The present invention provides a printed circuit board comprising: a dielectric layer (130); N pairs of differential signal vias (2) which penetrate through the dielectric layer wherein N is an integer more than one; N pairs of first strip conductors (101,102) disposed on a first surface of the dielectric layer; a first ground conductor layer (103) disposed in the dielectric layer forming N first differential transmission lines (100) with the N pairs of first strip conductors and the dielectric layer; N pairs of second strip conductors (111,112) disposed on a second surface of the dielectric layer; a second ground conductor layer (113) disposed in the dielectric layer forming N of second differential transmission lines (110) with the N pairs of second strip conductors and the dielectric layer.

A printed wiring board according to an embodiment includes a wiring board body, a first connection part and a second connection part. In the first connection part, a heat-receiving front surface is a first land formed on a front surface of the wiring board body. A heat-receiving back surface is formed on a back surface of the wiring board body. A main-heat conducting part is a through-hole that inter-connects the heat-receiving front surface and the heat-receiving back surface. In the second connection part, a second land is formed on the front surface of the wiring board body. The second land is not connected to any conductor pattern formed on the back surface of the wiring board body.

A wiring board includes: a wiring-board body including a first surface and a second surface opposite to the first surface, and including at least one insulator layer; pads formed at at least one of an internal layer boundary plane and the first surface and the second surface defining a first plane; and via conductors connected to corresponding ones of the pads, and arranged in parallel to extend in a thickness direction of the wiring-board body. Each of first and second ones of the pads adjacent to each other in planar view at the first plane is connected to corresponding ones of the via conductors. The via conductors corresponding to the first pad are arranged differently from the via conductors corresponding to the second pad, in planar view.

The present invention provides a high speed signal fan-out method for BGA and a PCB using the same. The method comprises: providing a printed circuit board (PCB), providing a plurality of vias and signal traces of the vias on the PCB; and providing back-drilled holes for routing of other signal traces at positions corresponding to the vias. The vias are arranged into a plurality of straight lines from an edge to the center of the PCB. The plurality of straight lines each is horizontal or vertical. The signal traces of the vias in a straight line are arranged from high to low or from low to high with respect to routing positions of the vias, and the back-drilled holes of the plurality of vias are arranged in descending or ascending order corresponding to the depths of the back-drilled holes.

Systems and methods are provided for reducing crosstalk between differential signals in a printed circuit board (PCB) using fine pitch vias. A pair of contact pads are on the top surface of the PCB and configured to couple a PCB component to the PCB, the contacts a first distance from each other. A first via of a plurality of vias is electrically coupled to a first contact of the pair of contacts and a second via is electrically coupled to a second contact, the first via and second via a second distance from each other, the second distance being less than current standards for minimum via pitch. Each via comprises a via pad on the top surface and a plated through-hole extending from the top surface to a termination point. A separator gap is between the first via and the second via.

The present invention solves the problem that propagation of electromagnetic noise in a predetermined frequency band cannot be suppressed when an existing EBG structure is applied in a multilayer substrate. The structure of the present invention is provided with: a first power plane; a first GND plane faces the first power plane; a second GND plane faces the first power plane or the first GND plane; a first planar conductor facing the first GND plane and/or the second GND plane; a first conductor via for connecting the first planar conductor and the first power plane, the first conductor via being insulated from the first GND plane and the second GND plane; and a second conductor via for connecting the first GND plane and the second GND plane, the second conductor via being insulated from the first power plane and the first planar conductor.

A method of forming an multi-chip carrier that includes providing a trace structure using an additive forming method. The method includes forming a metal layer on a trace structure to provide electrically conductive lines. A dielectric material may then be formed on the electrically conductive lines to encapsulate a majority of the electrically conductive lines. The ends of the electrically conductive lines that are exposed through the upper surface of the dielectric material provide a top processor mount location and the ends of the electrically conductive lines that are exposed through the sidewalls of the dielectric material provide a sidewall processor mount location.

An interposer-type component carrier includes a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; a cavity formed in an upper portion of the stack; an active component embedded in the cavity and having at least one terminal facing upwards; and a redistribution structure having only one electrically insulating layer structure above the component. A method of manufacturing an interposer-type component carrier is also disclosed.

An interposer and method of providing spatial and arrangement transformation are described. An electronic system has an electronic package, a motherboard and an interposer between the package and the motherboard. The interposer has signal and ground contacts on opposing surfaces that are respectively connected. The contacts opposing the package has a higher signal to ground contact ratio than the contacts opposing the motherboard, as well as different arrangements. Ground shielding vias in the interposer, which are connected to a ground plane, electrically isolate the signals through the interposer. The package may be mounted on a shielded socket such that signal and ground pins are mounted respectively in signal and ground socket mountings, ground shielding vias are between the signal socket mountings, and the ground socket mountings contain plated socket housings.

A method is provided for forming a printed circuit board (PCB) assembly. The method may include drilling a first plurality of vias having a first diameter in a PCB and filling the first plurality of vias to form a first plurality of plated or filled vias. The method may also include drilling a second plurality of vias having a second diameter in the PCB, and filling the second plurality of vias to form a second plurality of plated or filled vias. The first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.