A printed circuit board capable of reducing or suppressing connection failure includes a base film made of insulating material, an electric conductor pattern formed on a front surface of the base film, and an insulating cover film covering the electric conductor pattern. The printed circuit board also includes a circuit portion with a circuit formed by the electric conductor pattern, and a pad portion with a bonding pad composed of the electric conductor pattern exposed from the insulating cover film. The pad portion has higher rigidity than the circuit portion.

An interconnect is provided that can comprise a recess formed in a body where the recess comprises an axial end wall and a side wall extending from the axial end wall. The interconnect can also comprise a distributed metallized layer disposed on the axial end wall and the side wall and a conductive compliant (CC) plug disposed within the recess to interface with the metallized layer. The CC plug can be configured to establish an electrical connection between a conductive pad disposed on the recess and a male conductive element inserted into the recess via the metallized layer.

A card-type solid state drive (SSD) including: a substrate that has a first surface and a second surface facing each other; a memory controller and a nonvolatile memory device that are on the first surface; a plurality of functional terminals on the second surface; and a plurality of thermal terminals on the second surface, wherein the functional terminals include first-row functional terminals, second-row functional terminals, and third-row functional terminals, wherein at least one of the first-row functional terminals, at least one of the second-row functional terminals, and at least one of the third-row functional terminals are electrically connected to the memory controller or the nonvolatile memory device, and wherein the thermal terminals are not electrically connected to the memory controller or the nonvolatile memory device.

A load adaptive device includes a substrate, a first electrode, a second electrode, and a passive element. The substrate is configured with a first conductor and a second conductor, and the surface area of the first conductor and/or the surface area of the second conductor are at least 15 mm.sup.2. The distance between the center of the first conductor and the center of the second conductor is at least 9 mm. The first electrode, the second electrode and the passive element are disposed on the substrate. The first electrode is electrically connected to the first conductor. Two terminals of the passive element are electrically connected to the second conductor and the second electrode, respectively. In addition, a hand-made circuit module includes the load adaptive device and a hand-made loop. A part of the hand-made loop is consisted of a hand-bonded conductive tape.

A connector includes a rectangular flat-plate housing including a first positioning hole and a second positioning hole, and a contact row and a contact row held on the housing. The housing includes a first pitch side surface and a second pitch side surface on an opposite side of the first pitch side surface. The contact row and the contact row extend from the first pitch side surface to the second pitch side surface. The first positioning hole is disposed between the first pitch side surface and the contact row, and the second positioning hole is disposed between the first pitch side surface and the contact row.

An electrical connector assembly includes a housing and a circuit board. The housing includes opposing top and bottom walls and opposing first and second sidewalls connecting the top and bottom walls. The circuit board is at least partially disposed in the housing. The circuit board includes an upper surface and an opposing lower surface. The circuit board further includes a plurality of conductive rear pads disposed on the upper and lower surfaces. A separation between the rear pads disposed on the upper surface and the top wall of the housing is greater than a separation between the rear pads disposed on the lower surface and the bottom wall of the housing. Opposing first and second sidewall extensions extend upwardly from the opposing respective first and second sidewalls of the housing and define an open top channel therebetween that extends uninterrupted between the opposing first and second sidewall extensions.

A method for controlling a target switch assembly in a chain of switch assemblies includes distributing the chain of switch assemblies in a wellbore; placing a controller at a head of the wellbore; making a first decision, at the controller, to actuate a corresponding detonator of the target switch assembly; transmitting, from the controller to the target switch assembly, a fire command to activate the corresponding detonator; and making a second decision, locally, at the target switch assembly, to activate the detonator, after the fire command from the controller is received.

Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.

A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate. The chip is mounted on the chip mounting area, a space exists between a first bump and a second bump of the chip, and there are no additional bumps between the first and second bumps. A first inner lead, a second inner lead, a first dummy lead and a second dummy lead of the circuit layer are located on the chip mounting area. The first and second inner leads are electrically connected to the first and second bumps respectively. The first dummy lead is connected to the first inner lead and adjacent to the first bump, and the second dummy lead is connected to the second inner lead and adjacent to the second bump.

Provided are a stretchable electronic device and a method for manufacturing the same. The stretchable electronic device includes lines having lower pads, a chip provided on the lower pads and having first upper pads, which are wider than the lower pads, and an adhesive layer provided outside the lower pads or between the lower pads and bonded to the first upper pads.