a plurality of near conductive holes, a plurality of far conductive holes, and a first conductive path. The outer patterned conductive layer is located between the mounting surface and the inner patterned conductive layers. The control element is mounted on the mounting surface of the wiring board. The pair of first internal electrical connectors are mounted on the mounting surface of the wiring board, and are adapted for mounting a pair of memory modules. The first conductive path extends from the control element through the corresponding near conductive hole to the corresponding inner patterned conductive layer, and through the corresponding far conductive hole and the outer patterned conductive layer to the pair of first internal electrical connectors.

Provided are a circuit board component and a terminal. The circuit board component includes: a circuit board and a wire disposed on the circuit board, where the wire includes a first portion and a second portion, a line width of the first portion is greater than or equal to a line width threshold, and a line width of the second portion is less than the line width threshold.

Certain aspects of the present disclosure relate to methods and apparatus for allocating resources for the transmission of scheduling requests based on UE traffic profiles. In one embodiment, a base station determines, for one or more user equipments (UEs), a type of traffic to be exchanged between the one or more UEs and the base station. The base station allocates resources for the one or more UEs to use for sending a scheduling request based, at least in part, on the type of traffic associated with each of the one or more UEs. The base station signals an indication of the allocated resources to each of the one or more UEs.

A method for forming a circuit pattern on an integrated substrate structure includes providing an insulating surface which includes a pattern forming portion. An activation ink is deposited only on the pattern forming portion to form a non-conductive isolation layer. A first metal layer is formed on the non-conductive isolation layer by electroless plating. A patterned portion of the first metal layer is isolated from a remaining portion of the first metal layer to form the circuit pattern. A non-conductive masking layer is applied on the first metal layer. A second metal layer is formed on the non-conductive masking layer. A surface mount land pattern and pad configuration is determined. A solder mask layer is applied to the patterned portion. A protective layer is applied to protect pad areas not covered by the solder mask layer. An electrical component may then be mounted to the pad(s).

The subject matter presented herein relates to a method for producing a backplane for electro-optic displays. The method may include providing a substrate coated with a first conductive material on a first side and a second conductive material on a second side, the second side being positioned opposite from the first side, patterning the first conductive material by cutting through the first conductive material, wherein the patterning of the first conductive material creates electrical isolated conductive segments to be controlled by a driver circuit and creating a plurality of vias on the substrate, the plurality of vias extending through the substrate and providing electrical conductivity between the first and second sides. The method may further include creating a plurality of conductive traces on the second side of the substrate by patterning the second conductive material by locally align the vias to the driver circuit.

Disclosed herein is a pattern safety device for preventing interference between patterns. In detail, a separately partitioned space is defined in an adhesion portion, which is formed on a plurality of patterns on the surface of a substrate so that a circuit element is placed on the adhesion portion, thus preventing interference between the patterns.

A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.

A printed wiring board includes one or more substrates, the one or more substrates including at least a first substrate, the first substrate being formed with a pad and a ground layer at any one of main surfaces of the first substrate, the pad being to be electrically connected to a connector as another component, the ground layer being formed to surround the pad from a circumference of the pad and have an inner edge at a location separated from an outer edge of the pad with a predetermined distance, the ground layer being to be grounded to a ground contact.

A collective lamination substrate N is provided with pattern layers having N number of layers, where N is an integer and 4 or more, a pseudo waveguide formed penetrating through the pattern layers in a lamination direction, a converter section formed in the pattern layers, mutually converting between an electrical signal and radio waves being transmitted and received via the pseudo waveguide, and ground patterns formed in the pattern layers, covering a periphery of a waveguide formation section. The collective lamination substrate further includes: antennas formed in the waveguide formation section; a first via group provided in a periphery of the waveguide formation section; and a second via group provided in a periphery of the waveguide formation section and positioned at a more outer portion than the first via group.