Patent classifications
H05K2201/094
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
A flexible printed circuit board includes a base film having an insulating property and a plurality of interconnects laminated to at least one surface side of the base film. The plurality of interconnects includes a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect being greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50. The first interconnect includes a first conductive underlayer and a first plating layer, and the second interconnect includes a second conductive underlayer, a second plating layer, and a third plating layer.
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF
Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.
Display device and connection circuit board
A display device includes a display panel including an edge extending along a first direction, a main circuit board adjacent to the edge of the display panel, and a connection circuit board which connects the main circuit board to the display panel at the edge thereof. The connection circuit board includes a plurality of board side pads which are arranged along the first direction and at which the connection circuit board is connected to the main circuit board. Each of the plurality of board side pads includes a first pad, and a second pad adjacent to the first pad along the first direction. The second pad includes a plurality of signal pads which are arranged along a second direction which crosses the first direction and are each aligned with the first pad along the first direction.
Component Carrier with Stack-Stack Connection for Connecting Components
A component carrier includes a stack with at least one electrically insulating layer structure and electrically conductive layer structures some of which have a first density of trace structures and a second density of connection structures, and a further stack with at least one further electrically insulating layer structure and further electrically conductive layer structures some of which have a third density of further trace structures and a fourth density of further connection structures. A first component is applied to the stack and a second component is embedded in the further stack. The connection structures are respectively connected to the further connection structures. The first density of trace structures is lower than the third density of further trace structures. The stack and the further stack are connected with each other by the connection structures and by the further connection structures. The first component is connected to the second component.
Driving chip including bonding pads in non-display area and display panel
A driving chip and a display panel are provided. The display panel includes the driving chip, and a plurality of first bonding pads and a plurality of second bonding pads disposed at two opposite sides of the driving chip. The driving chip includes a group of first input leads and a group of second input leads. There is an interval between the group of first input leads and the group of second input leads. The group of first input leads is disposed near the first bonding pads, and the group of second input leads is disposed near the second bonding pads.
Sensor unit, vehicle positioning device, and vehicle
A sensor unit includes a circuit board including, on a first surface, a plurality of electrode pads to which a plurality of mounting terminals of an inertial sensor are respectively attached via connecting members. The first surface of the circuit board includes an insulating layer provided on the outer side of the plurality of electrode pads in a plan view, includes, in a portion overlapping a center region further on the inner side than the mounting terminals of the inertial sensor in the plan view, a first region where the insulating layer is not provided, and includes, from the first region to the outer side of the inertial sensor in the plan view, a second region where the insulating layer is not provided.
ELECTRONIC APPARATUS AND INSPECTION METHOD
An electronic apparatus includes: an electronic module; and a flexible substrate electrically connected to the electronic module. The flexible substrate includes: a base film; a plurality of first contact pads arranged at one end on the base film in a first direction, and electrically connected to the electronic module; a plurality of second contact pads arranged at an other end on the base film in the first direction; a plurality of first wires arranged on the base film, and each electrically connecting one of the first contact pads and one of the second contact pads together, and a plurality of third contact pads arranged on the base film, each of the third contact pads being positioned along the first direction between one of the first contact pads and one of the second contact pads, and being electrically connected to one of the first wires.
DISPLAY PANEL AND DISPLAY DEVICE
The present disclosure provides a display panel and a display device including the same, in which heights of at least some of metal terminals in a flexible circuit board bonding pad increase in a direction away from a driving chip. Therefore, more space is reserved for connecting traces between the metal terminals and the driving chip, thereby avoiding occurrence of a display abnormality caused by short-circuiting between the connecting traces due to limitation of space for setting the connecting traces and avoiding the metal terminals being too close to a fan-out trace area in order to reduce impedance.
DISPLAY DEVICE
A display device includes a display panel including first and second signal pads respectively disposed at one side and the other side of a center axis extending in a first direction and first and second fixing pads spaced apart from each other with the first and second signal pads interposed therebetween, and a flexible film including connection pads overlapping the signal pads and first and second alignment pads groups spaced apart from each other with the connection pads interposed therebetween. The first alignment pad group includes n first alignment pads arranged in the first direction, the second alignment pad group includes n second alignment pads corresponding to the first alignment pads, and a distance between corresponding first and second alignment pads decreases as a distance thereof from a display area decreases.
Edge Connector, Circuit Board, and Connector Component
An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.