A printed circuit board comprises a board main body, a sensor, an external connection pad, and a hollow-structured electrical conductor. The board main body has a top face and a bottom face opposite the top face. The sensor is mounted on one of the top face and the bottom face of the board main body. The external connection pad is provided on the top face or the bottom face of the board main body opposite the sensor. The hollow-structured electrical conductor extends through the board main body and electrically connects the sensor to the external connection pad.

A substrate is provided. The substrate includes a bottom plate and at least one bonding portion disposed on the bottom plate, where each bonding portion takes a shape that is a part of an Archimedean spiral. An electronic device, a bonding structure, and a bonding method for the bonding structure are further provided.

Systems and methods are provided for reducing crosstalk between differential signals in a printed circuit board (PCB) using fine pitch vias. A pair of contact pads are on the top surface of the PCB and configured to couple a PCB component to the PCB, the contacts a first distance from each other. A first via of a plurality of vias is electrically coupled to a first contact of the pair of contacts and a second via is electrically coupled to a second contact, the first via and second via a second distance from each other, the second distance being less than current standards for minimum via pitch. Each via comprises a via pad on the top surface and a plated through-hole extending from the top surface to a termination point. A separator gap is between the first via and the second via.

The present application provides a flexible display panel including a flexible substrate and a flexible circuit board electrically connected to the flexible substrate. Pins on the flexible substrate and the flexible circuit board are disposed to be inclined at a certain angle. When pitches of the pins on the flexible circuit board are changed due to expansion and contraction of the flexible circuit board itself, an accurate alignment of the pins on the flexible substrate and the flexible circuit board can be realized by adjusting the position of the flexible circuit board relative to the flexible substrate before connecting the flexible circuit board to the flexible substrate, thereby ensuring the quality of the flexible display panel and improving product yield of the display panel.

An assembly for connecting controlled-impedance cables to a PCB using a crescent-shaped connector that can be located much closer to the unit under test than those of the prior art. On the PCB, equal-length signal traces run from UUT contacts to signal pads that form an arc. All signal pads are surrounded by a ground land. The connector has an anchor block for permanently or removably securing the cables. The connector uses skewed coil contacts held within an electrically conductive plate. The signal contacts are captured in signal through apertures within insulating plugs in the plate. The ground contacts are captured in a ground through apertures. Each signal contact is electrically connected to a cable signal conductor and the ground contacts are electrically connected to the anchor block or ferrule. The connector is shaped so that the signal contacts trace an arc, so that they align with the signal pads.

An electric device includes a semiconductor assembly, a circuit board, first conductive pads and second conductive pads. The circuit board has a chip-mounted area with a rectangular shape. The first conductive pads are arranged in a center zone or all corner zones of the chip-mounted area, and the second conductive pads are arranged within the rest in the chip-mounted area. The first conductive pads are respectively soldered to one part of solder joints of the semiconductor assembly through first solder-ball portions, and the second conductive pads are respectively soldered to another part of the solder joints of the semiconductor assembly through second solder-ball portions. Each of the second conductive pads is sized smaller than one of the first conductive pads, and a maximum width of each of the second solder-ball portions is greater than a maximum width of each of the first solder-ball portions.

An electrical connector element, for use on a printed circuit board assembly, includes a soldering pad having a longitudinal length and a cross-sectional width. The soldering pad is configured to be electrically-coupleable to a PCB device conductor. At least one impedance inducing feature is positioned along the longitudinal length of the soldering pad.

A multi-gear brightness adjustment circuit board, and a multi-gear battery holder structure, which through adding the automatic control gear AUTO conductive contact piece and a light spot dot-circle pattern composite conductive contact piece on the circuit board, the gear can be automatically adjusted when the solar cell is used for power supply. Ensuring that the output light power meets the needs of ambient light, rationally use electric energy, which is conducive to energy saving; at the same time, the mode switching of the shooting target is integrated, which reduces the parts of the sight and makes the sight more compact.

A flat panel display is provided. A first metal joining surface on a display panel includes a first transverse part and a first longitudinal part, and the area occupied by the first transverse part along a transverse direction is larger than the area occupied by the first longitudinal part along the transverse direction. A second metal joining surface on a flexible wiring substrate includes a second transverse part and a second longitudinal part, and the area occupied by the second transverse part along the transverse direction is larger than the area occupied by the second longitudinal part along the transverse direction. The above design can increase the contact area between the first metal joining surface and the second metal joining surface after the expanding offset between the display panel and the flexible wiring substrate occurring in a thermal joining process, to guarantee electrical signals transmitting normally and improve displaying effect.

A display panel, a flexible circuit board and a display device are provided. The display panel includes a substrate, and at least one row of a plurality of input pads including at least one first-input pad disposed in the middle of the input pads and a plurality of second-input pads disposed on both sides of the first input pad. Each input pad includes a first end and a second end that are oppositely disposed, and a spacing between any adjacent two input pads includes a first spacing between adjacent two first ends and a second spacing between adjacent two second ends. The first spacing and the second spacing between any adjacent two second-input pads are not equal. Along a direction from the first-input pad to the second-input pad, starting from adjacent first-input and second-input pads, the first spacing and the second spacing successively and gradually increases, respectively.