A printed wiring board includes a base material, a plurality of electrode pads to which an electronic component is soldered, the electrode pads being formed on a surface of the base material, a molten-solder introducing protrusion formed on the surface of the base material and connected to each of the electrode pads to draw molten solder into the electrode pad during soldering, and a molten-solder separating protrusion formed on the surface of the base material and connected to each of the electrode pads to help separation of molten solder from the electrode pad at a moment of separation of molten solder, wherein the molten-solder introducing protrusion, the electrode pad, and the molten-solder separating protrusion are aligned in line.

An electronic device and an electromagnetic shielding frame are provided. The electromagnetic shielding frame includes a ring-shaped portion and a plurality of soldering tabs that extend from the ring-shaped portion along a protruding direction. The soldering tabs are spaced apart from each other and are in a ring-shaped arrangement. At least one of the soldering tabs has a patterned slot layout so as to be defined as a patterned tab. A portion of the patterned slot layout of the patterned tab arranged away from the ring-shaped portion has a layout distance. The patterned slot layout is arranged along a first direction and a second direction. The first direction and the protruding direction have a first angle therebetween that is smaller than 90 degrees, and the second direction and the protruding direction have a second angle therebetween that is smaller than 90 degrees.

An inverter with a modular bus assembly is described. In various embodiments, the modular bus assembly includes a laminated motherboard and a plurality of capacitor daughtercards. The laminated motherboard can be configured to interface a plurality of phase-leg modules and a plurality of capacitor daughtercards through a plurality of terminals and connectors located on a bottom side or a top side of the laminated motherboard. The laminated motherboard includes a layer stack with a plurality of conductor layers. Each of the plurality of conductor layers is implemented with a net spacing from a neighboring plated through hole (PTH) based at least in part on differences in potential to be applied to each of the plurality of conductor layers as compared to a potential to be applied to the PTH. Embedded shield polygons can be implemented on the laminated motherboard to mitigate surface discharge at surface terminal (PTH/SMT) triple junctions.

An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.

A design method and a packaging method for a PCB board to avoid patch element tombstone, and a PCB board are provided. The method includes: providing at least one patch element placement area on a PCB board, providing pads in each patch element placement area, where each pad group includes two pads, and the two pads are arranged side by side; establishing pad limit areas around the pads; and reflow soldering the patch element to the PCB board. With the above method, the tombstone phenomenon of the patch element can be effectively prevented, the design efficiency is improved, the workload of manual operation of the engineer is reduced, and an error rate is reduced.

A flexible substrate, a method of processing a flexible substrate and a system of processing a flexible substrate. The method of processing the flexible substrate includes: measuring a first expansion volume of the flexible substrate; and applying a first application pressure to the flexible substrate to laminate the flexible substrate on a base substrate; according to a first corresponding relationship between a first pressure applied to the flexible substrate and a compressive expansion volume generated by the flexible substrate in compression and according to the first expansion volume, the first application pressure is selected to allow a second expansion volume of the flexible substrate to at least partially compensate for the first expansion volume.

A display device is provided and includes a display panel including a display area that displays an image and a pad area disposed at least at a side of the display area, and a flexible circuit film electrically connected to the pad area. The flexible circuit film includes connection pads, a first measurement pad, and a second measurement pad. The connection pads are arrayed in a first direction and inclined with respect to a reference line extending in a second direction different from the first direction, the first measurement pad is disposed adjacent to a first side of the connection pads, and the second measurement pad is disposed adjacent to a second side of the connection pads. The connection pads are between the first measurement pad and the second measurement pad.

The present disclosure provides a display device. The display device includes a display panel and a bonding object; wherein the display panel is provided with a first bonding pad unit and a plurality of second bonding pad units respectively arranged on two sides of the first bonding pad unit, wherein a height of the first bonding pad unit in a second direction is identical to a height of the second bonding pad unit in the second direction; and the bonding object includes a third bonding pad unit corresponding to the first bonding pad unit, and fourth bonding pad units corresponding to the second bonding pad units, wherein a height of the fourth bonding pad unit in the second direction is less than a height of the third bonding pad unit in the second direction.